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Dean J Mazza, 38Waterbury, CT

Dean Mazza Phones & Addresses

Waterbury, CT   

Southington, CT   

Lauderhill, FL   

62 Victoria St, Springfield, MA 01104   

Pompano Beach, FL   

Chicopee, MA   

Social networks

Dean J Mazza

Linkedin

Work

Company: Dq grill and chill Jul 2015 Position: Operations manager

Education

School / High School: Boces Drafting School 1979 to 1979

Skills

Electronics • Project Management • Product Development • Management • Manufacturing • Semiconductors • Engineering • Pcb Design • Integration • Schematic Capture • Orcad • Networking

Industries

Food Production

Mentions for Dean J Mazza

Resumes and CV

Resumes

Dean Mazza Photo 1

Operations Manager

Location:
66 Prospect St, Winsted, CT 06098
Industry:
Food Production
Work:
Dq Grill and Chill
Operations Manager
Holiday Retirement
Co-Manager Village Gate Community
Uconn Torrington Campus Sep 2012 - May 2013
Head Chef
Wli 2001 - May 2010
Quality Control Supervisor
Wentworth Laboratories Apr 2001 - Nov 2008
Pcb Design Supervisor
Education:
Boces Drafting School 1979 - 1979
Sachem High School 1976 - 1979
Skills:
Electronics, Project Management, Product Development, Management, Manufacturing, Semiconductors, Engineering, Pcb Design, Integration, Schematic Capture, Orcad, Networking

Business & Organization Records

Name / TitleCompany / ClassificationPhones & Addresses
Dean C. Mazza
Principal
ROCKY RIVER SWEETS & SUNDRIES, LLC 280 Main St, New Hartford, CT 06057
PO Box 241, Pine Meadow, CT 06061
66 Prospect St, Winsted, CT 06098
752 Town Hl Rd, New Hartford, CT 06057

Publications

Us Patents

Flexible Microcircuit Space Transformer Assembly

US Patent:
2005021, Oct 6, 2005
Filed:
Mar 9, 2005
Appl. No.:
11/077537
Inventors:
Dean Mazza - Middlebury CT, US
Salvatore Sanzari - Naugatuck CT, US
Jeff Ritell - Ridgefield CT, US
Francis McQuade - Watertown CT, US
International Classification:
H01L027/10
US Classification:
257209000
Abstract:
A space transformer for electrically interconnecting a probe head to a printed circuit board, which includes a flexible multilayer circuit with device under test contact pads formed on a first side and printed circuit board contact pads formed on a second side. Electrically conductive circuit traces extend between the device under test contact pads and the printed circuit board contact pads. A shim plate is fastened to a periphery of the first side of the flexible multilayer circuit and a bottom plate is fastened to a periphery of the second side of the flexible multilayer circuit. The bottom plate has a plurality of internal apertures are aligned with the printed circuit board contact pads separated by bottom plate stanchions that are aligned with the device under test contact pads. A plurality of interconnects are bonded and electrically interconnected to the printed circuit contact pads and extend through the internal apertures.

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