Derrick M Herron, 44308 New Boston St, Canastota, NY 13032

2005009, May 5, 2005

Oct 1, 2004

10/954570

Yan Liu - Clinton NY, US
Derrick Herron - Utica NY, US

B23K031/02

228248100

Solder pastes for providing high elasticity, low rigidity solder joints are disclosed. The solder pastes may be used between two parts having large mismatches in their coefficients of thermal expansion and/or when there is a high likelihood of mechanical deformity when the two parts are soldered together. In one particular exemplary embodiment, a solder paste may be realized as a composition comprising a solder powder and high melting temperature particles with a flux, wherein the ratio between solder powder and high melting temperature particles may be between 2:1 and 1:10.

2012024, Oct 4, 2012

Apr 1, 2011

13/078824

DERRICK Matthew HERRON - Canastota NY, US
FENGYING ZHOU - JiangSu, CN

B23K 1/20
B23K 35/24
B23K 35/363

2282481, 148 24

A solder is provided that produces a more impact resistant solder joint that is usable in high-end applications. The solder joint has a strong interconnection that can perform all of the normal functions of a solder joint while being more impact resistant. Furthermore, the solder joint retains its capabilities over the service life of a high-end product such as a computer or a cell phone. The solder meets the requirements of the soldering industry both today and into the future, including but not limited to an ability to be printed or dispensed with standard methods and conformity to health and safety standards.

2016005, Feb 25, 2016

Aug 24, 2015

14/833398

- Clinton NY, US
Lei Luo - Shenzhen, CN
Christopher John Nash - Barneveld NY, US
Derrick Matthew Herron - Canastota NY, US

Indium Corporation - Clinton NY

H05K 3/34
H05K 1/18
H05K 1/11
B23K 1/00
H01L 23/495

Methods are provided for controlling voiding caused by gasses in solder joints of electronic assemblies. In various embodiments, a preform can be embedded into the solder paste prior to the component placement. The solder preform can be configured with a geometry such that it creates a standoff, or gap, between the components to be mounted in the solder paste. The method includes receiving a printed circuit board comprising a plurality of contact pads; depositing a volume of solder paste onto each of the plurality of contact pads; depositing a solder preform into each volume of solder paste; placing electronic components onto the printed circuit board such that contacts of the electronic components are aligned with corresponding contact pads of the printed circuit board; and reflow soldering the electronic components to the printed circuit board.