Douglas E Glover, 581212 Main St, Betts, SD 57301

7959441, Jun 14, 2011

Feb 9, 2007

11/704655

Douglas L. Glover - Phoenix AZ, US
Enrico E. DiVito - Scottsdale AZ, US
Kemmons A. Tubbs - Mesa AZ, US
Mark P. Colonna - Whitefish MT, US

Medical Dental Advanced Technologies Group, L.L.C. - Scottsdale AZ

A61C 5/02

433224, 433 29

A laser tip, and method for the use thereof, is described for utilization in medical and dental applications. Specifically, a tip with an increased photoacoustic wave emission capability is formed by beveling the tip and further enhanced by stripping the adjacent sheath. Preferably, this conic and/or stripped tip section is surface modified, for example, by texturing, derivatization or metalization. In the field of endodontics the tip is inserted into a solution that has been introduced into a root canal and the pulsed laser is fired. The resulting generation of an enhanced photoacoustic wave propagates through the solution. These photoacoustic waves turbulently clean the interior of the root and lateral canal systems and/or causes cell lysis and dissolution of inorganics in biotic systems.

7980854, Jul 19, 2011

Feb 28, 2009

12/395643

Douglas L. Glover - Phoenix AZ, US
Enrico E. DiVito - Scottsdale AZ, US
Kemmons A. Tubbs - Mesa AZ, US
Mark P. Colonna - Whitefish MT, US

A61C 5/02

433224, 433 29

A method treating a root canal in a tooth by introducing into the pulp chamber of a tooth and pulsing a laser light into the fluid reservoir so as to disintegrate pulp within the root canal without generation of any significant heat in said liquid fluid so as to avoid elevating the temperature of any of the dentin, tooth, or other adjacent tissue more than about 5 C.

2008007, Mar 20, 2008

Aug 24, 2007

11/895404

Enrico DiVito - Scottsdale AZ, US
Douglas Glover - Phoenix AZ, US
Kemmons Tubbs - Mesa AZ, US

A61C 5/02

433224000

A method that includes the following effects: the ability to expand, porositize, clean, decontaminate, debride, break-down and/or destroys, or aids and accentuates the dissolution or extraction of biological structures, nerves and tissues. The methodology uses nano-technology and/or other chemistries may or may not be excited by energy sources to expand and porositize the tissue, which enhances the penetration and effectiveness and acceleration of subsequent chemical, mechanical, and/or procedural steps in the protocol or process. Furthermore, the method includes the ability to associate with and/or initiate in the reconstructive growth and healing process associated with healthy tissue after surgery and/or the ability to destroy diseased or necrotic tissues or cells. The method also includes the ability to begin, construct or stage the activation of cells and/or tissues, including the area of transplantation and use in stem or primordial cell accentuation, their attachment and/or stimulation for growth and differentiation.

2010033, Dec 30, 2010

Sep 3, 2010

12/875565

Douglas L. Glover - Phoenix AZ, US
Enrico E. DiVito - Scottsdale AZ, US
Kemmons A. Tubbs - Mesa AZ, US
Mark P. Colonna - Whitefish MT, US
Robert Barr - San Jose CA, US

MEDICAL DENTAL ADVANCE TECHNOLOGIES GROUP - Scottsdale AZ

A61C 5/02

433224

Methods and apparatuses for treating a root canal in a tooth or hard and/or soft tissue within a tooth and surrounding tissues by pulsing a laser light into a reservoir, preferably after introducing liquid fluid into the reservoir, so as to disintegrate, separate, or otherwise neutralize pulp, plaque, calculus, and/or bacteria within and adjacent the fluid reservoir without elevating the temperature of any of the dentin, tooth, bones, gums, other soft tissues, other hard tissues, and any other adjacent tissue more than about 5 C.

2011026, Nov 3, 2011

Jul 18, 2011

13/185193

Douglas L. Glover - Phoenix AZ, US
Encrico E. DiVito - Scottsdale AZ, US
Kemmons A. Tubbs - Mesa AZ, US
Mark P. Colonna - Whitefish MT, US

MEDICAL DENTAL ADVANCED TECHNOLOGIES GROUP, LLC - Scottsdale AZ

A61N 5/00
A61C 5/02

433 29, 433224

A method treating a root canal in a tooth by introducing into the pulp chamber of a tooth and pulsing a laser light into the fluid reservoir so as to disintegrate pulp within the root canal without generation of any significant heat in said liquid fluid so as to avoid elevating the temperature of any of the dentin, tooth, or other adjacent tissue more than about 5 C.

2013014, Jun 6, 2013

Oct 1, 2012

13/633096

Douglas L. Glover - Phoenix AZ, US
Enrico E. DiVito - Scottsdale AZ, US
Kemmons A. Tubbs - Mesa AZ, US
Mark P. Colonna - Whitefish MT, US
Robert E. Barr - San Jose CA, US

Medical Dental Advanced Technologies Group LLC - Scottsdale AZ

A61N 5/06
A61B 18/22
A61C 17/00

433216

Methods and apparatuses for treating a root canal in a tooth or hard and/or soft tissue within a tooth and surrounding tissues by pulsing a laser light into a reservoir, preferably after introducing liquid fluid into the reservoir, so as to disintegrate, separate, or otherwise neutralize pulp, plaque, calculus, and/or bacteria within and adjacent the fluid reservoir without elevating the temperature of any of the dentin, tooth, bones, gums, other soft tissues, other hard tissues, and any other adjacent tissue more than about 5 C.

4928587, May 29, 1990

Jul 3, 1989

7/373704

Douglas L. Glover - Scottsdale AZ

Motorola Inc. - Schaumburg IL

B41F 1700

101 42

A programmable pad printer which responds to an input signal by selecting one of a plurality of marks for transfer to a semiconductor. The input signal is provided to the printer from an external source, such as a semiconductor tester. The appropriate mark is then presented to an opening in a housing by rotating a disc containing the plurality of marks. A print head picks up the mark from the disc and transfers it to the semiconductor.

6170736, Jan 9, 2001

May 4, 1998

9/072058

Martin J. Briehl - Scottsdale AZ
Russell J. Elias - Tempe AZ
Douglas L. Glover - Phoenix AZ
Marjorie S. Errickson - Tempe AZ

Motorola, Inc. - Schaumburg IL

B23K 3102

228212

A semiconductor die bonder (10) has a height adjuster (13) that is positioned next to the die bonding head (11). The height adjuster (13) assist in ensuring that die bonding head (11) positions a semiconductor die (36) at the desired bond line thickness.