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Duy Tu Kim Le, 48Woodinville, WA

Known as:
Duy Tu Le Duyt K Le Duy T Le Duy-Tu Kim Le Duy-Tu K Le Tu Duy Le Duy Le Tu U Kim U U Kim Leduy U Tu Leduy
Related to:
Yuhee Kim

Duy Le Phones & Addresses

Woodinville, WA   

Columbus, OH   

Seattle, WA   

512 Olivian Dr, San Jose, CA 95123    408-9720708   

Work

Address: 995 Montague Expy, Milpitas, CA 95035 Specialities: Chiropractor
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Mentions for Duy Tu Kim Le

Career records & work history

Medicine Doctors

Duy Le Photo 1

Duy Le

Specialties:
Neurology
Duy Le Photo 2

Duy Hoang Le, Milpitas CA

Specialties:
Chiropractor
Address:
995 Montague Expy, Milpitas, CA 95035

License Records

Duy Danh Le

Licenses:
License #: 2710030806
Category: Tradesman

Duy Khang Le Nguyen

Licenses:
License #: 0225083794
Category: Real Estate Individual

Duy Le resumes & CV records

Resumes

Duy Le Photo 50

Duy Le

Position:
Research & Development Lead at Renn Sport Design
Location:
United States
Industry:
Automotive
Work:
Renn Sport Design since Dec 2008
Research & Development Lead Makita U.S Apr 2008 - Dec 2008
Associate Product Manager Seibon International, Inc Aug 2006 - Mar 2008
Marketing Director
Education:
Northeastern University 1998 - 2002
BS, Legal Studies University of Massachusetts, Amherst
B.S, Exercise Science
Duy Le Photo 51

Duy Le

Industry:
Insurance
Work:
Duy Le
Student
Duy Le Photo 52

Duy Phuong Le

Duy Le Photo 53

Duy Le

Duy Le Photo 54

Duy Nguyen Le

Duy Le Photo 55

Duy Le

Duy Le Photo 56

Duy Le

Duy Le Photo 57

Duy Le

Publications & IP owners

Us Patents

Optimized Weld Strength For Dissimilar Materials

US Patent:
2020033, Oct 22, 2020
Filed:
Aug 6, 2019
Appl. No.:
16/533374
Inventors:
- Cupertino CA, US
Abhijeet Misra - Sunnyvale CA, US
Lei Gao - Shanghai, CN
Matthew D. Walker - Los Gatos CA, US
Logan Ames - Palo Alto CA, US
Duy P. Le - Los Angeles CA, US
Vince Yan - San Francisco CA, US
International Classification:
C22C 38/16
B23K 26/21
B23K 26/06
Abstract:
An electronic device can include a component including a first material joined to a component including a second, different material. The first material can include steel and copper, while the second material can include aluminum. The first material can be joined to the second material by a pulsed laser welding process that forms an interface region having a ratio of an interface region length to a lateral length greater than about

Vacuum Impregnation Seal In An Electronic Device

US Patent:
2020002, Jan 23, 2020
Filed:
Jul 20, 2018
Appl. No.:
16/041591
Inventors:
- Cupertino CA, US
Logan M. AMES - Palo Alto CA, US
HaiLong WANG - Shanghai, CN
Ricky C. LEE - Arcadia CA, US
Duy P. LE - Los Angeles CA, US
International Classification:
G02F 1/1341
G02F 1/1339
Abstract:
An electronic device is disclosed. The electronic device may include an enclosure that includes a metal band and a wall. The electronic device may further include a filler compound positioned in an opening of the metal band, where a split between two sidewall components defines the opening. The filler compound provides an RF communication path through the enclosure. In order to reduce or prevent liquid ingress into the enclosure, the electronic device may include a sealing compound that infused into the opening between the filler compound and the sidewall components, thereby providing a seal. The infusion process including placing the metal band (with the filler compound) in a chamber, providing a vacuum to remove air between the metal band and the filler compound, and subsequently providing a positive pressure to force the sealing compound between the metal band and the filler compound. The sealing compound may include an adhesive.

Coupling Structures For Electronic Device Housings

US Patent:
2019003, Jan 31, 2019
Filed:
Sep 29, 2018
Appl. No.:
16/147703
Inventors:
- Cupertino CA, US
Michael B. Wittenberg - Sunnyvale CA, US
Shane Bustle - Cupertino CA, US
Duy P. Le - Cupertino CA, US
International Classification:
H01Q 1/24
H04M 1/02
G06F 1/16
B29C 45/14
B29C 37/00
B29L 31/34
Abstract:
A housing for an electronic device is disclosed. The housing comprises a first component and a second component separated from the first component by a gap. The housing also includes a first molded element disposed at least partially within the gap and defining at least a portion of an interlock feature, and a second molded element disposed at least partially within the gap and mechanically engaging the interlock feature. The first component, the second component, and the second molded element form a portion of an exterior surface of the housing. A method of forming the housing is also disclosed.

Laser Bleach Marking Of An Anodized Surface

US Patent:
2018006, Mar 8, 2018
Filed:
Jun 22, 2017
Appl. No.:
15/630594
Inventors:
- Cupertino CA, US
Duy P. Le - Santa Clara CA, US
Burak Metin - Cupertino CA, US
Junjie Xu - Cupertino CA, US
Ming Li - Cupertino CA, US
International Classification:
B44C 1/22
B23K 26/362
B23K 26/40
C25D 11/24
H04B 1/3888
Abstract:
A deep black housing for a handheld electronic device is disclosed having one or more high resolution, bleached markings. The bleached markings are significantly lighter than the housing and exhibit a smooth appearance. Methods for preparing a housing having the finish and markings are also disclosed, including housings for use in mobile phones.

Coupling Structures For Electronic Device Housings

US Patent:
2017006, Mar 9, 2017
Filed:
Aug 10, 2016
Appl. No.:
15/233891
Inventors:
- Cupertino CA, US
Michael B. Wittenberg - Cupertino CA, US
Shane Bustle - Cupertino CA, US
Duy P. Le - Cupertino CA, US
International Classification:
H01Q 1/24
H05K 5/02
B29C 65/70
Abstract:
A housing for an electronic device is disclosed. The housing comprises a first component and a second component separated from the first component by a gap. The housing also includes a first molded element disposed at least partially within the gap and defining at least a portion of an interlock feature, and a second molded element disposed at least partially within the gap and mechanically engaging the interlock feature. The first component, the second component, and the second molded element form a portion of an exterior surface of the housing. A method of forming the housing is also disclosed.

Housing Features Including Logo Features Of An Electronic Device

US Patent:
2016006, Mar 3, 2016
Filed:
Feb 25, 2015
Appl. No.:
14/631626
Inventors:
- Cupertino CA, US
Michael Benjamin Wittenberg - Sunnyvale CA, US
Sawyer I. Cohen - Sunnyvale CA, US
Benjamin Shane Bustle - Cupertino CA, US
Duy P. Le - San Francisco CA, US
International Classification:
H05K 5/02
G06F 1/16
G09F 23/00
Abstract:
An enclosure having an indicium (e.g., logo) and a method for securing an indicium to an enclosure is disclosed. The enclosure includes an aperture extending through an interior portion and an exterior portion of the enclosure. The aperture may include concentric portions. For example, the aperture may include a first opening formed on an interior portion and a second opening smaller than the first opening formed on the exterior portion. The indicium may include a flange member such that the indicium may extend through the first opening but not the second opening. Also, in some embodiments, a plate is adhesively secured to the indicium and the enclosure; however, the indicium is not directly adhesively secured to the enclosure. This may prevent adhesively from protruding from an interface region between the indicium and the enclosure.

Possible Relatives

David M Le  De V Le  Dan Le  Danang D Le  Danh T Le  Daniel Le  Aaron H Le  Duy N Luu  Duy M Ta  Duy D Nguyen 

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