Edward E Conlon, 6819 Railroad Ave, Kenvil, NJ 07847

2001000, May 24, 2001

Oct 30, 1998

09/183479

MICHAEL JAMES LIBERATORE - LAWRENCEVILLE NJ, US
BARRY JAY THALER - LAWRENCEVILLE NJ, US
PAUL F. PELKA - STANHOPE NJ, US
EDWARD J. CONLON - PRINCETON NJ, US
JON SHELDON PROKOP - DALLAS TX, US

C03B029/00
C04B033/34
C04B037/00
B05D005/12

156/089120, 156/089210, 427/096000

A method of making transmission lines and buried passive components in a green tape comprising embossing a channel or opening into the green tape of the desired size under heat and pressure, screen printing an ink of a conductive material or a passive component material to fill said embossed channel or opening; and firing said green tape. The embossing tool forms channels and openings having improved dimensional control over that obtained using screen printing. Further, embossing provides improved thickness control of lines and passive components as well.

5035939, Jul 30, 1991

Feb 9, 1990

7/477393

Edward J. Conlon - Princeton NJ
Ashok N. Prabhu - East Windsor NJ
Simon M. Boardman - Holland PA
Valerie A. Pendrick - Lambertville NJ

David Sarnoff Research Center, Inc. - Princeton NJ

B32B 300

428137

In the manufacture of printed circuit boards, a first photoresist post is patterned on the substrate where via holes are to be made. A dielectric layer is put down, a second photoresist layer patterned so as to have openings over and in alignment with the photoresist posts, and the dielectric removed from the via holes. Barrier layers to reduce interaction between layers of copper, dielectric and photoresist during filling of the via holes with a conductor via fill ink are also described.

4874550, Oct 17, 1989

Dec 2, 1988

7/278987

Ashok N. Prabhu - East Windsor NJ
Kenneth W. Hang - Princeton NJ
Edward J. Conlon - Princeton NJ

General Electric Company - Schenectady NY

H01B 106

252512

Improved copper conductor inks useful in fabricating multilevel circuits are provided. The inks comprise copper powder, a devitrifying glass frit which does not begin to flow until the furnace temperature is above about 700. degree. C. , and a suitable organic vehicle. Devitrifying glass frits with these properties include a zinc-calcium-aluminum-silicate glass frit, a zinc-magnesium-barium-aluminum-silicate glass frit, a zinc-magnesium-barium-aluminum-zirconium-phosphosilicate glass frit and mixtures thereof. The inks are advantageous in that they form copper conductor layers having excellent properties without the inclusion of traditional flux materials such as bismuth oxide.

5216207, Jun 1, 1993

Feb 27, 1991

7/661264

Ashok N. Prabhu - East Windsor NJ
Edward J. Conlon - Princeton NJ
Barry J. Thaler - Lawrenceville NJ

David Sarnoff Research Center, Inc. - Princeton NJ

H05K 100

174256

A novel ceramic green tape composition useful in the manufacture of silver conductor based, low temperature, co-fired multilayer circuit boards comprises from about 8-35% by weight of a calcium-zinc-aluminum-borosilicate devitrifying glass; from about 10-35% by weight of a low alkali borosilicate glass; from about 10-35% by weight of a lead-zinc-aluminosilicate glass; from about 10-35% by weight of a ceramic filler; up to 0. 5% by weight of a coloring agent and from about 20-45% by weight of an organic binder. The co-fired multilayer circuit boards made from these green tape compositions have excellent mechanical and electrical properties and have thermal expansion characteristics matching that of silicon. The devitrifying glass comprises from about 10-30% by weight of zinc oxide; from about 10-20% by weight of calcium oxide; up to about 15% by weight of boron oxide; from about 15-20% by weight of aluminum oxide and about 25-55% by weight of silicon oxide. The lead-zinc-aluminosilicate vitreous glass comprises from about 30-40% by weight of lead oxide, from about 6-12% by weight of zinc oxide, from about 6-10% by weight of aluminum oxide and from about 40-55% by weight of silicon oxide.

3972463, Aug 3, 1976

Feb 7, 1975

5/548009

Edward James Conlon - Trenton NJ
Ralph DeStephanis - Middlesex NJ
Thomas Tipton Hitch - Trenton NJ

RCA Corporation - New York NY

B23K 1900

228 441A

A microcircuit adhesion testing method and fixture for uniform placement and soldering of a preselected length of wire above a film pad on a microcircuit substrate with consistent substrate-to-wire spacing, comprising a holder for the substrate, finger spacers attached to the holder, and a member for pressing the wire against the spacers. The spacers are made of a material which is not wettable with solder of the type used to attach the wire to the film.