Edward Adair Wilson, 8414634 W Parkwood Dr UNIT 106, Surprise, AZ 85374

4109707, Aug 29, 1978

Mar 16, 1977

5/778308

Edward A. Wilson - Phoenix AZ
James D. Fredenberg - Phoenix AZ

Honeywell Information Systems, Inc. - Phoenix AZ

F28F 2100
F28F 700

165 46

A fluid cooling system for electronic systems particularly adapted to cool large scale integrated circuit chips mounted on substrates. The system has one or more heat exchangers through which a liquid coolant is circulated. Each heat exchanger has a flexible wall and is mounted so that its flexible wall is in close proximity to a surface of the substrate to be cooled. A low thermal impedance contact is made through the flexible wall of the heat exchanger between the substrate to be cooled and the coolant flowing through the heat exchanger because of the pressure of the coolant in the heat exchanger. The heat exchangers are connected into the cooling system through flexible conduits so that a heat exchanger can readily be moved out of contact with a substrate without disrupting the flow of coolant through the cooling system.

4009423, Feb 22, 1977

Jul 2, 1975

5/592579

Edward A. Wilson - Phoenix AZ

Honeywell Information Systems, Inc. - Phoenix AZ

H01L 2334

361385

A liquid cooled heat exchanger particularly adapted to cool heat sinks of an electrical power supply for large electronic systems. The heat exchanger has thin flexible walls. Pressure of the coolant within the heat exchanger assures a positive mechanical contact between the heat exchanger and the heat sink, one that can accommodate changes in dimensions of the heat sink or heat exchanger and a lack of planarity of the surfaces of the heat sink without increasing the thermal impedance between the liquid in the heat exchanger and the heat sink. Fluid flow within the heat exchanger is controlled so that heat transfer efficiency between certain areas of the flexible walls and the coolant is maximized, which areas are proximate to the heat sources mounted on the heat sink.

D362426, Sep 19, 1995

Nov 5, 1993

D/015636

Edward A. Wilson - Glendale AZ
Norman Ellison - Phoenix AZ
Clyde L. Fauss - Phoenix AZ
Mike O. Arrieta - Phoenix AZ

Honeywell Inc. - Minneapolis MN

D14103

4142231, Feb 27, 1979

Jan 3, 1978

5/868097

Edward A. Wilson - Phoenix AZ
John R. Nowell - Phoenix AZ

Honeywell Information Systems Inc. - Phoenix AZ

H02M 3315

363141

An improved high current low voltage switching regulator power supply in which the major heat producing components of the power modules of the power supply are mounted on a pair of chill plates with a liquid cooled heat exchanger between the plates. The chill plates are electrically isolated from each other and the heat exchanger. One chill plate also serves as the positive power output bus and the other as the negative power output bus of the power supply which significantly reduces the parasitic inductance of the power supply.

4072188, Feb 7, 1978

Jul 2, 1975

5/592578

Edward A. Wilson - Phoenix AZ
James D. Fredenberg - Phoenix AZ

Honeywell Information Systems Inc. - Phoenix AZ

H01L 2334

165 80

A fluid cooling system for electronic systems particularly adapted to cool large scale integrated circuit chips mounted on substrates. The system has one or more heat exchangers through which a liquid coolant is circulated. Each heat exchanger has a flexible wall and is mounted so that its flexible wall is in close proximity to a surface of the substrate to be cooled. A low thermal impedance contact is made through the flexible wall of the heat exchanger between the substrate to be cooled and the coolant flowing through the heat exchanger because of the pressure of the coolant in the heat exchanger. The heat exchangers are connected into the cooling system through flexible conduits so that a heat exchanger can readily be moved out of contact with a substrate without disrupting the flow of coolant through the cooling system.

4009752, Mar 1, 1977

Feb 24, 1975

5/552494

Edward Arthur Wilson - Phoenix AZ

Honeywell Information Systems Inc. - Phoenix AZ

H01L 2336

165 81

A warp-resistant heat sink suitable for soldering to one side of a relatively fragile, ceramic semiconductor substrate comprises a plate of heat-conducting material having a plurality of slits along two sides thereof, and a plurality of U-shaped heat-conducting members each of which extends through a respective one of the slits in the plate. The U-shaped heat-conducting members are soldered to the same side of the plate, the members along one edge of the plate being off-set with respect to the members along the opposite side of the plate in order to increase the heat transfer efficiency when air is forced through the heat sink. The plate material is selected so as to have a substantially identical thermal coefficient of expansion as that of the substrate material. When the heat sink plate is soldered to the substrate surface, a laminate is thereby formed comprising two outer layers of material having substantially identical thermal coefficients of expansion and an inner layer having a different thermal coefficient of expansion. Relatively large heat sinks can thus be fabricated which have a high resistance to the warpage which would otherwise result from the dissimilar thermal expansion and contraction of the ceramic substrate and the heat-conducting members.