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Ellen C Kutner, 67712 Traver Rd, Pleasant Valley, NY 12569

Ellen Kutner Phones & Addresses

712 Traver Rd, Pleasant Vly, NY 12569    845-6351842   

Pleasant Valley, NY   

Yorktown Heights, NY   

Rensselaerville, NY   

Middleburgh, NY   

Hamilton, OH   

Poughquag, NY   

Trenton, OH   

Mentions for Ellen C Kutner

Ellen Kutner resumes & CV records

Resumes

Ellen Kutner Photo 14

Owner

Location:
Pleasant Valley, NY
Industry:
Consumer Services
Work:
Simply Organized
Owner
Education:
Dutchess Community College 1975 - 1976
Skills:
Public Speaking, Entrepreneurship, Marketing Strategy, Team Building, Coaching, Small Business, Sales Management, Customer Service, Professional Organizing, Start Ups, Social Media, Marketing, Event Planning, Sales, Strategic Planning, New Business Development
Ellen Kutner Photo 15

Certified Professional Organizer And Owner

Location:
Pleasant Valley, NY
Industry:
Consumer Services
Work:
Simply Organized
Certified Professional Organizer and Owner
Ibm Aug 1978 - Mar 1993
Equipment Engineering Technician
Simply Organized/Professional Organizer Aug 1978 - Mar 1993
Owner
Education:
Dutchess Community College 1975 - 1977
Associates, Drawing, Design

Publications & IP owners

Us Patents

Method For Preparation Of Semiconductor Structures And Devices Which Utilize Polymeric Dielectric Materials

US Patent:
4599136, Jul 8, 1986
Filed:
Oct 3, 1984
Appl. No.:
6/657277
Inventors:
Constance J. Araps - Wappingers Falls NY
Steven M. Kandetzke - Fishkill NY
Ellen L. Kutner - Poughquag NY
Mark A. Takacs - Poughkeepsie NY
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H01L 21306
B44C 122
C03C 1500
C03C 2506
US Classification:
156643
Abstract:
A method of fabrication of semiconductor structures which utilize trenches filled with polymeric dielectric materials to isolate segments thereof is disclosed. Contamination of the polymeric dielectric during processing of structural segments is avoided by filling the trenches with disposable polymer through formation of conductive patterns upon the structure, with subsequent removal of the disposable polymer and replacement with the desired polymeric dielectric.

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