Eric L Austin, 5510039 Buena Vista Ave, Santee, CA 92071

6769893, Aug 3, 2004

Jul 3, 2001

09/898601

Eric Austin - Carlsbad CA
Steve Majgier - San Jose CA
David Padgett - Carlsbad CA
Kyle Springer - Carlsbad CA

Nordson Corporation - Westlake OH

B29C 3100

425110

A multi-chamber vacuum encapsulation system for encapsulation of semiconductor chip packages. The encapsulation system includes a dispense chamber, an inlet chamber mounted adjacent an inlet end of the dispense chamber, and an outlet chamber mounted adjacent an outlet end of the dispense chamber. The dispense chamber includes a material dispensing head for dispensing encapsulant material about the peripheral edges of chip packages under at least partial vacuum of the dispense chamber. A transport mechanism is provided in the dispense chamber for moving the chip packages between the inlet and outlet ends of the chamber. Methods of vacuum encapsulating semiconductor chip packages are also disclosed.

6284173, Sep 4, 2001

May 28, 1999

9/322416

Eric Austin - Carlsbad CA
Steve Majgier - San Jose CA
David Padgett - Carlsbad CA
Kyle Springer - Carlsbad CA

Nordson Corporation - Westlake OH

B29C 3100

264102

A multi-chamber vacuum encapsulation system for encapsulation of semiconductor chip packages. The encapsulation system includes a dispense chamber, an inlet chamber mounted adjacent an inlet end of the dispense chamber, and an outlet chamber mounted adjacent an outlet end of the dispense chamber. The dispense chamber includes a material dispensing head for dispensing encapsulant material about the peripheral edges of chip packages under at least partial vacuum of the dispense chamber. A transport mechanism is provided in the dispense chamber for moving the chip packages between the inlet and outlet ends of the chamber. During the encapsulation process, the dispense chamber remains evacuated at all times while the smaller inlet and outlet chambers are evacuated and vented in a controlled manner to allow transfer of chip packages to and from the dispense chamber without venting of the dispense chamber to atmosphere. After the dispense cycle in the dispense chamber is completed, the chip packages are transferred to the outlet chamber which is then vented to atmosphere at a controlled rate to complete the encapsulation process. Methods of vacuum encapsulating semiconductor chip packages are also disclosed.

5927560, Jul 27, 1999

Mar 31, 1997

8/828569

Alan Lewis - Carlsbad CA
Eric L. Austin - Del Mar CA
Alec Babiarz - Encinitas CA
John Newbold - San Diego CA

Nordson Corporation - Westlake OH

G01F 1100

222263

A dispensing pump for dispensing liquid, particularly suitable for dispensing two-part epoxy for encapsulation of integrated circuits, includes a pumping chamber in communication with a nozzle via a three way valve, the pumping chamber including an outlet, an internal volume, a pair of spaced directional seals located away from the outlet, an open volume residing between the seals and an external port opening the open volume to atmosphere. A stepped plunger extends axially within the pumping chamber, with a first portion sized to be received and aligned through the first directional seal, the plunger being movable to move the first portion toward the outlet to close off the internal volume at the second seal. The second portion of the plunger is relatively smaller in transverse cross-sectional dimension than the inside diameter of the second seal, to cooperate with the port to promote fluid removal from the internal volume during initial filling and priming of the pumping chamber. Once filled and primed, the plunger causes positive volume displacement of liquid from the pumping chamber and out of the nozzle, with very good repeatability and high fluid flow rates, independent of material viscosity, and/or temperature or viscosity changes.

5992688, Nov 30, 1999

Feb 22, 1999

9/255619

Alan Lewis - Carlsbad CA
Eric L. Austin - Del Mar CA
Alec Babiarz - Encinitas CA
John Newbold - San Diego CA

Nordson Corporation - Westlake OH

B67B 700

222 1

A dispensing pump for dispensing liquid, particularly suitable for dispensing two-part epoxy for encapsulation of integrated circuits, includes a pumping chamber in communication with a nozzle via a three way valve, the pumping chamber including an outlet, an internal volume, a pair of spaced directional seals located away from the outlet, an open volume reciting between the seals and an external port opening the open volume to atmosphere. A stepped plunger extends axially within the pumping chamber, with a first portion sized to be received and aligned through the first directional seal, the plunger being movable to move the first portion toward the outlet to close off the internal volume at the second seal. The second portion of the plunger is relatively smaller in transverse cross-sectional dimension than the inside diameter of the second seal, to cooperate with the port to promote fluid removal from the internal volume during initial filling and priming of the pumping chamber. Once filled and primed, the plunger causes positive volume displacement of liquid from the pumping chamber and out of the nozzle, with very good repeatability and high fluid flow rates, independent of material viscosity, and/or temperature or viscosity changes.