Eric Davey resumes & CV records
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Eric E Davey, 46555 Dry Fork Rd, Chilhowie, VA 24319
Eric Davey Phones & Addresses
Chilhowie, VA
San Leandro, CA
88 Stonecrest Cir SW, Concord, NC 28027 704-7934192
Etna, CA
Hayward, CA
PO Box 6751, Concord, NC 28027 510-7834369
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Us Patents
Thin Plastic Polishing Article For Cmp Applications
US Patent:
2018020, Jul 26, 2018
Filed:
Jan 19, 2018
Appl. No.:
15/875867
Inventors:
- Santa Clara CA, US
Gregory E. MENK - Pleasanton CA, US
Eric DAVEY - Mountain View CA, US
You WANG - Cupertino CA, US
Huyen Karen TRAN - San Jose CA, US
Fred C. REDEKER - Fremont CA, US
Veera Raghava Reddy KAKIREDDY - Santa Clara CA, US
Ekaterina MIKHAYLICHENKO - San Jose CA, US
Jay GURUSAMY - Santa Clara CA, US
Gregory E. MENK - Pleasanton CA, US
Eric DAVEY - Mountain View CA, US
You WANG - Cupertino CA, US
Huyen Karen TRAN - San Jose CA, US
Fred C. REDEKER - Fremont CA, US
Veera Raghava Reddy KAKIREDDY - Santa Clara CA, US
Ekaterina MIKHAYLICHENKO - San Jose CA, US
Jay GURUSAMY - Santa Clara CA, US
International Classification:
B24D 11/00
H01L 21/306
C09K 3/14
B24D 3/22
B24B 37/26
B24B 37/20
H01L 21/306
C09K 3/14
B24D 3/22
B24B 37/26
B24B 37/20
Abstract:
A method and apparatus for polishing a substrate that includes a polishing article comprising a polymeric sheet having a raised surface texture, which is formed on the surface of the polymeric sheet is provided. According to one or more implementations of the present disclosure, an advanced polishing article has been developed, which does not require abrasive pad conditioning. In some implementations of the present disclosure, the advanced polishing article comprises a polymeric sheet having a polishing surface with a raised surface texture or “micro-features” and/or a plurality of grooves or “macro-features” formed in the polishing surface. In some implementations, the raised surface texture is embossed, etched, machined or otherwise formed in the polishing surface prior to installing and using the advanced polishing article in a polishing system. In one implementation, the raised features have a height within one order of magnitude of the features removed from the substrate during polishing.
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