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Eric L Falconer, 4477 Ross Rd, Kennebunk, ME 04043

Known as:
Eric Living Falconer Eric Falconer Lt Edward Falconer
Related to:
Constance G Henderson 79

Eric Falconer Phones & Addresses

Kennebunk, ME   

Jamesport, NY   

New Hyde Park, NY   

Alfred, ME   

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Eric L Falconer

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Company: Allied Home Mortgage Address: 360 Us Route 1, Suite 300, Scarborough, ME 04074 Phones: 207-8855070 (Office) 207-3182771 (Cell) 207-5108300 (Fax)

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Real Estate Brokers

Eric Falconer Photo 1

Senior Loan Officer

Specialties:
Purchase Loan, Refinancing, Mortgage Planning, 203K Rehab Loan, Reverse Mort.
Work:
Allied Home Mortgage
360 Us Route 1, Suite 300, Scarborough, ME 04074
207-8855070 (Office), 207-3182771 (Cell), 207-5108300 (Fax)
Experience:
10 years
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Eric Falconer resumes & CV records

Resumes

Eric Falconer Photo 32

President

Location:
Kennebunk, ME
Industry:
Security And Investigations
Eric Falconer Photo 33

Eric Falconer

Publications & IP owners

Us Patents

Integrated Circuit Package For Burn-In And Testing Of An Integrated Circuit Die

US Patent:
5528157, Jun 18, 1996
Filed:
Nov 15, 1994
Appl. No.:
8/339780
Inventors:
William R. Newberry - South Portland ME
Mark A. McClintick - Freeport ME
Eric Falconer - South Portland ME
William B. Aronson - Limerick ME
Mark Lippold - Portland ME
David W. Joy - Windham ME
Assignee:
National Semiconductor Corporation - Santa Clara CA
International Classification:
G01R 3102
US Classification:
324754
Abstract:
A method for and a disassemblable prepackage arrangement for testing and burning-in an integrated circuit die which will be hermetically sealed within and form part of an overall integrated circuit package is herein disclosed. The die has a top and bottom surface and includes a plurality of die input/output terminals. The prepackage comprises a substrate including a top surface. The bottom of the die is disengagably attached to the top surface of the substrate. A lid is disengagably attached to the substrate in a way which hermetically seals the die within a space substantially defined by the substrate and the lid. Thereafter, the die input/output terminals are electrically connecting to external testing equipment for testing and burning-in the die while the die is in a hermetically sealed environment.

Possible Relatives

David R Falconer  Daniel F Falconer  Dennis G Falconer  Don Falconer  Donald E Falconer  Donna J Falconer  Doris H Falconer  Eric N Johnson  Eric Stamps  Eric P Stander 

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