Eric L Mcafee, 418264 Forest Ridge Dr, Woodway, TX 76712

2021004, Feb 11, 2021

Aug 5, 2020

16/986122

- Santa Clara CA, US
Phil GENG - Portland OR, US
Kenan ARIK - Hillsboro OR, US
David SHIA - Portland OR, US
Casey WINKEL - Hillsboro OR, US
Sandeep AHUJA - Portland OR, US
Eric D. MCAFEE - Portland OR, US
Jeffory L. SMALLEY - Olympia WA, US
Minh T.D. LE - North Plains OR, US
Ralph V. MIELE - Hillsboro OR, US
Marc MILOBINSKI - Scappoose OR, US
Aaron P. ANDERSON - Beaverton OR, US
Brendan T. PAVELEK - Portland OR, US

H01L 23/367
G11C 5/06
H05K 7/14
H05K 7/20

An apparatus is described. The apparatus includes an electronic system. The electronic system includes a chassis. The electronic system includes a semiconductor chip cooling component that is rigidly fixed to the chassis. The electronic system includes a packaged semiconductor chip having a lid that is contact with the semiconductor chip cooling component. The electronic system includes an electronic circuit board. The packaged semiconductor chip is electro-mechanically attached to the electronic circuit board.

2019030, Oct 3, 2019

Mar 30, 2018

15/942270

- Santa Clara CA, US
Ming-Chen Chang - Portland OR, US
Evan A. Chenelly - Beaverton OR, US
Divya Swamy Bandaru - Hillsboro OR, US
Craig J. Jahne - Beaverton OR, US
Andrew Larson - Hillsboro OR, US
Eric W. Buddrius - Hillsboro OR, US
Eric D. McAfee - Portland OR, US
Mustafa Haswarey - Tigard OR, US
Ralph V. Miele - Hillsboro OR, US
Rolf Laido - Sherwood OR, US

Intel Corporation - Santa Clara CA

H01L 23/40
H05K 7/14
H01L 23/367

A microprocessor heat sink fastener assembly, comprising a base to couple to a heat sink a retention nut to be received by a cavity of the base, and a retention clip to be attached to the base and to be cantilevered therefrom. The retention clip is to engage with a latching structure extending from a latching structure of a retention plate.

2018005, Mar 1, 2018

Nov 22, 2016

15/358568

- Santa Clara CA, US
JOSEPH A. BRODERICK - Portland OR, US
BARRETT M. FANEUF - Beaverton OR, US
ERIC D. MCAFEE - Portland OR, US
BRIAN S. JARRETT - Hillsboro OR, US
JUAN G. CEVALLOS - Hillsboro OR, US
PEI-FANG SUNG - Hillsboro OR, US
EMERY E. FREY - Portland OR, US

F28F 9/26
F28F 3/12
F28F 1/02
F28D 15/00

Apparatuses and methods associated with heat exchanger puck design are disclosed herein. In embodiments, a heat exchanger puck may include a first plate with a cavity that extends into the first plate from a side of the first plate and a second plate. The second plate may be coupled to the side of the first plate, with the cavity located between the first plate and the second plate. The heat exchanger puck may further include a tube of a liquid coolant system located, at least partially, within the cavity, the tube formed to fit the cavity created by the first plate and the second plate. Other embodiments may be described and/or claimed.

2018000, Jan 4, 2018

Jul 1, 2016

15/201358

- Santa Clara CA, US
Mark E. Sprenger - Tigard OR, US
Ralph V. Miele - Hillsboro OR, US
Eric D. McAfee - Portland OR, US
Mark MacDonald - Beaverton OR, US

Intel Corporation - Santa Clara CA

A63B 71/06

Briefly, in accordance with one or more embodiments, a smart base for a baseball system or a softball system comprises a sensor to detect a first time at which a runner has touched the smart base, a radio-frequency (RF) receiver to receive a signal from a smart baseball that indicates a second time at which the smart baseball was caught, timing circuitry to detect if the second time occurs before or after the first time; and indicator circuitry to indicate a force out if the second time occurs before the first time.

2017016, Jun 8, 2017

Dec 3, 2015

14/958420

- Santa Clara CA, US
Eric D. McAfee - Portland OR, US
Shankar Krishnan - Portland OR, US
Juan G. Cevallos - Portland OR, US
Roger D. Flynn - Tempe AZ, US

H01L 23/473
H01L 23/00
H01L 23/367
H01L 21/48
B23P 15/26
G06F 1/20

Methods, apparatuses and systems associated with a heat exchanger for cooling an IC package are disclosed herein. In embodiments, a heat exchanger may include a base plate having a bottom side to be thermally coupled to the IC package, and a fin side, wherein the fin side is to include a plurality of fins to dissipate thermal energy emanated from the IC package. The heat exchanger may further include a manifold structure disposed on top of the base plate, having one or more layers, to regulate a coolant fluid flow to cool the plurality of fins, wherein the one or more layers are to include a plurality of channels and ports complementarily organized to distribute the coolant fluid flow to the plurality of fins tailored to a thermal energy emanation pattern of the integrated circuit package. Other embodiments may be described and/or claimed.

2016004, Feb 11, 2016

Aug 8, 2014

14/455337

- Santa Clara CA, US
Eric D. McAfee - Portland OR, US
Tod A. Byquist - Federal Way WA, US

H05K 7/20

Embodiments of the present disclosure are directed toward techniques and configurations for immersion cooling. In embodiments, an apparatus configured for immersion cooling may include a number of trays and a fluid circulation system. The number of trays may be configured to hold one or more circuit boards and may have a first opening to allow dielectric fluid to be injected into the tray, and a second opening to allow for escape of the dielectric fluid. The fluid circulation system may include a catchment area to collect the dielectric fluid that escapes from the plurality of trays and a distribution manifold coupled with the catchment area, to deliver the dielectric fluid collected in the catchment area back to the plurality of trays. Other embodiments may be described and/or claimed.