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Eric K White, 55825 Cheryl St, Aumsville, OR 97325

Eric White Phones & Addresses

Aumsville, OR   

Pacific City, OR   

Salem, OR   

Portland, OR   

Lake Oswego, OR   

1696 High St SE, Salem, OR 97302    503-3917127   

Work

Position: Professional/Technical

Education

Degree: High school graduate or higher

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Publications & IP owners

Us Patents

Copper Wire And Dielectric With Air Gaps

US Patent:
2016003, Feb 4, 2016
Filed:
Oct 14, 2015
Appl. No.:
14/883162
Inventors:
- Armonk NY, US
Jeffrey P. GAMBINO - Portland OR, US
Zhong-Xiang HE - Essex Junction VT, US
Trevor A. THOMPSON - Jeffersonville VT, US
Eric J. WHITE - Charlotte VT, US
International Classification:
H01L 21/768
H01L 23/528
H01L 23/522
H01L 21/288
H01L 23/532
Abstract:
Approaches for fabricating copper wires in integrated circuits are provided. A method of manufacturing a semiconductor structure includes forming a wire opening in a mask. The method also includes electroplating a conductive material in the wire opening. The method additionally includes forming a cap layer on the conductive material. The method further includes removing the mask. The method still further includes forming spacers on sides of the conductive material. The method additionally includes forming a dielectric film on surfaces of the cap layer and the sidewall spacers.

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