Frank A Polese Deceased46 Jackson Ave, Yonkers, NY 10709

6462413, Oct 8, 2002

Jul 21, 2000

09/620758

Frank J. Polese - San Diego CA
Stuart Weinshanker - La Jolla CA
Dana R. Graham - Poway CA

Polese Company, Inc. - San Diego CA

H01L 2312

257732, 257728, 257670, 257673, 257675

A heatsink assembly and method of fabrication and use for high power RF LDMOS transistors such as those used in mobile telephone basestation pre-antenna amplifiers wherein die attachment to the heatsink flange occurs prior to leadframe/spacer-to-flange bonding. Various bonding methods are disclosed which do not compromise the die-to-flange attachment bond. A unique leadframe/spacer/flange heatsink package is also disclosed which automatically properly orients attachment of the leadframe/spacer to the flange, and provides for a thickened spacer. A unique leadframe having contact projections also avoids later wire bonding. A unique leadframe/spacer/lid combination is disclosed which allows in one step the bonding of the leadframe to the flange, electrically contacting the die, and encapsulation.

2002000, Jan 17, 2002

Mar 9, 2001

09/802487

Frank Polese - San Diego CA, US
Walter Chichra - Armonk NY, US
Anthony Grodio - Armonk NY, US
Kenneth Huth - Armonk NY, US

B32B015/20
B32B005/00

428/654000, 228/235200, 228/235300, 428/652000, 428/627000, 428/650000, 428/940000

A ceramic metal matrix composite and copper material having a layer of ceramic metal matrix composite such as aluminum silicon carbide (Al—SiC) bonded to a layer of metal such as copper useful for forming heat-dissipating components for microelectronics concerned with lightweight, high stiffness, high thermal conductivity and compatible thermo expansion characteristics. The clad material may be formed from plurality of sucessive layers of composite and metal. The material is formed by rolling an extruded strip of Al—SiC with the metal layer. Alternately, an interim layer of aluminum, aluminum silicon or other bond-enhancing material is clad to the metal layer prior to rolling it with the composite. The interim layer is thought to form a stronger bond with the exposed aluminum matrix portion of the composites layer.

2003017, Sep 25, 2003

Nov 5, 2002

10/290070

Jonathan Ehly - San Diego CA, US
Jack Rubin - San Diego CA, US
Prem Sood - San Diego CA, US
Frank Polese - San Diego CA, US

H01L021/52

257/701000, 257/703000, 257/433000, 257/728000

An hermetically enhanced hybrid microelectronic package of injection moldable plastic and ceramic parts, wherein a gas barrier is formed onto surfaces of the plastic parts through metalization. Further, interface surfaces between the plastic parts and any metal or ceramic parts are further treated to accommodate hermetically stable low temperature bonding such as soldering at a temperature which does not exceed the temperature limits of the plastic.

2004005, Mar 18, 2004

Apr 2, 2003

10/406786

Cuong Pham - San Diego CA, US
Frank Polese - San Diego CA, US

G02B006/42

385/052000, 385/091000

An opto-electronic semiconductor microcircuit chip package where the chip is mounted upon a substrate or boat which in turn is mounted to the floor of the package upon a pool of reflowable solder. Actuator wires connect from package pads to pads on the boat. When the solder is liquefied, the entire package is placed in a magnetic field and current runs through actuator wires in order to force rotation of the boat according to Maxwell's equations for electric current in a magnetic field. The current is adjusted to obtain the proper torque on the boat to move it into alignment with an impinging fiber optic cable. Once in alignment, the solder is cooled to lock the boat in place and in alignment.

2004015, Aug 12, 2004

Oct 23, 2003

10/693014

Vlad Ocher - San Diego CA, US
Frank Polese - San Diego CA, US
Jack Rubin - San Diego CA, US

B22F003/24

419/028000

A shaped charged liner for oil well perforating is made from composite metal powder of clusters of pre-agglomerated particles of a denser metal with an agglutinating metal which is press-molded or tap-molded into a near net-shape liner preform which is then sintered to form a sintered body which is hot-coined or forged to form the final shape liner. The powder is formed by different density metal particles which are preclustered.

2013031, Dec 5, 2013

Mar 15, 2013

13/842465

Jonathan H. Harris - Scottsdale AZ, US
Frank J. Polese - San Diego CA, US
Robert J. Tesch - Phoenix AZ, US
Stephen P. Nootens - San Diego CA, US
Sorin Dinescu - San Diego CA, US
William L. Bradbury - San Diego CA, US

C04B 37/00
H05K 13/00

174 94 R, 156 60, 156280, 156 8912, 403272

A monolithic, substantially hermetic joining or bonding of two or more aluminum nitride (“AlN”) ceramic components is made by promoting transient liquid phase sintering near the contact areas between the components. In a first approach, AlN particles are combined with a rare earth oxide sintering additive such as yttrium oxide (Y2O3) in a joining paste can be applied between the joining surfaces of fired ceramic preformed components prior to final firing to weld the components together. In a second approach, the additive is added to green mixture, and the components having different shrinkage aspect ratios are mated and cofired in an atmosphere containing a partial pressure of the additive. The additive encourages wetting and diffusion of the liquid phases present on the surfaces of ceramic interface particles in the contact areas during final firing. Such processes can be used to form complex ceramic structures such as a ceramic susceptor used in integrated circuit fabrication. The components can have a plurality of embedded metallized electronic traces which can be electrically interconnected across the interface between the components.

5886407, Mar 23, 1999

May 28, 1996

8/654974

Frank J. Polese - San Diego CA
Vladimir Ocheretyansky - Santee CA

H01L 2310

257706

High density heatsinks for microcircuit packages are formed by first mold-pressing a composite powder of free-flowing spray-dried particles of an inexpensive high thermal conductivity material having a high coefficient of thermal expansion (CTE) such as copper and at least one other low CTE material such as tungsten, the proportions of which are adjusted to match the CTE of the microcircuit material. The pressed compacts are sintered in order to achieve an homogeneous distribution of the melting copper throughout the structure. A multilevel embodiment of the heatsink comprises two bonded layers of metals or composites having their coefficients of thermal expansion adjusted to match those of the semiconductor material and of any supporting structures respectively, wherein the second layer in contact with the supporting structure has a high CTE and the other has a lower CTE. Another embodiment provides for bonding a composite heatsink to a high thermal conductivity pedestal which mounts the microcircuit device, using sintering to shrink an aperture engaged by the pedestal.

5878322, Mar 2, 1999

Oct 10, 1997

8/947478

Frank J. Polese - San Diego CA

B22F 312

419 38

Heatsinks for microcircuit packages are formed by first mold-pressing a composite powder of free-flowing spray-dried particles of copper and at least one other denser material such as tungsten and/or molybdenum breakably agglutinated in nodules grouping sub-nodules of surface alloyed pairs of particles of each metal, the proportions of which are adjusted to match the thermal expansion characteristics of the microcircuit material. The pressed compacts are then heated in a sintering furnace at 1090. degree. C. to 1150. degree. C. in order to effect an homogeneous distribution of the melting copper throughout the structure. The process results in a readily usable component having good thermal conductivity and matched thermal expansion that requires no further machining.