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George Allen Carson DeceasedIndianapolis, IN

Known as:
George A Carson
Related to:
Donald Ray Tate 83 James H Carson 52 Collin Carson Beverly A Carson 58 Patricia A Carson 54 Robert Holowatuk 64 James E Carson 76 Sandra K Garmon 74 Danny W Garmon 79 Brian P Mccurry 52 Janet L Carson 76 Angela K Dill 49 James H Carson 51 Tammie Garmon 56

George Carson Phones & Addresses

Indianapolis, IN   

Ellettsville, IN   

Mesa, AZ   

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Mentions for George Allen Carson

Career records & work history

License Records

George E Carson

Licenses:
License #: 20637 - Expired
Expiration Date: Jun 30, 1984
Type: Civil Engineer

George Carson

Licenses:
License #: 059 - Expired
Category: Asbestos
Issued Date: Feb 22, 1989
Effective Date: Feb 22, 1989
Expiration Date: Feb 22, 1990
Type: Asbestos Project Designer

George Carson resumes & CV records

Resumes

George Carson Photo 50

Hancock Grade School Hancock High

Work:

Hancock Grade School Hancock High
Education:
Hancock Grade School Hancock High
George Carson Photo 51

George Carson

George Carson Photo 52

George Carson

George Carson Photo 53

George Carson

George Carson Photo 54

George Carson

George Carson Photo 55

George Carson

Publications & IP owners

Us Patents

Microelectronic Package Including A Polymer Encapsulated Die, And Method For Forming Same

US Patent:
5895229, Apr 20, 1999
Filed:
May 19, 1997
Appl. No.:
8/858756
Inventors:
Francis J. Carney - Gilbert AZ
George Amos Carson - Elk Grove Village IL
Phillip C. Celaya - Chandler AZ
Harry Fuerhaupter - Lombard IL
Frank Tim Jones - Chandler AZ
Donald H. Klosterman - Gilbert AZ
Cynthia M. Melton - Bolingbrook IL
James Howard Knapp - Chandler AZ
Keith E. Nelson - Tempe AZ
Assignee:
Motorola, Inc. - Schaumburg IL
International Classification:
H01L 2144
H01L 2148
US Classification:
438106
Abstract:
A microelectronic package (10) is formed and includes an integrated circuit die (12) attached to a substrate (14) by a plurality of solder bump interconnections (16) to form a preassembly (18). The integrated circuit die (12) has an active face (20) that faces the substrate (14) and is spaced apart therefrom by a gap (22). The integrated circuit die (12) also includes a back face (24) opposite the active face (20). The substrate (14) includes a die attach region (26) and a surrounding region (28) about the integrated circuit die (12). The solder bump interconnections (16) extend across the gap (22) and connect the integrated circuit die (12) and the substrate (14). A mold (30) is disposed about the preassembly (18) such that the mold (30) cooperates with the substrate (14) to define a mold cavity (32) that encloses the integrated circuit die (12). The mold (30) has a molding surface (34) that includes the surrounding region (28) and a mold surface (34) that faces the back face (24) and is spaced apart therefrom. A polymeric precursor (36) is dispensed into the mold cavity (32) and is formed against the molding surface (34) and the back face (24).

Microelectronic Package Including A Polymer Encapsulated Die

US Patent:
6093972, Jul 25, 2000
Filed:
May 3, 1999
Appl. No.:
9/304152
Inventors:
Francis J. Carney - Gilbert AZ
George Amos Carson - Elk Grove Village IL
Phillip C. Celaya - Chandler AZ
Harry Fuerhaupter - Lombard IL
Frank Tim Jones - Chandler AZ
Donald H. Klosterman - Gilbert AZ
Cynthia M. Melton - Bolingbrook IL
James Howard Knapp - Chandler AZ
Keith E. Nelson - Tempe AZ
Assignee:
Motorola, Inc. - Schaumburg IL
International Classification:
H01L 2331
US Classification:
257790
Abstract:
A microelectronic package (10) is formed and includes an integrated circuit die (12) attached to a substrate (14) by a plurality of solder bump interconnections (16) to form a preassembly (18). The integrated circuit die (12) has an active face (20) that faces the substrate (14) and is spaced apart therefrom by a gap (22). The integrated circuit die (12) also includes a back face (24) opposite the active face (20). The substrate (14) includes a die attach region (26) and a surrounding region (28) about the integrated circuit die (12). The solder bump interconnections (16) extend across the gap (22) and connect the integrated circuit die (12) and the substrate (14). A mold (30) is disposed about the preassembly (18) such that the mold (30) cooperates with the substrate (14) to define a mold cavity (32) that encloses the integrated circuit die (12). The mold (30) has a molding surface (34) that includes the surrounding region (28) and a mold surface (34) that faces the back face (24) and is spaced apart therefrom. A polymeric precursor (36) is dispensed into the mold cavity (32) and is formed against the molding surface (34) and the back face (24).

Amazon

George Carson Photo 60

Forever 22

Author:
Carson George
Publisher:
XLIBRIS
Binding:
Paperback
Pages:
244
ISBN #:
1499048718
EAN Code:
9781499048711
Walk with me while God connects the dots of my life, bringing those dots collectively to the point where He wants them to be. Walk with me as I learn to listen to my heart as instructed by the Spirit within as I learn to trust the voice of God. Walk with me after many morning cups of joe to help me ...

Isbn (Books And Publications)

Men And Centuries Of European Civilization

Author:
George Barr Carson
ISBN #:
0836921003

Possible Relatives

Cynthia K Carson  David M Carson  Dawn E Carson  Dean E Carson  Damon R Carson  Deborah Carson  Debra U Carson  George S Last  George N Johnson  George A Stamps 

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