George S Lychyk, 97518 Jackson Ave, River Forest, IL 60305

5077891, Jan 7, 1992

Apr 30, 1990

7/516841

George S. Lychyk - River Forest IL
Juzer Mohammed - Naperville IL

AG Communication Systems Corporation - Phoenix AZ

H05K 302

29847

A first method repairs the conductor traces of a printed circuit board assembly and includes the steps of first locating and isolating a break in an existing conductor trace. After the brake is isolated, an extrusion of a conductive resin material is applied, utilizing an extrusion delivery system. The conductive resin is then cured, hardening the conductive resin. A second method reworks the conductor traces of the printed circuit board assembly. This method severs an existing conductor path between existing electrical elements on the printed circuit board assembly and builds a conductor path to form a new connection. The method includes the steps of severing the conductor trace extending between the leads of a first and a second electrical element. Next, utilizing an extrusion delivery system, a conductive resin is extruded onto the printed circuit board assembly between the lead of the first electrical element and the lead of a third electrical element. Finally, the conductive resin is cured, thereby, hardening and fixing the conductive resin to the printed circuit board assembly.

4272140, Jun 9, 1981

Dec 19, 1979

6/105180

George S. Lychyk - River Forest IL
Wayne E. Neese - Hoffman Estates IL

GTE Automatic Electric Laboratories Incorporated - Northlake IL

H05K 112

339 17CF

An arrangement for mounting a dual-in-line packaged integrated circuit (DIP) to a thick/thin film circuit wherein a portion of each DIP lead is formed into a U-shape including a horizontal foot portion. The arrangement further includes a complementary socket which accepts the U-shaped DIP leads in opposite sides thereof. The socket is then soldered to either a thick/thin film circuit of a circuit board.