George C Wolf, 921413 Hutchins Dr, Kokomo, IN 46901

5128057, Jul 7, 1992

Sep 21, 1990

7/586080

Michael L. Bixenman - Old Hickory TN
George C. Wolf - Kokomo IN

Kyzen Corporation - Nashville TN
Delco Electronics Corporation - Kokomo IN

C09D 900
C11D 722
C11D 118
C11D 732

252162

The present invention offers an alternative to the chlorofluorocarbons which have been used in the cleaning industry. In particular, the present invention uses a solution having tetrahydrofurfuryl alcohol (THFA) and an activator.

5461008, Oct 24, 1995

May 26, 1994

8/249815

Richard M. Sutherland - Kokomo IN
Howard E. Harrell - Kokomo IN
Wayne A. Sozansky - Greentown IN
George C. Wolf - Kokomo IN

Delco Electronics Corporatinon - Kokomo IN

H01L 21302
H01L 21304
H01L 21463

437226

A method of suppressing adherence of silicon particles to IC bond pads, and corrosion thereof, during the dicing of silicon wafers by sawing. An anion of an organic acid is added to saw coolant water.

4781804, Nov 1, 1988

Mar 2, 1988

7/163006

George C. Wolf - Kokomo IN

Delco Electronics Corporation - Kokomo IN

C25F 100

2041415

This invention comprehends an improved method for uniformly loosening and removing the thin layer of mold flash which deposits on the surface of the metal lead frames during encapsulation of the silicon integrated circuit chips bonded to that metal lead frame surface. The disclosed method does not adversely effect the underlying metal material or the encapsulating plastic material enveloping the silicon integrated circuit chip. The disclosed method is electrolytic and employs (1) the chemical dissolving action of the stripping solution and (2) the percolating effect of the hydrogen gas generated during electrolysis of the water, to loosen the unwanted organic mold flash from the metal lead frame surface. The disclosed electrolytic method for removal of mold flash employs an aqueous based stripping solution preferably comprising; (a) about 75 grams of sodium hydroxide; (b) about 50 milliliters of duo-dectal sulfonic acid; (c) about 100 milliliters of diethylene glycol; (d) about 40 grams of sodium bicarbonate; (e) about 100 milliliters of ethoxylated furfuryl alcohol; (f) about 50 milliliters of tetrahydrofurfuryl alcohol; (g) about 1. 0 milligrams of a nonionic fluorinated alkyl ester surfactant; and (h) enough deionized water to yield about 1 liter of solution.

5308402, May 3, 1994

Mar 26, 1993

8/037528

Michael L. Bixenman - Old Hickory TN
George C. Wolf - Kokomo IN

Kyzen Corporation - Nashville TN
Delco Electronics Corporation - Kokomo IN

B08B 700
C11D 118
C11D 326
C11D 732

134 2

A method for removing flux residue from an electronic component using a solution having tetrahydrofurfuryl alcohol (THFA) and an activator. As activators, compounds of the formula ##STR1## are used, wherein R. sub. 1, R. sub. 2 and R. sub. 3 are independently hydrogen, C. sub. 1 -C. sub. 7 alkyl, C. sub. 5 -C. sub. 6 cycloalkyl, furanyl which can be substituted by C. sub. 1 -C. sub. 7 alkyl, tetrahydrofuranyl which can be substituted by C. sub. 1 -C. sub. 7 alkyl, pyrrolyl, pyrrolidinyl, benzyl which can be substituted by C. sub. 1 -C. sub. 7 alkyl, phenyl which can be substituted by C. sub. 1 -C. sub. 7 alkyl, C. sub. 1 -C. sub. 7 alkenyl, C. sub. 1 -C. sub. 7 alkenyl, furfuryl which can be substituted by C. sub. 1 -C. sub. 7 alkyl, or tetrahydrofurfuryl which can be substituted by C. sub. 1 -C. sub. 7 alkyl, wherein R. sub. 1, R. sub. 2 and R. sub.