Gregg B Monjeau, 36New Hamburg, NY

6682872, Jan 27, 2004

Jan 22, 2002

10/056245

Krishna G. Sachdev - Hopewell Junction NY
Michael Berger - New Paltz NY
Rebecca Y. Gorrell - Lagrangeville NY
Gregg B. Monjeau - Wallkill NY
Bernadette H. Perry - Wappingers Falls NY
Thomas A. Wassick - Lagrangeville NY

International Business Machines Corporation - Armonk NY

G03C 500

430311, 4302701, 430905, 430913, 4284247, 4284248, 428522

Radiation-curable compositions are provided for use in the fabrication of electronic components as passivation coatings; for defect repair in ceramic and thin film products by micropassivation in high circuit density electronic modules to allow product recovery; as a solder mask in electronic assembly processes; for use as protective coatings on printed circuit board (PCB) circuitry and electronic devices against mechanical damage and corrosion from exposure to the environment. The compositions are solvent-free, radiation-curable, preferably uv-curable, containing a polymer binder, which is a pre-formed thermoplastic or elastomeric polymer/oligomer, a monofunctional and/or bifunctional acrylic monomer, a multifunctional (more than 2 reactive groups) acrylated/methacrylated monomer, and a photoinitiator, where all the constituents are mutually miscible forming a homogeneous viscous blend without the addition of an organic solvent. The compositions may also contain inorganic fillers and/or nanoparticle fillers.

7608295, Oct 27, 2009

Mar 12, 2007

11/684679

Krishna G Sachdev - Hopewell Junction NY, US
Michael Berger - New Paltz NY, US
Gregg Monjeau - Wallkill NY, US
Robert A. Rita - Manlius NY, US
Kathleen M Wiley - Wappingers Falls NY, US

International Business Machines Corporation - Armonk NY

B05D 7/00
B32B 43/00

427140

A method to repair ceramic substrates is disclosed using a novel polyimide polymer which has high thermal stability, resistance to fluxes and flux residue cleaning solvents and processes, good mechanical properties, good adhesion to all contacting surfaces with low moisture uptake and good flow properties suitable for repairing chipped ceramic, filling deep trench or vias and writing passivation lines with automated process The polyimide polymer is made by reacting aromatic dianhydride and aromatic diamine monomers with a stoichiometric offset and end capping the resulting polymer when the reaction is completed. The preferred polyimide is made using a molar excess of diamine which is end-capped using an anhydride.

8188597, May 29, 2012

Sep 22, 2010

12/887809

Thomas E. Lombardi - Poughkeepsie NY, US
Donald Merte - Yorktown Heights NY, US
Gregg B. Monjeau - Wallkill NY, US
David L. Questad - Hopewell Junction NY, US
Son K. Tran - Endwell NY, US

International Business Machines Corporation - Armonk NY

H01L 23/34

257727, 257726, 257716, 257699, 257687, 257E23084

A fixture assembly and method of forming a chip assembly is provided. The fixture assembly includes a first plate having an opening sized to accommodate a chip mounted on a laminate. The fixture assembly further includes a second plate mated to the first plate by at least one mechanical fastening mechanism. The fixture assembly further includes a space defined by facing surfaces of the first plate and the second plate and confined by a raised stepped portion of at least one of the first plate and the second plate. The space is coincident with the opening. The space is sized and shaped such that the laminate is confined within the space and directly abuts the stepped portion and the facing surfaces of the first plate and the second plate to be confined in X, Y and Z directions.

8232636, Jul 31, 2012

Jan 26, 2010

12/693646

James N Humenik - Hopewell Junction NY, US
Sushumna Iruvanti - Hopewell Junction NY, US
Richard Langlois - Granby, CA
Hsichang Liu - Hopewell Junction NY, US
Govindarajan Natarajan - Hopewell Junction NY, US
Kamal K Sikka - Hopewell Junction NY, US
Hilton T Toy - Hopewell Junction NY, US
Jiantao Zheng - Hopewell Junction NY, US
Gregg B Monjeau - Hopewell Junction NY, US
Mark Kapfhammer - Hopewell Junction NY, US

International Business Machines Corporation - Armonk NY

H01L 23/10
H01L 23/34

257707, 257706, 438122

A frontside of a chip is bonded to a top surface of a chip carrier. Seal material is dispensed at a periphery of the top surface of the chip carrier. A solder TIM having a first side and a second side is provided. The first side of the TIM contacts a backside of the chip. A reflow is performed to melt the TIM. The second side of the TIM is bonded to a lid. The seal material is cured. The lid is attached to the top surface of the chip carrier. Backfill material is injected into a space between the top surface of the chip carrier and the lid. The backfill material abuts sides of the TIM. The backfill material is cured. TIM solder cracking and associated thermal degradation are mitigated.

2004013, Jul 8, 2004

Jan 8, 2003

10/338927

Krishna Sachdev - Hopewell Junction NY, US
Michael Berger - New Paltz NY, US
Gregg Monjeau - Wallkill NY, US
Robert Rita - Manlius NY, US
Kathleen Wiley - Wappingers Falls NY, US

International Business Machines Corporation - Armonk NY

B05D003/02
C08K003/00

524/606000, 427/140000, 427/385500

A method to repair ceramic substrates is disclosed using a novel polyimide polymer which has high thermal stability, resistance to fluxes and flux residue cleaning solvents and processes, good mechanical properties, good adhesion to all contacting surfaces with low moisture uptake and good flow properties suitable for repairing chipped ceramic, filling deep trench or vias and writing passivation lines with automated process The polyimide polymer is made by reacting aromatic dianhydride and aromatic diamine monomers with a stoichiometric offset and end capping the resulting polymer when the reaction is completed. The preferred polyimide is made using a molar excess of diamine which is end-capped using an anhydride.

2012018, Jul 26, 2012

Mar 16, 2012

13/422429

Thomas E. LOMBARDI - Poughkeepsie NY, US
Donald MERTE - Yorktown Heights NY, US
Gregg B. MONJEAU - Wallkill NY, US
David L. QUESTAD - Hopewell Junction NY, US
Son K. TRAN - Endwell NY, US

INTERNATIONAL BUSINESS MACHINES CORPORATION - Armonk NY

B23K 31/02
H01L 21/58

228135, 29 2501

A fixture assembly and method of forming a chip assembly is provided. The fixture assembly includes a first plate having an opening sized to accommodate a chip mounted on a laminate. The fixture assembly further includes a second plate mated to the first plate by at least one mechanical fastening mechanism. The fixture assembly further includes a space defined by facing surfaces of the first plate and the second plate and confined by a raised stepped portion of at least one of the first plate and the second plate. The space is coincident with the opening. The space is sized and shaped such that the laminate is confined within the space and directly abuts the stepped portion and the facing surfaces of the first plate and the second plate to be confined in X, Y and Z directions.

5935404, Aug 10, 1999

Jan 22, 1997

8/787071

Shaji Farooq - Hopewell Junction NY
Suryanarayana Kaja - Hopewell Junction NY
Hsichang Liu - Fishkill NY
Karen P. McLaughlin - Poughkeepsie NY
Gregg B. Monjeau - Wallkill NY
Kim Hulett Ruffing - Briarcliff Manor NY

International Business Machines Corporation - Armonk NY

C25D 502

205125

A method of performing electrochemistry processes on features and connectors of a substrate includes the application of a shorting layer across the connectors which are in electrical contact with the features, thereby shorting the features and creating an assemblage for which electricity is applied.

5284286, Feb 8, 1994

Oct 31, 1991

7/786201

Peter J. Brofman - Hopewell Junction NY
Shaji Farooq - Hopewell Junction NY
Kathleen A. Lidestri - Hopewell Junction NY
Gregg B. Monjeau - Wallkill NY
Karl J. Puttlitz - Wappingers Falls NY

International Business Machines Corporation - Armonk NY

B23K 1018

228 19

A porous metal block for selectively removing solder or braze from a substrate is disclosed. The block comprises a plurality of protrusions which absorb solder or braze through capillary action. The number and dimensions of the protrusions vary depending on the application. Also disclosed is a process for making such a block involving a unique two steps sintering process.