Harold P Kahn, 60410 Altamont St, Charlottesville, VA 22902

6465045, Oct 15, 2002

Oct 18, 2000

09/691706

Arthur H. Heuer - Cleveland OH
Harold Kahn - Lakewood OH
Jie Yang - Cleveland OH

Case Western Reserve University - Cleveland OH

C23C 1608

427255393, 427 58, 42725528

Multi-layer assemblies of polysilicon thin films having predetermined stress characteristics and techniques for forming such assemblies are disclosed. In particular, a multi-layer assembly of polysilicon thin film may be produced that has a stress level of zero, or substantially so. The multi-layer assemblies comprise at least one constituent thin film having a tensile stress and at least one constituent thin film having a compressive stress. The thin films forming the multi-layer assemblies may be disposed immediately adjacent to one another without the use of intermediate layers between the thin films.

6479166, Nov 12, 2002

May 1, 2000

09/561675

Arthur H. Heuer - Cleveland OH
Harold Kahn - Lakewood OH
Jie Yang - Woodbury CT
Stephen M. Phillips - Chesterland OH

Case Western Reserve University - Cleveland OH

H01L 2912

428620, 428636, 428446

Multi-layer assemblies of polysilicon thin films having predetermined stress characteristics and techniques for forming such assemblies are disclosed. In particular, a multi-layer assembly of polysilicon thin films may be produced that has a stress level of zero, or substantially so. The multi-layer assemblies comprise at least one constituent thin film having a tensile stress and at least one constituent thin film having a compressive stress. The thin films forming the multi-layer assemblies may be disposed immediately adjacent to one another without the use of intermediate layers between the thin films. Multi-layer assemblies exhibiting selectively determinable overall bending moments are also disclosed. Selective production of overall bending moments in microstructures enables manufacture of such structures with a wide array of geometrical configurations.

6610361, Aug 26, 2003

Nov 26, 1999

09/449790

Arthur H. Heuer - Cleveland OH
Harold Kahn - Lakewood OH
Jie Yang - Woodbury CT
Stephen M. Phillips - Chesterland OH

Case Western Reserve University - Cleveland OH

C23C 1624

42725518, 42725515, 4272557, 427402

Multi-layer assemblies of polysilicon thin films having predetermined stress characteristics and techniques for forming such assemblies are disclosed. In particular, a multi-layer assembly of polysilicon thin films may be produced that has a stress level of zero, or substantially so. The multi-layer assemblies comprise at least one constituent thin film having a tensile stress and at least one constituent thin film having a compressive stress. The thin films forming the multi-layer assemblies may be disposed immediately adjacent to one another without the use of intermediate layers between the thin films. Multi-layer assemblies exhibiting selectively determinable overall bending moments are also disclosed. Selective production of overall bending moments in microstructures enables manufacture of such structures with a wide array of geometrical configurations.

6268068, Jul 31, 2001

Mar 1, 1999

9/260168

Arthur H. Heuer - Cleveland OH
Harold Kahn - Lakewood OH
Jie Yang - Cleveland OH

Case Western Reserve University - Cleveland OH

B32B 1501

428620

Multi-layer assemblies of polysilicon thin films having predetermined stress characteristics and techniques for forming such assemblies are disclosed. In particular, a multi-layer assembly of polysilicon thin film may be produced that has a stress level of zero, or substantially so. The multi-layer assemblies comprise at least one constituent thin film having a tensile stress and at least one constituent thin film having a compressive stress. The thin films forming the multi-layer assemblies may be disposed immediately adjacent to one another without the use of intermediate layers between the thin films.

2020004, Feb 13, 2020

Sep 13, 2019

16/570292

- Cleveland OH, US
Frank Ernst - Cleveland OH, US
Harold Kahn - Charlottesville VA, US
Arthur Heuer - Cleveland OH, US

C23C 22/06
C23C 22/78
C23C 8/02
C23G 1/08
C23C 22/02
C23C 22/50
C23G 1/02

A process for surface activation or depassivation of an article, in particular an alloy, by immersion of the alloy in an aqueous acid solution. The surface activation methods of the present invention can be performed during a relatively short period of time and achieve reductions in production costs and provide environmental friendliness as compared to prior art processes. In a further embodiment, after surface activation, the article is immersed in a second liquid that prevents re-formation of a passivating oxide layer on the surface of the article. In a further embodiment the surface-activated alloys are subjected to surface engineering by a process that infuses carbon or nitrogen through the surface at a temperature sufficiently low to suppress precipitation of carbides or nitrides.

2017008, Mar 23, 2017

May 6, 2015

15/308223

- CLEVELAND OH, US
Frank Ernst - Cleveland OH, US
Harold Kahn - Charlottesville VA, US
Arthur Heuer - Cleveland OH, US

C23C 22/06
C23C 22/78

A process for surface activation or depassivation of an article, in particular an alloy, by immersion of the alloy in an aqueous acid solution. The surface activation methods of the present invention can be performed during a relatively short period of time and achieve reductions in production costs and provide environmental friendliness as compared to prior art processes. In a further embodiment, after surface activation, the article is immersed in a second liquid that prevents re-formation of a passivating oxide layer on the surface of the article. In a further embodiment the surface-activated alloys are subjected to surface engineering by a process that infuses carbon or nitrogen through the surface at a temperature sufficiently low to suppress precipitation of carbides or nitrides.