Harry Richard Kuder, 741317 Pico St, Fullerton, CA 92833
Harry Kuder Phones & Addresses
1317 Pico St, Fullerton, CA 92833 714-4478333
Anaheim, CA
Los Angeles, CA
Orange, CA
1317 Pico St, Fullerton, CA 92833
Mentions for Harry Richard Kuder
Publications & IP owners
Us Patents
Adhesion Promoters Containing Benzotriazoles
US Patent:
6930136, Aug 16, 2005
Filed:
Sep 28, 2001
Appl. No.:
09/966453
Inventors:
Osama M. Musa - Hillsborough NJ, US
Harry Richard Kuder - Fullerton CA, US
Harry Richard Kuder - Fullerton CA, US
Assignee:
National Starch and Chemical Investment Holding Corporation - New Castle DE
International Classification:
C08K005/24
US Classification:
524 91, 548257, 548260, 548261, 548517, 548518, 548519, 548523, 548524
Abstract:
Benzotriazole adducts contain a benzotriazole segment and a segment with a curable and polymerizable functionality, or an adhesion promoting functionality, particularly suitable for use on metal substrates or in adhesive, sealant or coating compositions for use in proximity to metal substrates.
Curable Compounds Containing Reactive Groups: Triazine/Isocyanurates, Cyanate Esters And Blocked Isocyanates
US Patent:
7057264, Jun 6, 2006
Filed:
Oct 18, 2002
Appl. No.:
10/274664
Inventors:
Renyi Wang - Los Angeles CA, US
Bing Wu - Shanghai, CN
Harry Richard Kuder - Fullerton CA, US
Bing Wu - Shanghai, CN
Harry Richard Kuder - Fullerton CA, US
Assignee:
National Starch and Chemical Investment Holding Corporation - New Castle DE
International Classification:
H01L 23/62
US Classification:
257666, 524236, 525 43
Abstract:
This invention is directed to compounds that can be used as antioxidants for exposed metal surfaces, and also as adhesion promoters for adhesive, coating or encapsulant resins that are applied to the metal substrates. These compounds include triazine or isocyanurate compounds bearing reactive or polymerizable functional groups, polyfunctional cyanate esters, and polyfunctional blocked-isocyanates.
Metal Salts Of Quinolinols And Quinolinol Derivatives In Curable Compositions
US Patent:
7468407, Dec 23, 2008
Filed:
Sep 26, 2005
Appl. No.:
11/235991
Inventors:
Osama M. Musa - Hillsborough NJ, US
Harry Richard Kuder - Fullerton CA, US
Harry Richard Kuder - Fullerton CA, US
Assignee:
National Starch and Chemical Investment Holding Copporation - New Castle DE
International Classification:
C08K 5/00
US Classification:
524 87, 524 99, 524100
Abstract:
Curable compositions exhibit improved adhesion and conductivity by the addition of a metal salt of 8-quinolinol or of an 8-quinolinol derivative as an adhesion and/or conductivity promoter. The metal salt of 8-quinolinol or of an 8-quinolinol derivative is formed by coordination with a metal selected from the group consisting of Cu, Be, Mg, Ca, Sr, Ba, Zn, Cd, Al, Ga, In, TI, Yt, La, Pb, Sb, Bi, Cr, Mo, Mn, Fe, Co, Ni, Pd, Ce, and Pr. Examples of quinolinol derivative salts have the structures:.
Aceto Acetonate And Related Compounds As Adhesion Promoters
US Patent:
2003007, Apr 17, 2003
Filed:
Sep 28, 2001
Appl. No.:
09/966135
Inventors:
Osama Musa - Hillsborough NJ, US
Harry Kuder - Fullerton CA, US
Harry Kuder - Fullerton CA, US
International Classification:
B32B015/08
US Classification:
428/457000, 428/626000
Abstract:
Curable compositions containing aceto acetonate compounds or related compounds can be used to promote adhesion to metal substrates, either by coating on the metal substrate or by addition to the adhesive formulation.
Dual Cure B-Stageable Adhesive For Die Attach
US Patent:
2003012, Jul 10, 2003
Filed:
Dec 14, 2001
Appl. No.:
10/016844
Inventors:
Kevin Becker - Cerritos CA, US
Harry Kuder - Fullerton CA, US
Harry Kuder - Fullerton CA, US
International Classification:
B32B031/26
US Classification:
428/620000, 156/307100, 525/010000
Abstract:
Curable compositions that comprise two separately curable chemistry sets or compositions with curing temperatures sufficiently separated so that one chemistry composition can be fully cured during a B-staging process, and the second can be left uncured until a final cure is desired, such as at the final attach of a semiconductor chip to a substrate.
Semiconductor Assembly Using Dual-Cure Die Attach Adhesive
US Patent:
2005023, Oct 27, 2005
Filed:
Jun 27, 2005
Appl. No.:
11/168037
Inventors:
Kevin Becker - Cerritos CA, US
Harry Kuder - Fullerton CA, US
Harry Kuder - Fullerton CA, US
International Classification:
B32B027/38
H01L021/48
H01L021/48
US Classification:
428413000, 438106000
Abstract:
A semiconductor assembly comprising a semiconductor chip on a substrate is adhered to the substrate using a dual cure B-stageable adhesive comprising two chemical compositions, (i) a first composition comprising a curable monomeric or polymeric compound or resin and a curing initiator or curing agent for that compound or resin, and (ii) a second composition comprising a monomeric or polymeric compound or resin and a curing initiator or curing agent for that compound or resin, in which the curing temperatures or curing temperature ranges are sufficiently separated to allow the composition with the lower curing temperature, the first composition, to cure without curing the composition with the higher curing temperature, the second composition.
Silver Salts Of Dicarboxcylic Acids For Precious Metal Powder And Flakes
US Patent:
2006028, Dec 28, 2006
Filed:
Jun 23, 2005
Appl. No.:
11/159336
Inventors:
Kirk McNeilly - North Scituate RI, US
Brian LaCroix - Attleboro MA, US
Harry Kuder - Fullerton CA, US
Brian LaCroix - Attleboro MA, US
Harry Kuder - Fullerton CA, US
International Classification:
H01B 1/12
US Classification:
252500000
Abstract:
Noble metal (e.g., silver) powder and/or flake is at least partially coated with a silver salt lubricant, and is prepared by milling a noble metal powder (e.g., silver) in the presence of a silver salt of dicarboxylic acid lubricant.
Metal Salts Of Organic Acids As Conductivity Promoters
US Patent:
2006028, Dec 28, 2006
Filed:
Jun 23, 2005
Appl. No.:
11/166860
Inventors:
Gordon Emmerson - Seal Beach CA, US
Harry Kuder - Fullerton CA, US
Osama Musa - Hillsborough NJ, US
Harry Kuder - Fullerton CA, US
Osama Musa - Hillsborough NJ, US
International Classification:
H01B 1/12
US Classification:
252500000
Abstract:
A conductive resin composition containing a curable resin, such as an adhesive resin, and a conductive metal filler, has improved conductivity through the addition of a metal salt of a carboxylic acid to the composition.
NOTICE: You may not use BackgroundCheck or the information it provides to make decisions about employment, credit, housing or any other purpose that would require Fair Credit Reporting Act (FCRA) compliance. BackgroundCheck is not a Consumer Reporting Agency (CRA) as defined by the FCRA and does not provide consumer reports.