Hugh Li resumes & CV records
Resumes
Hugh H Y Li23 Kingsbury Ct, Alameda, CA 94501
Hugh Li Phones & Addresses
23 Kingsbury Ct, Alameda, CA 94501
Berkeley, CA
Fremont, CA
101 Lombard St, San Francisco, CA 94111 415-7887247
101 Lombard St #409E, San Francisco, CA 94111
121 Tiffany Ave, San Francisco, CA 94110 415-5193229
Social networks
Hugh H Y Li
Linkedin
Work
Position:
Clerical/White Collar
Education
Degree:
High school graduate or higher
Emails
Mentions for Hugh H Y Li
Publications & IP owners
Us Patents
Bond Pad And Wire Bond
US Patent:
6610601, Aug 26, 2003
Filed:
Jan 4, 2002
Appl. No.:
10/038980
Inventors:
Hugh Li - Santa Clara CA
Diane J. Hymes - San Jose CA
Diane J. Hymes - San Jose CA
Assignee:
Lam Research Corporation - Fremont CA
International Classification:
H01L 2144
US Classification:
438687, 438681, 438688
Abstract:
A method is described comprising removing an oxide from a surface and then commencing application of a passivation layer to the surface within 5 seconds of the oxide removal. The surface may be a copper surface which may further comprise a bonding pad surface. Removing the oxide may further comprise applying a solution comprising citric acid or hydrochloric acid. Applying the passivation layer may further comprise applying a solution comprising a member of the azole family where the azole family member may further comprise BTA. The method may also further comprise completely applying the passivation layer 35 seconds after commencing its application.
Method For Enabling Conventional Wire Bonding To Copper-Based Bond Pad Features
US Patent:
6358847, Mar 19, 2002
Filed:
Mar 31, 1999
Appl. No.:
09/282596
Inventors:
Hugh Li - Santa Clara CA
Diane J. Hymes - San Jose CA
Diane J. Hymes - San Jose CA
Assignee:
Lam Research Corporation - Fremont CA
International Classification:
H01L 2144
US Classification:
438687, 438692, 438693, 438745, 438747, 438754
Abstract:
A method is described comprising removing an oxide from a surface and then commencing application of a passivation layer to the surface within 5 seconds of the oxide removal. The surface may be a copper surface which may further comprise a bonding pad surface. Removing the oxide may further comprise applying a solution comprising citric acid or hydrochloric acid. Applying the passivation layer may further comprise applying a solution comprising a member of the azole family where the azole family member may further comprise BTA. The method may also further comprise completely applying the passivation layer 35 seconds after commencing its application.
Possible Relatives
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