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Icko T Iben, 663305 Mauricia Ave, Santa Clara, CA 95051

Known as:
Icko Timothy Iben Icko E Iben Icko Eric Timothy Iben Icko J Iben Icko R Iben Eric Timothy Iben Icko Icko Tiben Icko Eric Y Icwko Iben Iben Icko
Related to:
Jeffery E Iben 59

Icko Iben Phones & Addresses

3305 Mauricia Ave, Santa Clara, CA 95051    408-7612596   

San Jose, CA   

Sacramento, CA   

Champaign, IL   

La Jolla, CA   

Cupertino, CA   

Glenville, NY   

Summit, NJ   

San Diego, CA   

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Icko T Iben

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Work

Company: General electric corporate research& development Sep 1991 to Aug 1997 Position: Staff scientist

Education

Degree: Doctorates, Doctor of Philosophy School / High School: Biophysics University of Illinois 1988 Specialities: Physics

Skills

Project Management • Integration • Management • Sql • Java • Software Development • Microsoft Office • Linux • Requirements Analysis • Testing • Storage Solutions • Reliability • Reliability Engineering • Esd Control • Rf Engineering • Failure Analysis • Quality Assurance • Product R&D • R&D • Thermodynamics

Industries

Information Technology And Services
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Icko Iben resumes & CV records

Resumes

Icko Iben Photo 10

Senior Development Engineer

Location:
15 Polk Ct, North Potomac, MD 20878
Industry:
Information Technology And Services
Work:
General Electric Corporate Research& Development Sep 1991 - Aug 1997
Staff Scientist Ibm Sep 1991 - Aug 1997
Senior Development Engineer Ge Sep 1991 - Jul 1997
Staff Scientist At&T Bell Laboratories Jun 1988 - Sep 1991
Post Doctoral Research Fellow At&T Jun 1988 - Sep 1991
Post Doctoral Research Fellow University of Illinois at Urbana-Champaign May 1982 - May 1988
Phd Candidate and Research Assistant University of Illinois May 1982 - May 1988
Research and Teaching Assistant Hungarian Biological Center & National Academy of Science Mar 1985 - Jul 1985
Visiting Scientist Hungarianbiologicalcenter&Nationalacademy of Science Feb 1985 - Jul 1985
Visiting Researcher Watkins-Johnson Jul 1980 - Jul 1981
Project Engineer
Education:
Biophysics University of Illinois 1988
Doctorates, Doctor of Philosophy, Physics University of Illinois at Urbana - Champaign 1981 - 1988
Doctorates, Doctor of Philosophy, Physics, Philosophy University of Illinois System 1982
Master of Science, Masters, Physics University of California, Berkeley 1975 - 1980
Bachelors, Bachelor of Arts, Bachelor of Science, Physics
Skills:
Project Management, Integration, Management, Sql, Java, Software Development, Microsoft Office, Linux, Requirements Analysis, Testing, Storage Solutions, Reliability, Reliability Engineering, Esd Control, Rf Engineering, Failure Analysis, Quality Assurance, Product R&D, R&D, Thermodynamics

Publications & IP owners

Wikipedia

Icko Iben Photo 11

Icko Iben

Icko Iben, Jr. is an American astronomer and a Distinguished Professor at the University of Illinois at Urbana-Champaign. Iben received his PhD from the University of Illinois in 1958.

Us Patents

Method And Apparatus For Embedding A Chip In A Substrate To Form A Composite Air Bearing Surface

US Patent:
7082013, Jul 25, 2006
Filed:
May 6, 2003
Appl. No.:
10/431247
Inventors:
Annayya P. Deshpande - San Jose CA, US
Hoodin Hamidi - Walnut Creek CA, US
Icko E. Iben - Santa Clara CA, US
Kevin Thuy Luong - San Jose CA, US
Sassan K. Shahidi - San Jose CA, US
Abel J. Taina - San Jose CA, US
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
G11B 17/32
US Classification:
3602347
Abstract:
A method and apparatus for embedding a chip in a substrate to form a composite air bearing surface. An example of the method includes securing the substrate in a fixed position, aligning the chip in a first direction with a chip receiving slot in the substrate, depositing adhesive in the chip receiving slot, and aligning the chip in a second direction with the chip receiving slot. The chip is pushed into the adhesive in the chip receiving slot until the air bearing surface of the chip is substantially at a desired protrusion in a third direction in relation to the air bearing surface of the substrate. The adhesive is cured with the air bearing surface of the chip substantially at the desired protrusion in the third direction, and with the chip substantially aligned in the first and second directions with chip receiving slot.

Method And Apparatus For Providing Compressive Connection With Electrostatic Discharge Dissipative Properties

US Patent:
7248455, Jul 24, 2007
Filed:
Oct 31, 2003
Appl. No.:
10/698740
Inventors:
William L. Brodsky - Binghamton NY, US
Icko E. Iben - Santa Clara CA, US
Ho-Yiu Lam - Mountain View CA, US
George G. Zamora - Vail AZ, US
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H02H 9/00
US Classification:
361220, 361 56
Abstract:
A method and apparatus for providing compressive connection with electrostatic discharge dissipative properties is disclosed. A compression connector is formed having an elastomeric material modified to provide a dissipative member, an electrostatically dissipative base member, and a connection to a ground to dissipate the charge generated when tension is applied to or released from the elastomer.

System And Method For Deconvolution Of Multiple Data Tracks

US Patent:
7253986, Aug 7, 2007
Filed:
Aug 30, 2005
Appl. No.:
11/215602
Inventors:
David Berman - San Jose CA, US
W. Stanley Czarnecki - Palo Alto CA, US
Icko F. Iben - Santa Clara CA, US
Wayne Isami Imaino - San Jose CA, US
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
G11B 5/58
US Classification:
360 7701
Abstract:
A system and method for reading a magnetic medium having a data band thereon, the data band comprising a plurality of simultaneously written data tracks and at least one alignment band. The system in one embodiment includes a plurality of adjacent readers for simultaneously reading the data tracks. At least one reader is also present for reading the at least one alignment band. A mechanism determines a fractional overlap of each reader on the data tracks based on readback of the alignment band. A mechanism extracts data from readback of the data tracks based at least in part on the fractional overlap.

Tape Head Read/Write Module

US Patent:
7274536, Sep 25, 2007
Filed:
Jun 7, 2006
Appl. No.:
11/449443
Inventors:
Annayya P. Deshpande - San Jose CA, US
Hoodin Hamidi - Walnut Creek CA, US
Icko E. Iben - Santa Clara CA, US
Kevin Thuy Luong - San Jose CA, US
Sassan K. Shahidi - San Jose CA, US
Abel J. Taina - San Jose CA, US
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
G11B 5/127
US Classification:
3602347
Abstract:
A tape head read/write module that has a composite air bearing surface, and a method and apparatus for embedding a chip in a substrate to form a composite air bearing surface. An example of the module includes a substrate that has an air bearing surface, a front, a back, and a chip receiving slot. The air bearing surface of the substrate has a first portion adjoining a first side of the chip receiving slot, and a second portion adjoining a second side of the chip receiving slot. The module also includes a chip that has an air bearing surface, a bottom surface, a front, a back, and active elements. The active elements are located proximate the front of the chip. The chip is positioned in the chip receiving slot in the substrate, with the air bearing surface of the chip substantially aligned with the air bearing surface of the substrate.

Tape Head Read/Write Module

US Patent:
7492552, Feb 17, 2009
Filed:
Aug 4, 2007
Appl. No.:
11/833973
Inventors:
Annayya P. Deshpande - San Jose CA, US
Hoodin Hamidi - Walnut Creek CA, US
Icko E. Iben - Santa Clara CA, US
Kevin Thuy Luong - San Jose CA, US
Sassan K. Shahidi - San Jose CA, US
Abel J. Taina - San Jose CA, US
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
G11B 5/127
US Classification:
3602344
Abstract:
A tape head read/write module that has a composite air bearing surface, and a method and apparatus for embedding a chip in a substrate to form a composite air bearing surface. An example of the module includes a substrate that has an air bearing surface, a front, a back, and a chip receiving slot. The air bearing surface of the substrate has a first portion adjoining a first side of the chip receiving slot, and a second portion adjoining a second side of the chip receiving slot. The module also includes a chip that has an air bearing surface, a bottom surface, a front, a back, and active elements. The active elements are located proximate the front of the chip. The chip is positioned in the chip receiving slot in the substrate, with the air bearing surface of the chip substantially aligned with the air bearing surface of the substrate.

Electrically Tunable Resistor And Related Methods

US Patent:
7723200, May 25, 2010
Filed:
Mar 27, 2007
Appl. No.:
11/691755
Inventors:
Icko E. Iben - Santa Clara CA, US
Alvin W. Strong - Essex Junction VT, US
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H01L 27/01
H01L 29/00
US Classification:
438385, 438469, 257 48, 257536
Abstract:
An electrically tunable resistor and related methods are disclosed. In one embodiment, the resistor includes a first resistive layer, at least one second resistive layer, and an intermediate interdiffused layer of the first resistive layer and the at least one second resistive layer. One method may include providing a first plurality of layers of different materials surrounded by at least one insulating layer, and passing a current pulse through the first plurality of layers to affect a conductivity structure of the first plurality of layers in order to obtain a first predetermined resistance value for the resistor.

Method For Reading Data From A Magnetic Recordign Tape

US Patent:
7724459, May 25, 2010
Filed:
Sep 5, 2008
Appl. No.:
12/205452
Inventors:
W. Stanley Czarnecki - Palo Alto CA, US
Icko E. Iben - Santa Clara CA, US
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
G11B 15/12
G11B 5/58
US Classification:
360 63, 360 7701
Abstract:
A method for reading data from a magnetic recording tape having multiple adjacent data tracks according to one embodiment includes simultaneously detecting signals from a plurality of read devices, at least some of the read devices being positioned over multiple data tracks while other of the adjacent read devices are positioned over single data tracks; determining which of the read devices is positioned over a single data track; and simultaneously reading data from the data tracks using only those read devices over the single data tracks. A method for reading and writing data to a magnetic recording tape according to another embodiment includes simultaneously writing data tracks to a magnetic medium; and simultaneously reading the data tracks on the magnetic medium using a plurality of adjacent read devices; wherein the number of the adjacent read devices is at least twice the number of the adjacent write devices.

Process, Apparatus, And System For Adhesive Bond Strength Recovery Using Joule Heating

US Patent:
2004012, Jul 8, 2004
Filed:
Jan 8, 2003
Appl. No.:
10/338319
Inventors:
Icko Iben - Santa Clara CA, US
Assignee:
INTERNATIONAL BUSINESS MACHINES CORPORATION - Armonk NY
International Classification:
B32B031/00
US Classification:
156/064000, 156/359000
Abstract:
A process, apparatus, and system are presented for adhesive bond strength recovery in a bonded system, which may be an electronic device, such as, a magnetic drive or magnetic disk drive. The adhesive bond strength of an adhesive bonding material degrades over time and under certain ambient conditions, such as humidity. The process, apparatus, and system are designed to recover at least a portion of the initial adhesive bond strength through the application of joule heating. The adhesive bonding material, and possibly the materials bonded by the adhesive bonding material, is heated via an embedded heat source within the bonded system. The embedded heat source receives electric power from a controlled power source that selectively applies power to achieve optimum heating and adhesive bond strength recovery consistent with a characterization of the bonded system, heat source, and adhesive bonding material.

Isbn (Books And Publications)

Physical Processes In Red Giants: Proceedings Of The Second Workshop, Held At The Ettore Majorana Centre For Scientific Culture, Advanced School Of Astronomy, In Erice, Sicily, Italy, September 3-13,

Author:
Icko Iben
ISBN #:
9027712840

Possible Relatives

Weihong Iben 

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