BackgroundCheck.run
Search For

Imtiaz H Chaudhry, 5015002 15Th St, Vancouver, WA 98685

Imtiaz Chaudhry Phones & Addresses

15002 15Th St, Vancouver, WA 98685    360-5718601   

14713 2Nd St, Vancouver, WA 98685    360-5718469    360-5718601   

Costa Mesa, CA   

Longview, WA   

Lake Forest, CA   

Mentions for Imtiaz H Chaudhry

Career records & work history

Lawyers & Attorneys

Imtiaz Chaudhry Photo 1

Imtiaz Chaudhry - Lawyer

ISLN:
923101358
Admitted:
2013

Medicine Doctors

Imtiaz A. Chaudhry

Specialties:
Ophthalmology
Work:
Houston Oculoplastics
6400 Fannin St STE 2220, Houston, TX 77030
832-8683938 (phone) 713-7901130 (fax)
Education:
Medical School
University of Utah School of Medicine
Graduated: 1994
Procedures:
Eye Muscle Surgery, Corneal Surgery, Eyeglass Fitting, Ophthalmological Exam, Skull/Facial Bone Fractures and Dislocations
Conditions:
Orbital Infection, Retinal Detachments, Acute Conjunctivitis, Cataract, Diabetic Retinopathy, Glaucoma, Keratitis
Languages:
Arabic, English, Spanish
Description:
Dr. Chaudhry graduated from the University of Utah School of Medicine in 1994. He works in Houston, TX and specializes in Ophthalmology. Dr. Chaudhry is affiliated with Houston Methodist Hospital, Memorial Hermann Texas Medical Center, St Joseph Medical Center and Texas Childrens Hospital.

Imtiaz M. Chaudhry

Specialties:
Ophthalmology
Work:
Eye See Lazer Eye Care
2301 E Allegheny Ave, Philadelphia, PA 19134
215-6394500 (phone) 215-2910810 (fax)
Education:
Medical School
Thomas Jefferson University, Jefferson Medical College
Graduated: 2004
Procedures:
Retinal Detachment Repair, Corneal Surgery, Destruction of Lesion of Retina and Choroid, Lens and Cataract Procedures, Ophthalmological Exam
Conditions:
Acute Conjunctivitis, Diabetic Retinopathy, Keratitis, Orbital Infection, Primary Angle-Closure Glaucoma, Retinal Detachments, Cataract, Glaucoma, Macular Degeneration
Languages:
English, Spanish
Description:
Dr. Chaudhry graduated from the Thomas Jefferson University, Jefferson Medical College in 2004. He works in Philadelphia, PA and specializes in Ophthalmology. Dr. Chaudhry is affiliated with Aria Health Torresdale Campus, Jeanes Hospital, St Mary Medical Center and Temple University Hospital.

Imtiaz Chaudhry resumes & CV records

Resumes

Imtiaz Chaudhry Photo 29

Owner, E&I Ince

Position:
Owner at E&I Ince
Location:
Portland, Oregon Area
Industry:
Hospitality
Work:
E&I Ince
Owner
Education:
California State University-Fullerton
Imtiaz Chaudhry Photo 30

Imtiaz Chaudhry

Imtiaz Chaudhry Photo 31

Imtiaz Chaudhry

Imtiaz Chaudhry Photo 32

Imtiaz Chaudhry

Publications & IP owners

Us Patents

Method For Making An Enhanced Die-Up Ball Grid Array Package With Two Substrates

US Patent:
6887741, May 3, 2005
Filed:
Dec 9, 2003
Appl. No.:
10/730093
Inventors:
Sam Ziqun Zhao - Irvine CA, US
Imtiaz Chaudhry - Rancho Santa Margarita CA, US
Assignee:
Broadcom Corporation - Irvine CA
International Classification:
H01L021/44
H01L021/48
H01L021/50
US Classification:
438125
Abstract:
An electrically and thermally enhanced die-up ball grid array (BGA) package is described. An integrated circuit (IC) package includes a first substrate, a second substrate, and a stiffener. A surface of the first substrate is attached to a first surface of the stiffener. A surface of the second substrate is attached to a second surface of the stiffener. An IC die may be attached to a second surface of the second substrate or to the second surface of the stiffener. Additional electronic devices may be attached to the second surface of the second substrate.

Method For Assembling A Ball Grid Array Package With Two Substrates

US Patent:
7312108, Dec 25, 2007
Filed:
Mar 11, 2005
Appl. No.:
11/076873
Inventors:
Sam Zinqun Zhao - Irvine CA, US
Imtiaz Chaudhry - Rancho Santa Margarita CA, US
Assignee:
Broadcom Corporation - Irvine CA
International Classification:
H01L 21/00
US Classification:
438125, 257E21505
Abstract:
An electrically and thermally enhanced die-up ball grid array (BGA) package is described. An integrated circuit (IC) package includes a first substrate, a second substrate, and a stiffener. A surface of the first substrate is attached to a first surface of the stiffener. A surface of the second substrate is attached to a second surface of the stiffener. An IC die may be attached to a second surface of the second substrate or to the second surface of the stiffener. Additional electronic devices may be attached to the second surface of the second substrate.

Enhanced Die-Up Ball Grid Array Package With Two Substrates And Method For Making The Same

US Patent:
2003017, Sep 25, 2003
Filed:
Mar 21, 2002
Appl. No.:
10/101751
Inventors:
Sam Zhao - Irvine CA, US
Imtiaz Chaudhry - Rancho Santa Margarita CA, US
Assignee:
Broadcom Corporation
International Classification:
H05K007/06
US Classification:
361/760000, 361/792000, 361/783000, 174/260000, 257/784000, 257/700000, 438/125000
Abstract:
An electrically and thermally enhanced die-up ball grid array (BGA) package is described. An integrated circuit (IC) package includes a first substrate, a second substrate, and a stiffener. A surface of the first substrate is attached to a first surface of the stiffener. A surface of the second substrate is attached to a second surface of the stiffener. An IC die may be attached to a second surface of the second substrate or to the second surface of the stiffener. Additional electronic devices may be attached to the second surface of the second substrate.

NOTICE: You may not use BackgroundCheck or the information it provides to make decisions about employment, credit, housing or any other purpose that would require Fair Credit Reporting Act (FCRA) compliance. BackgroundCheck is not a Consumer Reporting Agency (CRA) as defined by the FCRA and does not provide consumer reports.