James Henry Herbold, 80965 Bluff St, Marseilles, IL 61341
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965 Bluff St, Marseilles, IL 61341 815-7952575
750 Lily Cache Ln, Bolingbrook, IL 60440
Spearfish, SD
San Antonio, TX
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Us Patents
Vertical Removal Of Excess Solder From A Circuit Substrate
US Patent:
7353983, Apr 8, 2008
Filed:
Oct 28, 2003
Appl. No.:
10/695187
Inventors:
William C. Weigler - New Braunfels TX, US
Robert Babula - New Braunfels TX, US
James E. Herbold - Gonzales TX, US
Thomas P. Gall - Northbrook IL, US
Steven G. Sharkey - Island Park IL, US
Robert Babula - New Braunfels TX, US
James E. Herbold - Gonzales TX, US
Thomas P. Gall - Northbrook IL, US
Steven G. Sharkey - Island Park IL, US
Assignee:
Temic Automotive of North America, Inc. - Deer Park IL
International Classification:
B23K 1/018
US Classification:
228264, 228119
Abstract:
A method for vertical removal of excess solder from a circuit substrate includes the use of a sacrificial circuit substrate with a plurality of pads and vias that are solder-wettable. The pads and vias of the sacrificial circuit substrate are placed in vertical proximity to the excess solder of the circuit substrate. The excess solder is heated until it is liquid, wherein the excess solder is wicked vertically onto the pads and into the vias of the sacrificial circuit substrate. Thereafter, the sacrificial circuit substrate is lifted from the proximity of the circuit substrate while the solder is in a liquid, taking the excess solder with it but leaving a predetermined amount on the circuit substrate.
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