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Janet A Patterson, 81309 Center Pointe Dr, Cary, NC 27513

Known as:
Janet Ardella Patterson Janet F Patterson Janet C Patterson Janet A Cpatterson Janet A Currie Janette A Patterson Patterson Patterson Janet Apatterson Patterson Janet
Related to:
Ashley Houser 37 Sakena Jwan Patterson 49 John W Lowrance 59 Carrie M Patterson 76 Orus Patterson 76 Ricardo A Washington 53 Michele R Patterson 56 John N Patterson Anne Wilbourne Lowrance 58 Shuwanda A Patterson 44 Daryl C Patterson 60

Janet Patterson Phones & Addresses

309 Center Pointe Dr, Cary, NC 27513    919-4682050   

Pittsburgh, PA   

Lemon Grove, CA   

Cincinnati, OH   

Squaw Valley, CA   

Wade, NC   

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Mentions for Janet A Patterson

Career records & work history

Lawyers & Attorneys

Janet Patterson Photo 1

Janet Patterson - Lawyer

Specialties:
Labor Law, Administrative Law, Employment Law
ISLN:
904557617
Admitted:
1988
Law School:
University of British Columbia, LL.B., 1987

Medicine Doctors

Janet L. Patterson

Specialties:
Neurodevelopmental Disabilities, Pediatrics
Work:
University Of Illinois College Of Medicine At Peoria The Ray & Kathy Lahood Center Cerebal Palsy
507 E Armstrong Ave, Peoria, IL 61603
309-6816960 (phone) 309-6816965 (fax)
Education:
Medical School
Loyola University Chicago Stritch School of Medicine
Graduated: 1982
Procedures:
Psychological and Neuropsychological Tests
Conditions:
Anxiety Phobic Disorders, Attention Deficit Disorder (ADD), Acute Upper Respiratory Tract Infections, Allergic Rhinitis, Autism, Bronchial Asthma, Hemophilia A or B
Languages:
English
Description:
Dr. Patterson graduated from the Loyola University Chicago Stritch School of Medicine in 1982. She works in Peoria, IL and specializes in Neurodevelopmental Disabilities and Pediatrics. Dr. Patterson is affiliated with OSF Saint Francis Medical Center and Unitypoint Health Proctor Hospital.

License Records

Janet Kathleen Patterson

Licenses:
License #: 8369 - Expired
Category: Pharmacy
Issued Date: Jun 15, 1973
Effective Date: Jan 2, 1996
Type: Pharmacist

Janet Patterson resumes & CV records

Resumes

Janet Patterson Photo 21

Retired Senior Manager, Quality Review At Drug Safety Alliance; A United Drug Company

Location:
Raleigh-Durham, North Carolina Area
Industry:
Pharmaceuticals
Education:
Carnegie Mellon University 1983 - 1984
Master of Public Management, Public Management
Janet Patterson Photo 22

Paralegal

Position:
Paralegal at Jennings & Associates, LTD.
Location:
Raleigh-Durham, North Carolina Area
Industry:
Legal Services
Work:
Jennings & Associates, LTD. since Aug 2012
Paralegal Cox & Tillery, P.A. Feb 2001 - Jun 2011
Paralegal Vaiden P. Kendrick Feb 1999 - Feb 2001
Paralegal Pestine & Associates 1990 - 1992
Paralegal
Education:
Loyola University of Chicago (Mallinckrodt Campus - Wilmette, IL) 1987 - 1990
Associate's degree, Paralegal Studies/ABA Paralegal Certificate John T. Hoggard High School 1982 - 1986
Janet Patterson Photo 23

Continuing And Distance Education

Position:
Senior Conference Planner at Penn State University
Location:
Howard, Pennsylvania
Industry:
Higher Education
Work:
Penn State University
Senior Conference Planner
Education:
Penn State University 1989 - 2004
Janet Patterson Photo 24

Janet Patterson

Location:
United States
Janet Patterson Photo 25

Janet Patterson

Location:
United States
Janet Patterson Photo 26

Executive Assistant At Altus Pharmaceuticals

Position:
Executive Assistant at Altus Pharmaceuticals
Location:
United States
Industry:
Biotechnology
Work:
Altus Pharmaceuticals
Executive Assistant
Janet Patterson Photo 27

Manager, Quality Review At Drug Safety Alliance

Position:
Manager, Quality Review at Drug Safety Alliance
Location:
Raleigh-Durham, North Carolina Area
Industry:
Pharmaceuticals
Work:
Drug Safety Alliance
Manager, Quality Review
Janet Patterson Photo 28

Janet Patterson

Location:
United States

Publications & IP owners

Us Patents

Radiation Shielding Of Three Dimensional Multi-Chip Modules

US Patent:
6613978, Sep 2, 2003
Filed:
Jun 9, 2001
Appl. No.:
09/878683
Inventors:
David R. Czjakowski - Encinitas CA
Neil Eggleston - San Diego CA
Janet S. Patterson - San Diego CA
Assignee:
Maxwell Technologies, Inc. - San Diego CA
International Classification:
H05K 900
US Classification:
174 35MS, 174 35 R, 257660, 361816
Abstract:
A method for making two sided Multi-Chip Modules (MCMs) that will allow most commercially available integrated circuits to meet the thermal and radiation hazards of the spacecraft environment using integrated package shielding technology. The invention describes the technology and methodology to manufacture MCMs that are radiation-hardened, structurally and thermally stable using 3-dimensional techniques allowing for high density integrated circuit packaging in a radiation hardened package.

Radiation Shielding Of Three Dimensional Multi-Chip Modules

US Patent:
6858795, Feb 22, 2005
Filed:
Aug 18, 2003
Appl. No.:
10/643250
Inventors:
David R. Czjakowski - Encinitas CA, US
Neil Eggleston - San Diego CA, US
Janet S. Patterson - San Diego CA, US
Assignee:
Maxwell Technologies, Inc. - San Diego CA
International Classification:
H05K009/00
US Classification:
174 35MS, 361816, 257660, 2505061
Abstract:
The invention discloses a method for making two sided Multi-Chip Modules (MCMs) that will allow most commercially available integrated circuits to meet the thermal and radiation hazards of the spacecraft environment using integrated package shielding technology. The invention describes the technology and methodology to manufacture MCMs that are radiation-hardened, structurally and thermally stable using 3-dimensional techniques allowing for high density integrated circuit packaging in a radiation hardened package.

Method For Shielding Integrated Circuit Devices

US Patent:
7191516, Mar 20, 2007
Filed:
Jul 16, 2003
Appl. No.:
10/621844
Inventors:
Janet Patterson - San Diego CA, US
Assignee:
Maxwell Technologies, Inc. - San Diego CA
International Classification:
H05K 3/34
US Classification:
29840, 29831, 29832, 29839, 29843, 22818021, 22818022, 257686
Abstract:
A high reliability radiation shielding integrated circuit device comprising a plurality of package layers; a radiation shielding lid or base coupled to the plurality of package layers; wherein the circuit die are shielded from receiving an amount of radiation greater than the total dose tolerance of the circuit die. An integrated circuit device for use in high reliability applications. The integrated circuit device is designed to be highly reliable and protect integrated circuit die from failing or becoming unreliable due to radiation, mechanical forces, thermal exposure, or chemical contaminates.

Method And Apparatus For Shielding An Integrated Circuit From Radiation

US Patent:
7382043, Jun 3, 2008
Filed:
Sep 25, 2002
Appl. No.:
10/065209
Inventors:
Larry L. Longden - San Diego CA, US
Janet Patterson - San Diego CA, US
Assignee:
Maxwell Technologies, Inc. - San Diego CA
International Classification:
H01L 23/552
US Classification:
257660
Abstract:
A radiation shielding integrated circuit device comprising a x-ray shielding layer for shielding an electronic circuit device from receiving an amount of x-rays greater than the total dose tolerance of the electronic circuit device; a base coupled to the x-ray shielding layer; a radiation shielding top coupled to the base; a radiation shielding bottom coupled to the base; and the electronic circuit device coupled to the x-ray shielding layer; wherein the electronic circuit device is shielded from receiving an amount of radiation greater than a total dose tolerance of the electronic circuit device.

Apparatus For Shielding Integrated Circuit Devices

US Patent:
7696610, Apr 13, 2010
Filed:
Nov 13, 2006
Appl. No.:
11/559140
Inventors:
Janet Patterson - San Diego CA, US
Assignee:
Maxwell Technologies, Inc. - San Diego CA
International Classification:
H01L 23/552
US Classification:
257659, 29840, 174350, 361818
Abstract:
A high reliability radiation shielding integrated circuit apparatus comprising a plurality of package layers; a radiation shielding lid or base coupled to the plurality of package layers; wherein the circuit die are shielded from receiving an amount of radiation greater than the total dose of tolerance of the circuit die. In one embodiment, an integrated circuit apparatus for use in high reliability applications is disclosed. The integrated circuit apparatus is designed to be highly reliable and protect integrated circuit die from failing or becoming unreliable due to radiation, mechanical forces, thermal exposure, or chemical contaminates.

Apparatus For Shielding Integrated Circuit Devices

US Patent:
8018739, Sep 13, 2011
Filed:
Mar 8, 2010
Appl. No.:
12/719123
Inventors:
Janet Patterson - San Diego CA, US
Assignee:
Maxwell Technologies, LLC - San Diego CA
International Classification:
H05K 9/00
US Classification:
361816, 361735, 361818, 361800, 174350, 257659, 257660, 257686
Abstract:
A high reliability radiation shielding integrated circuit apparatus comprising a plurality of package layers; a radiation shielding lid or base coupled to the plurality of package layers; wherein the circuit die are shielded from receiving an amount of radiation greater than the total dose of tolerance of the circuit die. In one embodiment, an integrated circuit apparatus for use in high reliability applications is disclosed. The integrated circuit apparatus is designed to be highly reliable and protect integrated circuit die from failing or becoming unreliable due to radiation, mechanical forces, thermal exposure, or chemical contaminates.

Electronic Component Packaging

US Patent:
2004021, Nov 4, 2004
Filed:
Apr 30, 2003
Appl. No.:
10/427608
Inventors:
Janet Patterson - San Diego CA, US
Assignee:
Maxwell Electronic Components Group, Inc.
International Classification:
H01L023/495
US Classification:
257/666000
Abstract:
An electronic component package and a method of forming the package are disclosed. The package includes a die having a top face with set of contacts and a substrate having a cutout therein. The die may include a memory component and may include SDRAM. The substrate is mounted on the top face, and the cutout overlays the set of contacts. Wire leads extend from the set of contacts, at least partially through the cutout, to the substrate. The set of contacts may be positioned along a central region of the die, and the cutout overlays the central region. The wire leads extend to the substrate and may contact the substrate proximate to the cutout. The package may further include a set of electrical paths extending from the wire leads through the substrate for providing communicative path between the die and an external component.

Radiation Shielding Of Three Dimensional Multi-Chip Modules

US Patent:
6262362, Jul 17, 2001
Filed:
Jul 2, 1998
Appl. No.:
9/109954
Inventors:
David R. Czjakowski - Encinitas CA
Neil Eggleston - San Diego CA
Janet S. Patterson - San Diego CA
Assignee:
Maxwell Electronic Components Group, Inc. - San Diego CA
International Classification:
H05K 900
US Classification:
174 35R
Abstract:
The invention discloses a method for making two sided Multi-Chip Modules (MCMs) that will allow most commercially available integrated circuits to meet the thermal and radiation hazards of the spacecraft environment using integrated package shielding technology. The invention describes the technology and methodology to manufacture MCMs that are radiation-hardened, structurally and thermally stable using 3-dimensional techniques allowing for high density integrated circuit packaging in a radiation hardened package.

Amazon

Janet Patterson Photo 36

Aphasia Rehabilitation: Clinical Challenges

Author:
Patrick Coppens, Janet Patterson
Publisher:
Jones & Bartlett Learning
Binding:
Paperback
Pages:
484
ISBN #:
1284042715
EAN Code:
9781284042719
Aphasia Rehabilitation: Clinical Challenges focuses on specific aphasia symptoms and clinical issues that present challenges for rehabilitation professionals. Contributed by experts in the field, each chapter presents a clinically relevant topic in detail while blending theoretical concepts with pra...
Janet Patterson Photo 37

Wings Of Song

Publisher:
Unity School of Christianity
Binding:
Hardcover
ISBN #:
0871591766
EAN Code:
9780871591760
Book by
Janet Patterson Photo 38

Mr. Rockefeller's Roads: The Untold Story Of Acadia's Carriage Roads And Their Creator

Author:
Ann Rockefeller Roberts
Publisher:
Down East Books
Binding:
Paperback
Pages:
184
ISBN #:
0892722967
EAN Code:
9780892722969
Book by Ann Rockefeller Roberts

Possible Relatives

Cynthia Patterson  David F Patterson  Dawn O Patterson  Dean E Patterson  Debbie K Patterson  Deborah K Patterson  Dana R Patterson  Janet M Johnson  Janet G Stanard  Janet A Standish 

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