Jay Bunt resumes & CV records
Resumes
Jay A Bunt, 61Brookfield, NY
Jay Bunt Phones & Addresses
North Brookfield, NY
Esopus, NY
South Brookfield, NY
524 Swarte Kill Rd, New Paltz, NY 12561
Highland, NY
Madison, NY
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Jay A Bunt
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Publications & IP owners
Us Patents
Method For Providing Uniaxial Load Distribution For Laminate Layers Of Multilayer Ceramic Chip Carriers
US Patent:
7947143, May 24, 2011
Filed:
Apr 18, 2008
Appl. No.:
12/105622
Inventors:
Jay A. Bunt - Esopus NY, US
Donald W. Diangelo - Fishkill NY, US
Cristian Docu - Montgomery NY, US
Thomas Foley - Beacon NY, US
Lisa A. Hamilton - Chelsea NY, US
Thomas A. Kline - Wappingers Falls NY, US
Mark J. LaPlante - Montgomery NY, US
Hsichang Liu - Fishkill NY, US
Sebastian Loscerbo - Newburgh NY, US
Govindarajan Natarajan - Poughkeepsie NY, US
Olga A. Otieno - Bel Air MD, US
Renee L. Weisman - Poughkeepsie NY, US
Donald W. Diangelo - Fishkill NY, US
Cristian Docu - Montgomery NY, US
Thomas Foley - Beacon NY, US
Lisa A. Hamilton - Chelsea NY, US
Thomas A. Kline - Wappingers Falls NY, US
Mark J. LaPlante - Montgomery NY, US
Hsichang Liu - Fishkill NY, US
Sebastian Loscerbo - Newburgh NY, US
Govindarajan Natarajan - Poughkeepsie NY, US
Olga A. Otieno - Bel Air MD, US
Renee L. Weisman - Poughkeepsie NY, US
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
B32B 37/00
US Classification:
156228, 156 8911, 156 8912, 156250
Abstract:
An apparatus for providing uniform axial load distribution for laminate layers of multilayer ceramic chip carriers includes a base plate configured to support a plurality of green sheet layers thereon, the base plate having at least one resiliently mounted load support bar disposed adjacent outer edges of the base plate. The load support bar is mounted on one or more biasing members such that the top surface of the support bar extends above the top surface of the base plate by a selected distance.
Apparatus For Providing Uniaxial Load Distribution For Laminate Layers Of Multilayer Ceramic Chip Carriers
US Patent:
8156990, Apr 17, 2012
Filed:
Apr 18, 2008
Appl. No.:
12/105494
Inventors:
Jay A. Bunt - Esopus NY, US
Donald W. Diangelo - Fishkill NY, US
Cristian Docu - Montgomery NY, US
Thomas Foley - Beacon NY, US
Lisa A. Hamilton - Chelsea NY, US
Thomas A. Kline - Wappingers Falls NY, US
Mark J. LaPlante - Montgomery NY, US
Hsichang Liu - Fishkill NY, US
Sebastian Loscerbo - Newburgh NY, US
Govindarajan Natarajan - Poughkeepsie NY, US
Olga A. Otieno - Bel Air MD, US
Renee L. Weisman - Poughkeepsie NY, US
Donald W. Diangelo - Fishkill NY, US
Cristian Docu - Montgomery NY, US
Thomas Foley - Beacon NY, US
Lisa A. Hamilton - Chelsea NY, US
Thomas A. Kline - Wappingers Falls NY, US
Mark J. LaPlante - Montgomery NY, US
Hsichang Liu - Fishkill NY, US
Sebastian Loscerbo - Newburgh NY, US
Govindarajan Natarajan - Poughkeepsie NY, US
Olga A. Otieno - Bel Air MD, US
Renee L. Weisman - Poughkeepsie NY, US
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
B32B 37/00
US Classification:
156581, 156580
Abstract:
An apparatus for providing uniform axial load distribution for laminate layers of multilayer ceramic chip carriers includes a base plate configured to support a plurality of green sheet layers thereon, the base plate having at least one resiliently mounted load support bar disposed adjacent outer edges of the base plate. The load support bar is mounted on one or more biasing members such that the top surface of the support bar extends above the top surface of the base plate by a selected distance.
Method And Apparatus For Providing Uniaxial Load Distribution For Laminate Layers Of Multilayer Ceramic Chip Carriers
US Patent:
2007011, May 24, 2007
Filed:
Nov 22, 2005
Appl. No.:
11/164437
Inventors:
Jay Bunt - Esopus NY, US
Donald Diangelo - Fishkill NY, US
Cristian Docu - Montgomery NY, US
Thomas Foley - Beacon NY, US
Melvin Gottschalk - Danbury CT, US
Lisa Hamilton - Chelsea NY, US
Thomas Kline - Wappingers Falls NY, US
Mark LaPlante - Montgomery NY, US
Hsichang Liu - Fishkill NY, US
Sebastian Loscerbo - Newburgh NY, US
Govindarajan Natarajan - Poughkeepsie NY, US
Olga Otieno - BeL Air MD, US
Renee Weisman - Poughkeepsie NY, US
Donald Diangelo - Fishkill NY, US
Cristian Docu - Montgomery NY, US
Thomas Foley - Beacon NY, US
Melvin Gottschalk - Danbury CT, US
Lisa Hamilton - Chelsea NY, US
Thomas Kline - Wappingers Falls NY, US
Mark LaPlante - Montgomery NY, US
Hsichang Liu - Fishkill NY, US
Sebastian Loscerbo - Newburgh NY, US
Govindarajan Natarajan - Poughkeepsie NY, US
Olga Otieno - BeL Air MD, US
Renee Weisman - Poughkeepsie NY, US
Assignee:
INTERNATIONAL BUSINESS MACHINES CORPORATION - Armonk NY
International Classification:
C03B 29/00
B32B 37/00
B29C 65/00
B32B 37/00
B29C 65/00
US Classification:
156089110, 156580000, 156089230, 156267000
Abstract:
An apparatus for providing uniform axial load distribution for laminate layers of multilayer ceramic chip carriers includes a base plate configured to support a plurality of green sheet layers thereon, the base plate having at least one resiliently mounted load support bar disposed adjacent outer edges of the base plate. The load support bar is mounted on one or more biasing members such that the top surface of the support bar extends above the top surface of the base plate by a selected distance.
Apparatus For Providing Uniaxial Load Distribution For Laminate Layers Of Multilayer Ceramic Chip Carriers
US Patent:
2008019, Aug 14, 2008
Filed:
Apr 18, 2008
Appl. No.:
12/105600
Inventors:
Jay A. Bunt - Esopus NY, US
Donald W. Diangelo - Fishkill NY, US
Cristian Docu - Montgomery NY, US
Thomas Foley - Beacon NY, US
Melvin R. Gottschalk - Danbury CT, US
Lisa A. Hamilton - Chelsea NY, US
Thomas A. Kline - Wappingers Falls NY, US
Mark J. LaPlante - Montgomery NY, US
Hsichang Liu - Fishkill NY, US
Sebastian Loscerbo - Newburgh NY, US
Govindarajan Natarajan - Poughkeepsie NY, US
Olga A. Otieno - Bel Air MD, US
Renee L. Weisman - Poughkeepsie NY, US
Donald W. Diangelo - Fishkill NY, US
Cristian Docu - Montgomery NY, US
Thomas Foley - Beacon NY, US
Melvin R. Gottschalk - Danbury CT, US
Lisa A. Hamilton - Chelsea NY, US
Thomas A. Kline - Wappingers Falls NY, US
Mark J. LaPlante - Montgomery NY, US
Hsichang Liu - Fishkill NY, US
Sebastian Loscerbo - Newburgh NY, US
Govindarajan Natarajan - Poughkeepsie NY, US
Olga A. Otieno - Bel Air MD, US
Renee L. Weisman - Poughkeepsie NY, US
Assignee:
INTERNATIONAL BUSINESS MACHINES CORPORATION - Armonk NY
International Classification:
B32B 37/00
US Classification:
156580
Abstract:
An apparatus for providing uniform axial load distribution for laminate layers of multilayer ceramic chip carriers includes a base plate configured to support a plurality of green sheet layers thereon, the base plate having at least one resiliently mounted load support bar disposed adjacent outer edges of the base plate. The load support bar is mounted on one or more biasing members such that the top surface of the support bar extends above the top surface of the base plate by a selected distance.
Coolant-Cooled Heat Sink(S) With Associated Ultra-Violet Light Assembly
US Patent:
2022034, Nov 3, 2022
Filed:
Apr 30, 2021
Appl. No.:
17/245356
Inventors:
- Armonk NY, US
David J. LEWISON - LaGrangeville NY, US
Frank L. POMPEO - Redding CT, US
James BUSBY - New Paltz NY, US
Jay A. BUNT - Esopus NY, US
Joyce E. MOLINELLI ACOCELLA - Poughquag NY, US
Madhana SUNDER - Poughkeepsie NY, US
David J. LEWISON - LaGrangeville NY, US
Frank L. POMPEO - Redding CT, US
James BUSBY - New Paltz NY, US
Jay A. BUNT - Esopus NY, US
Joyce E. MOLINELLI ACOCELLA - Poughquag NY, US
Madhana SUNDER - Poughkeepsie NY, US
International Classification:
A61L 2/10
F21V 29/58
F21V 29/58
Abstract:
Apparatuses and methods of fabrication are provided which include a coolant-cooled heat sink through which coolant passes to facilitate cooling the coolant-cooled heat sink, and an ultra-violet (UV) light assembly associated with the coolant-cooled heat sink for directing UV light towards an interior surface of the coolant-cooled heat sink across which the coolant passes. The UV light inhibits bacterial growth at the interior surface of the coolant-cooled heat sink.
Tamper-Respondent Assemblies With Porous Heat Transfer Element(S)
US Patent:
2022019, Jun 16, 2022
Filed:
Dec 10, 2020
Appl. No.:
17/117267
Inventors:
- Armonk NY, US
Arthur J. HIGBY - Cottekill NY, US
David J. LEWISON - LaGrangeville NY, US
Philipp K. BUCHLING REGO - Wappingers Falls NY, US
Jay A. BUNT - Esopus NY, US
James BUSBY - New Paltz NY, US
Levi CAMPBELL - Poughkeepsie NY, US
Arthur J. HIGBY - Cottekill NY, US
David J. LEWISON - LaGrangeville NY, US
Philipp K. BUCHLING REGO - Wappingers Falls NY, US
Jay A. BUNT - Esopus NY, US
James BUSBY - New Paltz NY, US
Levi CAMPBELL - Poughkeepsie NY, US
International Classification:
H05K 1/02
H05K 7/20
F28F 13/00
G08B 21/18
H05K 7/20
F28F 13/00
G08B 21/18
Abstract:
Tamper-respondent assemblies are provided which include a circuit board, an enclosure assembly mounted to the circuit board, and a pressure sensor. The circuit board includes an electronic component, and the enclosure assembly is mounted to the circuit board to enclose the electronic component within a secure volume. The enclosure assembly includes a thermally conductive enclosure with a sealed inner compartment, and a porous heat transfer element within the sealed inner compartment. The porous heat transfer element is sized and located to facilitate conducting heat from the electronic component across the sealed inner compartment of the thermally conductive enclosure. The pressure sensor senses pressure within the sealed inner compartment of the thermally conductive enclosure to facilitate identifying a pressure change indicative of a tamper event.
Conformal Integrated Circuit (Ic) Device Package Lid
US Patent:
2021024, Aug 12, 2021
Filed:
Feb 11, 2020
Appl. No.:
16/787241
Inventors:
- Armonk NY, US
Hongqing Zhang - Hopewell Junction NY, US
Jay A. Bunt - Esopus NY, US
Jeffrey A. Zitz - Poughkeepsie NY, US
Sushumna Iruvanti - Wappingers Falls NY, US
Hongqing Zhang - Hopewell Junction NY, US
Jay A. Bunt - Esopus NY, US
Jeffrey A. Zitz - Poughkeepsie NY, US
Sushumna Iruvanti - Wappingers Falls NY, US
International Classification:
H01L 23/40
H01L 23/427
F28F 13/00
H01L 23/427
F28F 13/00
Abstract:
An integrated circuit (IC) device package includes an IC device connected to an upper surface of the IC device carrier. Due to operation conditions or IC device package makeup, the IC device may warp. The warped IC device may include a convex upper surface. A conformable lid is connected to the IC device and includes an internal chamber and a deformable floor. The deformable floor is able to deform or bend along with the IC device. After deformation, the deformable floor may include a concave lower surface. A uniform bond line thickness of a thermal interface material that connects the IC device and the conformable lid is able to be achieved due to the deformable floor deforming or bending along with the IC device.
Coolant-Cooled Heat Sinks With Internal Thermally-Conductive Fins Joined To The Cover
US Patent:
2021022, Jul 22, 2021
Filed:
Jan 20, 2020
Appl. No.:
16/747059
Inventors:
- Armonk NY, US
Jay A. BUNT - Esopus NY, US
David J. LEWISON - LaGrangeville NY, US
Joyce E. MOLINELLI ACOCELLA - Poughquag NY, US
Frank L. POMPEO - Redding CT, US
Jeffrey Allen ZITZ - Poughkeepsie NY, US
Jay A. BUNT - Esopus NY, US
David J. LEWISON - LaGrangeville NY, US
Joyce E. MOLINELLI ACOCELLA - Poughquag NY, US
Frank L. POMPEO - Redding CT, US
Jeffrey Allen ZITZ - Poughkeepsie NY, US
International Classification:
F28D 15/02
H05K 7/20
F28D 15/04
H05K 7/20
F28D 15/04
Abstract:
Coolant-cooled heat sinks and methods of fabrication are provided with a coolant-carrying compartment between a cover and a heat transfer base. The heat transfer base includes a heat transfer surface to couple to a component to be cooled, and a plurality of thermally-conductive fins extending into the coolant-carrying compartment from a surface of the heat transfer base opposite to the heat transfer surface. One or more grooves are provided in an interface surface of the cover and fins, and wicking element(s) are positioned within, at least in part, the groove(s). A joining material is provided between the cover and fins to join the plurality of thermally-conductive fins to the cover. The wicking element(s) within, at least in part, the groove(s) facilitate retaining the joining material over the plurality of thermally-conductive fins during joining of the cover and fins.
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