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Jeffrey Lynn Finder, 631525 Freeman, Mesa, AZ 85201

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1525 Freeman, Mesa, AZ 85201   

1528 Freeman, Mesa, AZ 85201   

Chandler, AZ   

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Jeffrey Finder Photo 14

Business Development / Strategy Leader With 14+ Years Of Experience In Technology And Telecommunications

Location:
Phoenix, Arizona Area
Industry:
Telecommunications

Publications & IP owners

Us Patents

Microelectronic Piezoelectric Structure And Method Of Forming The Same

US Patent:
6432546, Aug 13, 2002
Filed:
Jul 24, 2000
Appl. No.:
09/624527
Inventors:
Yu Wang - Greenbelt MD
Jeffrey M. Finder - Chandler AZ
Kurt Eisenbeiser - Tempe AZ
Zhiyi Yu - Gilbert AZ
Ravindranath Droopad - Chandler AZ
Assignee:
Motorola, Inc. - Schaumburg IL
International Classification:
B32B 900
US Classification:
428448, 428446, 428469, 428472, 428697, 428688, 428699, 428700, 428701, 428702
Abstract:
A high quality epitaxial layer of monocrystalline Pb(Zr,Ti)O can be grown overlying large silicon wafers by first growing an strontium titanate layer on a silicon wafer. The strontium titanate layer is a monocrystalline layer spaced apart from the silicon wafer by an amorphous interface layer of silicon oxide.

Microelectronic Piezoelectric Structure And Method Of Forming The Same

US Patent:
6482538, Nov 19, 2002
Filed:
Jul 25, 2001
Appl. No.:
09/912994
Inventors:
Ramamoorthy Ramesh - Silver Spring MD
Yu Wang - Shatin, HK
Jeffrey M. Finder - Chandler AZ
Zhiyi Yu - Gilbert AZ
Ravindranath Droopad - Chandler AZ
Kurt Eisenbeiser - Tempe AZ
Assignee:
Motorola, Inc. - Schaumburg IL
International Classification:
B32B 1900
US Classification:
428701, 428689, 428699, 428702
Abstract:
A high quality epitaxial layer of monocrystalline Pb(Mg,Nb)O âPbTiO or Pb(Mg Nb )O âPbTiO can be grown overlying large silicon wafers by first growing an strontium titanate layer on a silicon wafer. The strontium titanate layer is a monocrystalline layer spaced apart from the silicon wafer by an amorphous interface layer of silicon oxide.

Acoustic Wave Device And Process For Forming The Same

US Patent:
6555946, Apr 29, 2003
Filed:
Jul 24, 2000
Appl. No.:
09/624803
Inventors:
Jeffrey M. Finder - Chandler AZ
Kurt Eisenbeiser - Tempe AZ
Jamal Ramdani - Gilbert AZ
Ravindranath Droopad - Chandler AZ
William Jay Ooms - Chandler AZ
Assignee:
Motorola, Inc. - Schaumburg IL
International Classification:
H01L 4108
US Classification:
310324, 311322, 311334
Abstract:
High quality epitaxial layers of piezoelectric material materials can be grown overlying large silicon wafers by first growing an accommodating buffer layer on a silicon wafer. The accommodating buffer layer is a layer of monocrystalline oxide spaced apart from the silicon wafer by an amorphous interface layer of silicon oxide. The amorphous interface layer dissipates strain and permits the growth of a high quality monocrystalline oxide accommodating buffer layer. Any lattice mismatch between the accommodating buffer layer and the underlying silicon substrate is taken care of by the amorphous interface layer.

Quantum Well Infrared Photodetector And Method For Fabricating Same

US Patent:
6559471, May 6, 2003
Filed:
Dec 8, 2000
Appl. No.:
09/733688
Inventors:
Jeffrey M. Finder - Chandler AZ
William J. Ooms - Prescott AZ
Assignee:
Motorola, Inc. - Schaumburg IL
International Classification:
H01L 2906
US Classification:
257 22, 257 9, 257 14, 257 15
Abstract:
High quality epitaxial layers of monocrystalline materials can be grown overlying monocrystalline substrates such as large silicon wafers by forming a compliant substrate for growing the monocrystalline layers. One way to achieve the formation of a compliant substrate includes first growing an accommodating buffer layer ( ) on a silicon wafer ( ). The accommodating buffer layer is a layer of monocrystalline oxide spaced apart from the silicon wafer by an amorphous interface layer ( ) of silicon oxide. The amorphous interface layer dissipates strain and permits the growth of a high quality monocrystalline oxide accommodating buffer layer. The accommodating buffer layer is lattice matched to both the underlying silicon wafer and the overlying monocrystalline layer. Any lattice mismatch between the accommodating buffer layer and the underlying silicon substrate is taken care of by the amorphous interface layer. In addition, formation of a compliant substrate may include utilizing surfactant enhanced epitaxy, epitaxial growth of single crystal silicon onto single crystal oxide, and epitaxial growth of Zintl phase materials.

Pyroelectric Device On A Monocrystalline Semiconductor Substrate And Process For Fabricating Same

US Patent:
6563118, May 13, 2003
Filed:
Dec 8, 2000
Appl. No.:
09/733181
Inventors:
William J. Ooms - Prescott AZ
Jeffrey M. Finder - Chandler AZ
Kurt W. Eisenbeiser - Tempe AZ
Jerald A. Hallmark - Gilbert AZ
Assignee:
Motorola, Inc. - Schaumburg IL
International Classification:
G01J 500
US Classification:
2503383, 257 43, 257467, 257613
Abstract:
High quality epitaxial layers of monocrystalline materials can be grown overlying large silicon wafers by first growing an accommodating buffer layer ( ) on a silicon wafer ( ). The accommodating buffer layer ( ) is a layer of monocrystalline material spaced apart from the silicon wafer ( ) by an amorphous interface layer ( ) of silicon oxide. The amorphous interface layer dissipates strain and permits the growth of a high quality monocrystalline accommodating buffer layer. Any lattice mismatch between the accommodating buffer layer and the underlying silicon substrate is taken care of by the amorphous interface layer. Utilizing this technique permits the fabrication of thin film pyroelectric devices ( ) on a monocrystalline silicon substrate.

Semiconductor Structure Including A Partially Annealed Layer And Method Of Forming The Same

US Patent:
6638838, Oct 28, 2003
Filed:
Oct 2, 2000
Appl. No.:
09/678372
Inventors:
Kurt Eisenbeiser - Tempe AZ
Barbara M. Foley - Gilbert AZ
Jeffrey M. Finder - Chandler AZ
Danny L. Thompson - Mesa AZ
Assignee:
Motorola, Inc. - Schaumburg IL
International Classification:
H01L 2120
US Classification:
438481, 438606, 438607, 117101, 117105, 117108
Abstract:
High quality epitaxial layers of compound semiconductor materials can be grown overlying large silicon wafers by first growing an accommodating buffer layer on a silicon wafer. The accommodating buffer layer is a layer of monocrystalline oxide spaced apart from the silicon wafer by an amorphous interface layer of silicon oxide. The amorphous interface layer dissipates strain and permits the growth of a high quality monocrystalline oxide accommodating buffer layer. The accommodating buffer layer is lattice matched to both the underlying silicon wafer and the overlying monocrystalline compound semiconductor layer. Any lattice mismatch between the accommodating buffer layer and the underlying silicon substrate is taken care of by the amorphous interface layer. To further relieve strain in the accommodating buffer layer, at least a portion of the accommodating buffer layer is exposed to a laser anneal process to cause the accommodating buffer layer to become amorphous, providing a true compliant substrate for subsequent layer growth.

Microelectronic Piezoelectric Structure And Method Of Forming The Same

US Patent:
6750067, Jun 15, 2004
Filed:
Apr 19, 2002
Appl. No.:
10/126772
Inventors:
Yu Wang - Greenbelt MD
Jeffrey M. Finder - Chandler AZ
Kurt Eisenbeiser - Tempe AZ
Zhiyi Yu - Gilbert AZ
Ravindranath Droopad - Chandler AZ
Assignee:
Freescale Semiconductor, Inc. - Austin TX
International Classification:
H01L 2100
US Classification:
438 3, 438 96, 438480
Abstract:
A high quality epitaxial layer of monocrystalline Pb(Zr,Ti)O can be grown overlying large silicon wafers by first growing an strontium titanate layer on a silicon wafer. The strontium titanate layer is a monocrystalline layer spaced apart from the silicon wafer by an amorphous interface layer of silicon oxide.

Bst On Low-Loss Substrates For Frequency Agile Applications

US Patent:
6764864, Jul 20, 2004
Filed:
Apr 17, 2003
Appl. No.:
10/418372
Inventors:
Hao Li - Chandler AZ
Jeffrey M. Finder - Chandler AZ
Yong Liang - Gilbert AZ
Corey Overgaard - Phoenix AZ
Assignee:
Freescale Semiconductor, Inc. - Austin TX
International Classification:
H01L 2100
US Classification:
438 3, 438689, 438695
Abstract:
An exemplary system and method for providing a microwave regime, frequency-agile device is disclosed as comprising inter alia: a low-loss, insulating substrate ( ); a layer of SiO ( ) over the surface of said substrate; and a layer of BST ( ) deposited over the SiO layer ( ). Disclosed features and specifications may be variously controlled, configured, adapted or otherwise optionally modified to further improve or otherwise optimize frequency response or other material characteristics. Exemplary embodiments of the present invention representatively provide for integrated high-efficiency, low-loss microwave components that may be readily incorporated with existing technologies for the improvement of frequency response, device package form factors, weights and/or other manufacturing, device or material performance metrics.

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