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Jianjun Li, 38Santa Barbara, CA

Related to:
Shu Li Wang Myong H Fin 62 Ki Mo Sin 89

Jianjun Li Phones & Addresses

Santa Barbara, CA   

Los Angeles, CA   

Sioux Falls, SD   

Hagerstown, MD   

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Jianjun Li resumes & CV records

Resumes

Jianjun Li Photo 23

Landscape Designer

Location:
Los Angeles, CA
Industry:
Architecture & Planning
Work:
Van Atta Associates
Landscape Designer Hongjoo Kim Landscape Architects Apr 2015 - Jul 2015
Intern University of Southern California Aug 2012 - May 2015
Landscape Architecture Student Oor Landscape Architecture and Planning May 1, 2013 - Aug 1, 2013
Intern Guiyang Architecture Design Institute Oct 2010 - Aug 2011
Intern Van Atta Associates, Inc Oct 2010 - Aug 2011
Landscape Designer
Education:
University of Southern California 2012 - 2015
Masters, Landscape Architecture Tianjin Chengjian University 2005 - 2009
Bachelors, Bachelor of Science, Engineering
Skills:
Sketchup, Sustainable Design, Autocad, Microsoft Office, Photoshop, Landscape Architecture, Environmental Engineering, Microsoft Excel, Urban Design, Powerpoint, Microsoft Word, Research, Indesign, Rendering, Design Research, Adobe Creative Suite, Urban Planning
Languages:
Mandarin
English
Jianjun Li Photo 24

Air Man

Location:
Urbana, IL
Work:
Us Navy
Air Man
Education:
Long Island Business Institute 2017 - 2019
Jianjun Li Photo 25

Jianjun Li

Location:
Los Angeles, CA
Education:
University of California, Los Angeles 2012 - 2016
Jianjun Li Photo 26

Specialist And Head Of Obgyn

Location:
Los Angeles, CA
Industry:
Medical Practice
Work:
The Prestige Hospital
Specialist and Head of Obgyn United Family Healthcare
Physician of Department of Obgyn Duke University Medical Center Jan 2005 - Feb 2011
Senior Research Associate Pumch Aug 1994 - Jun 2004
Associate Professor
Education:
Peking Union Medical College 1986 - 1994
Doctor of Medicine, Doctorates, Medicine
Skills:
Healthcare, Public Health, Clinical Research, Medicine, Hospitals, Medical Research, Medical Education, Research, Healthcare Management, Data Analysis, Healthcare Information Technology, Statistics, Translational Research, Health Services Research, Cancer, Surgery
Languages:
Mandarin
Jianjun Li Photo 27

Jianjun Li

Jianjun Li Photo 28

Jianjun Li

Publications & IP owners

Us Patents

Thermal Enhancement For Quad Flat No Lead (Qfn) Packages

US Patent:
2017001, Jan 19, 2017
Filed:
Jul 22, 2015
Appl. No.:
14/805945
Inventors:
- Irvine CA, US
Jianjun Li - Irvine CA, US
Chunwei Yu - Irvine CA, US
International Classification:
H01L 23/495
H01L 23/367
H01L 23/31
H01L 21/56
H01L 23/13
H01L 23/00
Abstract:
Integrated circuit packages with enhanced thermal characteristics are provided. For example, in embodiments, a QFN (quad flat no lead) package includes a die pad that extends to at least one pinless edge of the QFN package body. A portion of the die pad further extends towards a top surface of the QFN package body. By doing so, a low impedance thermal path from a die included in the QFN package to the top of the QFN package body is formed, which causes heat generated by the die to dissipate from one or more sides and the top of the QFN package, and ultimately to the surrounding environment. Furthermore, the path travelled by the heat in a circuit board coupled to the QFN package is shortened, thereby protecting electrical components coupled thereto.

Isbn (Books And Publications)

Zhongguo Di Xia Jin Rong Diao Cha: Zhongguo Dixia Jinrong Diaocha

Author:
Jianjun Li
ISBN #:
7208059799

Possible Relatives

Cynthia M Li  David Li  Dawei Li  Dayu W Li  De Li  Dean Li  Da Li  Jianjun Ye  Jianjun Chen  Jianjun J Cao 

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