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John P Birk, 546720 154Th Ln NW, Ramsey, MN 55303

John Birk Phones & Addresses

6720 154Th Ave, Ramsey, MN 55303    763-4226788   

6720 154Th Ln NW, Anoka, MN 55303    763-4226788   

Plymouth, MN   

Rosemount, MN   

San Jose, CA   

Work

Company: Birk & Birk Attorneys At Law, P.C. Address:

Mentions for John P Birk

Career records & work history

Lawyers & Attorneys

John Birk Photo 1

John Birk - Lawyer

Office:
Birk & Birk Attorneys At Law, P.C.
Specialties:
Personal Injury, Wrongful Death, Insurance Defense, Insurance Defense Subrogation, Workers Compensation, Defense Litigation, Commercial Collections, Estate Planning, Health Care, Probate, Commercial
ISLN:
909017666
Admitted:
1989
University:
United States Military Academy, B.S., 1981
Law School:
Indiana University School of Law, J.D., 1989

Medicine Doctors

John W. Birk

Specialties:
Gastroenterology
Work:
UconnUniversity Connecticut Health Center Gastroenterology
263 Farmington Ave, Farmington, CT 06030
844-8907666 (phone) 860-6791217 (fax)
Site
University Of Connecticut Gastroenterology Associates
263 Farmington Ave- Outpatient Pavilion, Farmington, CT 06030
860-6793238 (phone) 860-6794873 (fax)
Education:
Medical School
Mount Sinai School of Medicine
Graduated: 1986
Procedures:
Endoscopic Retrograde Cholangiopancreatography (ERCP), Colonoscopy, Sigmoidoscopy, Upper Gastrointestinal Endoscopy
Conditions:
Acute Pancreatitis, Benign Polyps of the Colon, Cholelethiasis or Cholecystitis, Cirrhosis, Diverticulosis, Gastritis and Duodenitis, Infectious Liver Disease, Intestinal Obstruction, Liver Cancer, Peptic Ulcer Disease, Anal or Rectal Abscess, Celiac Disease, Chronic Pancreatitis, Constipation, Diverticulitis, Esophagitis, Gastroesophageal Reflux Disease (GERD), Gastrointestinal Hemorrhage, Hemorrhoids, Inflammatory Bowel Disease (IBD), Irritable Bowel Syndrome (IBS), Ischemic Bowel Disease, Malignant Neoplasm of Colon, Malignant Neoplasm of Esophagus, Pancreatic Cancer, Rectal, Abdomen, Small Intestines, or Colon Cancer
Languages:
English
Description:
Dr. Birk graduated from the Mount Sinai School of Medicine in 1986. He works in Farmington, CT and 1 other location and specializes in Gastroenterology.

Publications & IP owners

Wikipedia

John Birk Photo 35

Dizzy Gillespie

Birth name, John Birks Gillespie. Born, October 21, 1917(1917-10-21) Cheraw, South Carolina, U.S.. Died, January 6, 1993(1993-01-06) (aged 75) Englewood ...

Us Patents

System For Sensing And Forming Objects Such As Leads Of Electronic Components

US Patent:
4821157, Apr 11, 1989
Filed:
Aug 26, 1987
Appl. No.:
7/089651
Inventors:
John Birk - Los Altos CA
Heinz Breu - Mountain View CA
William Gong - Sunnyvale CA
Charles C. Morehouse - Cupertino CA
Sidney Liebes - Atherton CA
Assignee:
Hewlett-Packard Co. - Palo Alto CA
International Classification:
F21V 1100
US Classification:
362241
Abstract:
An automatic lead sensing and fine-forming system is disclosed for preparing the leads of electronic components so that they are ready to be inserted by robots into holes on printed circuit boards. The positions of the lead tips and the positions of the holes are sensed and compared to determine if any leads need to be bent. These leads are then bent and the force on the leads and their displacement are sensed and recorded during the process. The data recorded in then used for subsequent bendings, where necessary, for bending the leads to the target locations so that all the leads fit simultaneously into the holes. To simplify image processing, the lead tips are illuminated by light originating from substantially isotropic directions from locations substantially coplanar with the region of the lead tips. A telecentric lens system is used in the optical sensing of the position of the lead tips so that measurement of the distances between leads is unaffected by variations in the separation between the lead tips and the sensing device.

Method And Apparatus For Scanning And Printing

US Patent:
5446559, Aug 29, 1995
Filed:
Oct 5, 1992
Appl. No.:
7/956708
Inventors:
John R. Birk - Los Altos CA
Assignee:
Hewlett-Packard Company - Palo Alto CA
International Classification:
H04N 1024
US Classification:
358473
Abstract:
A method and apparatus for conveying a printing mechanism over a surface of a substrate as the printing means creates indicia on the surface of the substrate. The present invention further provides a method and apparatus for conveying an optical sensor over the surface of the substrate so as to optically scan an image of indicia present on the surface of the substrate. In the preferred embodiment the invention comprises a compact shuttle assembly including a housing that accommodates a mobility subsystem, a sensor subsystem, a printer subsystem and a communications subsystem, each in cooperative communication with a control processor subsystem. In the preferred embodiment the mobility subsystem includes an electric motor rotationally coupled to a rolling member mounted under the housing. The shuttle assembly is guided over a top surface of substrate by selectively activating the mobility subsystem as the rolling member frictionally engages the top surface of the substrate.

System For Sensing And Forming Objects Such As Leads Of Electronic Components

US Patent:
4705081, Nov 10, 1987
Filed:
Feb 21, 1986
Appl. No.:
6/832481
Inventors:
John Birk - Los Altos CA
Heinz Breu - Mountain View CA
William Gong - Sunnyvale CA
Charles C. Morehouse - Cupertino CA
Sidney Liebes - Atherton CA
Assignee:
Hewlett-Packard Company - Palo Alto CA
International Classification:
H05K 330
US Classification:
140147
Abstract:
An automatic lead sensing and fine-forming system is disclosed for preparing the leads of electronic compnents so that they are ready to be inserted by robots into holes on printed circuit boards. The positions of the lead tips and the positions of the holes are sensed and compared to determine if any leads need to be bent. These leads are then bent and the force on the leads and their displacement are sensed and recorded during the process. The data recorded is then used for subsequent bendings, where necessary, for bending the leads to the target locations so that all the leads fit simultaneously into the holes. To simplify image processing, the lead tips are illuminated by light originating from substantially isotropic directions from locations substantially coplanar with the region of the lead tips. A telecentric lens system is used in the optical sensing of the position of the lead tips so that measurement of the distances between leads is unaffected by variations in the separation between the lead tips and the sensing device.

System For Sensing And Forming Objects Such As Leads Of Electronic Components

US Patent:
4813255, Mar 21, 1989
Filed:
Aug 26, 1987
Appl. No.:
7/089719
Inventors:
John Birk - Los Altos CA
Heinz Breu - Mountain View CA
William Gong - Sunnyvale CA
Charles C. Morehouse - Cupertino CA
Sidney Liebes - Atherton CA
Assignee:
Hewlett-Packard Company - Palo Alto CA
International Classification:
B21D 712
US Classification:
72 19
Abstract:
An automatic lead sensing and fine-forming system is disclosed for preparing the leads of electronic components so that they are ready to be inserted by robots into holes on printed circuit boards. The positions of the lead tips and the positions of the holes are sensed and compared to determine if any leads need to be bent. These leads are then bent and the force on the leads and their displacement are sensed and recorded during the process. The data recorded is then used for subsequent bendings, where necessary, for bending the leads to the target locations so that all the leads fit simultaneously into the holes. To simplify image processing, the lead tips are illuminated by light originating from substantially isotropic directions from locations substantially coplanar with the region of the lead tips. A telecentric lens system is used in the optical sensing of the position of the lead tips so that measurement of the distances between leads is unaffected by variations in the separation between the lead tips and the sensing device.

Mechanical Simultaneous Registration Of Multi-Pin Surface-Mount Components To Sites On Substrates

US Patent:
5034802, Jul 23, 1991
Filed:
Dec 11, 1989
Appl. No.:
7/448495
Inventors:
Sidney Liebes - Atherton CA
John Birk - Los Altos CA
Assignee:
Hewlett-Packard Company - Palo Alto CA
International Classification:
H01L 2302
H01L 2312
US Classification:
357 74
Abstract:
A method and structure are provided for aligning SMDs to a substrate. The body of an SMD and that portion of a substrate encircled by the electrical interconnect pads each have a mating physical structure such that the SMD may be quickly placed in the general vicinity of its proper location and the mating physical features cause a precise alignment. In one embodiment, the physical features are nonsymmetrical, thereby preventing accidental placement of the SMD in an undesired rotation. In another embodiment, the physical features vary among device types, thereby ensuring that an improper device is not placed in a particular location on the substrate. In another embodiment, a component carrier is provided which includes depressions for the placement of the SMDs. A vacuum is applied to the carrier which holds each of the SMDs in place. The carrier is then placed in a desired physical relationship with the substrate such that each of the devices held in the carrier is properly aligned with the substrate.

Isbn (Books And Publications)

Tracing The Round - The Astrological Framework Of Moby-Dick

Author:
John F. Birk
ISBN #:
0754109941

Herman Melville'S Billy Budd And The Cybernetic Imagination

Author:
John F. Birk
ISBN #:
0773490256

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