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John J Geraghty, 566562 W Robin Ln, Glendale, AZ 85310

Known as:
John L Geraghty Leticia Martinez
Related to:
Timothy R Rogan

John Geraghty Phones & Addresses

6562 W Robin Ln, Glendale, AZ 85310    602-6173848   

52 Buckley Ct, Phoenixville, PA 19460    610-9834957   

Limerick, PA   

Burlingame, CA   

Maricopa, AZ   

Chester, PA   

Education

School / High School: Fordham University School of Law

Ranks

Licence: New York - Currently registered Date: 1968
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Mentions for John J Geraghty

Career records & work history

Lawyers & Attorneys

John Geraghty Photo 1

John Robert Geraghty - Lawyer

Licenses:
New York - Currently registered 1968
Education:
Fordham University School of Law

Medicine Doctors

John J. Geraghty

Specialties:
Neurology
Work:
Kaiser Permanente Medical GroupKaiser Permanente Hospital Neurology
1600 Eureka Rd FL 4, Roseville, CA 95661
916-4746380 (phone) 916-4746401 (fax)
Site
Education:
Medical School
Baylor College of Medicine
Graduated: 1984
Procedures:
Neurological Testing, Sleep and EEG Testing
Conditions:
Epilepsy, Multiple Sclerosis (MS), Parkinson's Disease, Carpel Tunnel Syndrome, Ischemic Stroke, Migraine Headache, Myasthenia Gravis (MG)
Languages:
English
Description:
Dr. Geraghty graduated from the Baylor College of Medicine in 1984. He works in Roseville, CA and specializes in Neurology. Dr. Geraghty is affiliated with Kaiser Permanente Medical Center - Roseville.

John S. Geraghty

Specialties:
Family Medicine
Work:
Geraghty Family Medicine
13111 E Briarwood Ave STE 105, Englewood, CO 80112
303-6323640 (phone) 303-6323642 (fax)
Education:
Medical School
University of Colorado School of Medicine at Denver
Graduated: 1992
Procedures:
Arthrocentesis, Continuous EKG, Destruction of Benign/Premalignant Skin Lesions, Electrocardiogram (EKG or ECG), Hearing Evaluation, Pulmonary Function Tests, Vaccine Administration, Vasectomy
Conditions:
Acne, Acute Bronchitis, Acute Conjunctivitis, Acute Pharyngitis, Acute Sinusitis, Acute Upper Respiratory Tract Infections, Allergic Rhinitis, Anxiety Dissociative and Somatoform Disorders, Attention Deficit Disorder (ADD), Breast Disorders, Bronchial Asthma, Contact Dermatitis, Fractures, Dislocations, Derangement, and Sprains, Gastroesophageal Reflux Disease (GERD), Gastrointestinal Hemorrhage, Hypothyroidism, Migraine Headache, Non-Toxic Goiter, Obstructive Sleep Apnea, Osteoarthritis, Otitis Media, Overweight and Obesity, Sciatica, Venous Embolism and Thrombosis, Abdominal Hernia, Abnormal Vaginal Bleeding, Acute Otitis Externa, Alopecia Areata, Anal Fissure, Anemia, Angina Pectoris, Anxiety Phobic Disorders, Atopic Dermatitis, Atrial Fibrillation and Atrial Flutter, Bacterial Pneumonia, Benign Prostatic Hypertrophy, Bipolar Disorder, Burns, Calculus of the Urinary System, Candidiasis, Candidiasis of Vulva and Vagina, Cardiac Arrhythmia, Carpel Tunnel Syndrome, Cataract, Cholelethiasis or Cholecystitis, Chronic Sinusitis, Constipation, Croup, Dehydration, Dermatitis, Deviated Nasal Septum, Diabetes Mellitus (DM), Diabetic Peripheral Neuropathy, Disorders of Lipoid Metabolism, Diverticulitis, Erectile Dysfunction (ED), Esophagitis, Female Infertility, Gastritis and Duodenitis, Genital HPV, Glaucoma, Gout, Hallux Valgus, Hearing Loss, Heart Failure, Hemorrhagic stroke, Hemorrhoids, Herpes Genitalis, Herpes Simplex, Herpes Zoster, Hypertension (HTN), Hyperthyroidism, Infectious Liver Disease, Infectious Mononucleosis, Inflammatory Bowel Disease (IBD), Inguinal Hernia, Insomnia, Internal Derangement of Knee, Intervertebral Disc Degeneration, Intracranial Injury, Iron Deficiency Anemia, Irritable Bowel Syndrome (IBS), Labyrinthitis, Lateral Epicondylitis, Macular Degeneration, Malignant Neoplasm of Female Breast, Menopausal and Postmenopausal Disorders, Mitral Valvular Disease, Multiple Sclerosis (MS), Orbital Infection, Parkinson's Disease, Peptic Ulcer Disease, Peripheral Nerve Disorders, Phlebitis and Thrombophlebitis, Plantar Fascitis, Plantar Warts, Pneumonia, Polycystic Ovarian Syndrome (PCOS), Premenstrual Syndrome (PMS), Prostatitis, Psoriasis, Pulmonary Embolism, Raynaud's Disease, Rheumatoid Arthritis, Rosacea, Rotator Cuff Syndrome and Allied Disorders, Skin and Subcutaneous Infections, Skin Cancer, Spinal Stenosis, Substance Abuse and/or Dependency, Systemic Lupus Erythematosus, Tempromandibular Joint Disorders (TMJ), Tension Headache, Thyroiditis, Tinea Pedis, Tinea Unguium, Urinary Incontinence, Urinary Tract Infection (UT), Valvular Heart Disease, Varicose Veins, Ventral Hernia, Vitamin D Deficiency
Languages:
English
Description:
Dr. Geraghty graduated from the University of Colorado School of Medicine at Denver in 1992. He works in Centennial, CO and specializes in Family Medicine. Dr. Geraghty is affiliated with Centennial Peaks Hospital and Sky Ridge Medical Center.
John Geraghty Photo 2

John S Geraghty

Specialties:
Family Medicine
Education:
University of Colorado (1992)

John Geraghty resumes & CV records

Resumes

John Geraghty Photo 40

Account Manager

Location:
Phoenix, AZ
Industry:
Information Technology And Services
Work:
Chech Point Sotware Technology
Account Manager Check Point Software Technologies, Ltd.
Account Manager
Skills:
Solution Selling, Cloud Computing, Network Security, Channel Partners, Security, Managed Services, Enterprise Software, Virtualization, Ips, Professional Services, Saas, Firewalls, Sales Enablement, Information Security, Data Center
John Geraghty Photo 41

John Geraghty

John Geraghty Photo 42

John P Geraghty

John Geraghty Photo 43

John Geraghty

John Geraghty Photo 44

John Geraghty

John Geraghty Photo 45

Account Manager At Check Point Software Technologies

Position:
Account Manager at Check Point Software Technologies
Location:
Phoenix, Arizona Area
Industry:
Internet
Work:
Check Point Software Technologies
Account Manager

Publications & IP owners

Us Patents

Chemical Mechanical Polishing Head Assembly Having Floating Wafer Carrier And Retaining Ring

US Patent:
7044838, May 16, 2006
Filed:
Feb 27, 2004
Appl. No.:
10/789773
Inventors:
Gerard S. Maloney - Milpitas CA, US
Scott Chin - Palo Alto CA, US
John J. Geraghty - Burlingame CA, US
William Dyson, Jr. - San Jose CA, US
Tanlin K. Dickey - Sunnyvale CA, US
Assignee:
EBARA Corporation - Tokyo
International Classification:
B24B 1/00
US Classification:
451 41, 451 63, 451288
Abstract:
The invention provides structure and method for achieving a uniformly polished or planarized substrate such as a semiconductor wafer including achieving substantially uniform polishing between the center of the semiconductor wafer and the edge of the wafer. In one aspect the invention provides a polishing apparatus including a housing, a carrier for mounting a substrate to be polished, a retaining ring circumscribing the carrier for retaining the substrate, a first coupling attaching the retaining ring to the carrier such that the retaining ring may move relative to the carrier, a second coupling attaching the carrier to the housing such that the carrier may move relative to the housing, the housing and the first coupling defining a first pressure chamber to exert a pressure force against the retaining ring, and the housing and the second coupling defining a second pressure chamber to exert a pressure force against the subcarrier. In one embodiment, the couplings are diaphragms. The invention also provides a retaining ring having a special edge profile that assists in smoothing an pre-compressing the polisihng pad to increase polisihng uniformity.

Chemical Mechanical Polishing Head Assembly Having Floating Wafer Carrier And Retaining Ring

US Patent:
2001000, Jul 12, 2001
Filed:
Feb 13, 2001
Appl. No.:
09/782818
Inventors:
Gerard Moloney - Milpitas CA, US
Scott Chin - Palo Alto CA, US
John Geraghty - Burlingame CA, US
William Dyson - San Jose CA, US
Tanlin Dickey - Sunnyvale CA, US
Assignee:
Mitsubishi Materials Corporation - Tokyo
International Classification:
B24B001/00
B24B007/19
B24B007/30
US Classification:
451/072000, 451/041000, 451/056000
Abstract:
The invention provides structure and method for achieving a uniformly polished or planarized substrate such as a semiconductor wafer including achieving substantially uniform polishing between the center of the semiconductor wafer and the edge of the wafer. In one aspect the invention provides a polishing apparatus including a housing, a carrier for mounting a substrate to be polished, a retaining ring circumscribing the carrier for retaining the substrate, a first coupling attaching the retaining ring to the carrier such that the retaining ring may move relative to the carrier, a second coupling attaching the carrier to the housing such that the carrier may move relative to the housing, the housing and the first coupling defining a first pressure chamber to exert a pressure force against the retaining ring, and the housing and the second coupling defining a second pressure chamber to exert a pressure force against the subcarrier. In one embodiment, the couplings are diaphragms. The invention also provides a retaining ring having a special edge profile that assists in smoothing an pre-compressing the polisihng pad to increase polisihng uniformity. A method for polisihing and a semiconductor manufacture is also provided.

Chemical Mechanical Polishing Head Assembly Having Floating Wafer Carrier And Retaining Ring

US Patent:
2002017, Nov 21, 2002
Filed:
Oct 30, 2001
Appl. No.:
10/021372
Inventors:
Huey-Ming Wang - Fremont CA, US
Gerard Moloney - Milpitas CA, US
Scott Chin - Palo Alto CA, US
John Geraghty - Burlingame CA, US
William Dyson - San Jose CA, US
Tanlin Dickey - Sunnyvale CA, US
Assignee:
MITSUBISHI MATERIALS CORPORATION
International Classification:
B24B001/00
US Classification:
451/041000, 451/287000, 451/402000
Abstract:
The invention provides structure and method for achieving a uniformly polished or planarized substrate such as a semiconductor wafer including achieving substantially uniform polishing between the center of the semiconductor wafer and the edge of the wafer. In one aspect the invention provides a polishing apparatus including a housing, a carrier for mounting a substrate to be polished, a retaining ring circumscribing the carrier for retaining the substrate, a first coupling attaching the retaining ring to the carrier such that the retaining ring may move relative to the carrier, a second coupling attaching the carrier to the housing such that the carrier may move relative to the housing, the housing and the first coupling defining a first pressure chamber to exert a pressure force against the retaining ring, and the housing and the second coupling defining a second pressure chamber to exert a pressure force against the subcarrier. In one embodiment, the couplings are diaphragms. The invention also provides a retaining ring having a special edge profile that assists in smoothing an pre-compressing the polisihng pad to increase polisihng uniformity. A method for polisihing and a semiconductor manufacture is also provided.

Chemical Mechanical Polishing Head Having Floating Wafer Retaining Ring And Wafer Carrier With Multi-Zone Polishing Pressure Control

US Patent:
6309290, Oct 30, 2001
Filed:
Apr 19, 1999
Appl. No.:
9/294547
Inventors:
Huey-Ming Wang - Fremont CA
Gerard S. Moloney - Milpitas CA
Scott Chin - Palo Alto CA
John J. Geraghty - Burlingame CA
William Dyson - San Jose CA
Tanlin K. Dickey - Sunnyvale CA
Assignee:
Mitsubishi Materials Corporation - Tokyo
International Classification:
B24B 502
US Classification:
451398
Abstract:
The invention provides structure and method for achieving a uniformly polished or planarized substrate such as a semiconductor wafer including achieving substantially uniform polishing between the center of the semiconductor wafer and the edge of the wafer. In one aspect the invention provides a polishing apparatus including a housing, a carrier for mounting a substrate to be polished, a retaining ring circumscribing the carrier for retaining the substrate, a first coupling attaching the retaining ring to the carrier such that the retaining ring may move relative to the carrier, a second coupling attaching the carrier to the housing such that the carrier may move relative to the housing, the housing and the first coupling defining a first pressure chamber to exert a pressure force against the retaining ring, and the housing and the second coupling defining a second pressure chamber to exert a pressure force against the subcarrier. In one embodiment, the couplings are diaphragms. In another embodiment, the invention includes a single-or multiple-chambered wafer carrier or subcarrier capable of modifying a differential polishing pressure across the surface of the wafer or other substrate.

Chemical Mechanical Polishing Head Assembly Having Floating Wafer Carrier And Retaining Ring

US Patent:
6231428, May 15, 2001
Filed:
Mar 3, 1999
Appl. No.:
9/261112
Inventors:
Gerard S. Maloney - Milpitas CA
Scott Chin - Palo Alto CA
John J. Geraghty - Burlingame CA
William Dyson - San Jose CA
Tanlin K. Dickey - Sunnyvale CA
Assignee:
Mitsubishi Materials Corporation - Tokyo
International Classification:
B24B 500
US Classification:
451 41
Abstract:
The invention provides structure and method for achieving a uniformly polished or planarized substrate such as a semiconductor wafer including achieving substantially uniform polishing between the center of the semiconductor wafer and the edge of the wafer. In one aspect the invention provides a polishing apparatus including a housing, a carrier for mounting a substrate to be polished, a retaining ring circumscribing the carrier for retaining the substrate, a first coupling attaching the retaining ring to the carrier such that the retaining ring may move relative to the carrier, a second coupling attaching the carrier to the housing such that the carrier may move relative to the housing, the housing and the first coupling defining a first pressure chamber to exert a pressure force against the retaining ring, and the housing and the second coupling defining a second pressure chamber to exert a pressure force against the subcarrier. In one embodiment, the couplings are diaphragms. The invention also provides a retaining ring having a special edge profile that assists in smoothing an pre-compressing the polisihng pad to increase polisihng uniformity.

Possible Relatives

Cynthia A Geraghty  David W Geraghty  Daniel T Geraghty  Denis J Geraghty  Danielle B Geraghty  Dennis B Geraghty  Donna Geraghty  John M Johnson  John Stamps  John R Stan 

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