John G Olenick, 8938586 Yolanda St, Selbyville, DE 19975

5027191, Jun 25, 1991

May 11, 1989

7/350872

Robert A. Bourdelaise - Crofton MD
David B. Harris - Columbia MD
Denise B. Harris - Columbia MD
John A. Olenick - Columbia MD

Westinghouse Electric Corp. - Pittsburgh PA

H01L 2312
H01L 2302

357 74

The invention is an improved chip carrier assembly utilizing a cavity-down chip carrier with a pad grid array wherein the IC chip within the chip carrier is mounted against a surface opposite the PWB to which the chip carrier is attached such that heat transfer from the IC chip may occur along a short path to a heat sink such that a large heat transfer rate is possible. Furthermore, the apparatus utilizes an alignment and electrical connection means between the contact pads of the chip carrier and a PWB to which the chip carrier is attached to compensate for shrinkage variation which occurs during the chip carrier fabrication process. Furthermore, within the cavity of the chip carrier there is space for additional components such as a decoupling capacitors. This permits the design of an apparatus providing better heat transfer properties, more accurate contact pad locations and the option of including within the chip carrier components which in the past had been mounted outside of the chip carrier.

4346608, Aug 31, 1982

Jul 31, 1980

6/174069

John G. Olenick - Laurel MD
Patrick E. Lorenz - Olney MD

The United States of America as represented by the Secretary of the Army - Washington DC

G01N 114

7386321

A float device is provided for density gradient fractionation which permits continuous removal of liquid samples from the surface of the liquid within a tube. The float device floats on the liquid surface and is provided with a centrally disposed length of tubing which extends through the device to provide communication between the liquid surface and a suction source such as a peristaltic pump. A concavity in the bottom of the float assists in removing trapped air and minimizes turbulent flow, thereby assuring high resolution of obtained samples.

5041695, Aug 20, 1991

Jun 1, 1989

7/360071

John A. Olenick - Columbia MD
Allen B. Timberlake - Columbia MD

Westinghouse Electric Corp. - Pittsburgh PA

H01L 2302
H05K 506

174 524

Both a co-fired ceramic package for a power circuit is disclosed as well as a method of manufacture thereof. The package includes a base which is formed from a plurality of pyrolizable ceramic films, each of which includes a heat-conductive and electrically insulative ceramic material such as aluminum nitride, silicon carbide or beryllium oxide embedded within a binder. In the method of the invention, two or three ceramic films are metalized with a pattern of conductive material on their top surfaces. The resulting metalized films are then stacked over a plurality of unmetalized ceramic films, and the resulting aggregate stack is laminated together by the application of heat and pressure. Electrical components are then soldered onto the top surface of the base, and a cover is sealingly connected around the resulting hybrid circuit. The metalization step advantageously forms terminals around the cover which allow access to the heat generating power circuit without the need for glass post seals.