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John J Salazar, 37Gresham, OR

Known as:
John Joseph Salazar
Related to:
Eugene L Miles 98 Alicia Roberts 60 Richard Renfro Rocky Rothrock 54 Cheryl Rothrock Samantha M Parks 44

John Salazar Phones & Addresses

Gresham, OR   

Austin, TX   

Portland, OR   

Gresham, OR   

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Career records & work history

Medicine Doctors

John F. Salazar

Specialties:
Cardiovascular Disease
Work:
University Cardiology AssocsUniversity Cardiology Associates
1348 Walton Way STE 5100, Augusta, GA 30901
706-7248611 (phone) 706-7246202 (fax)
Site
University Cardiology Associates
4350 Towne Ctr Dr STE 1100, Evans, GA 30809
706-8633790 (phone) 706-8633794 (fax)
Education:
Medical School
Medical College of Georgia School of Medicine
Graduated: 1979
Procedures:
Cardiac Stress Test, Angioplasty, Cardiac Catheterization, Cardioversion, Continuous EKG, Echocardiogram, Electrocardiogram (EKG or ECG), Pacemaker and Defibrillator Procedures
Conditions:
Acute Myocardial Infarction (AMI), Aortic Valvular Disease, Conduction Disorders, Abdominal Aortic Aneurysm, Acute Renal Failure, Anemia, Angina Pectoris, Anxiety Phobic Disorders, Aortic Regurgitation, Atherosclerosis, Atrial Fibrillation and Atrial Flutter, Bronchial Asthma, Cardiac Arrhythmia, Cardiomyopathy, Chronic Renal Disease, Congenital Anomalies of the Heart, Dehydration, Diabetes Mellitus (DM), Disorders of Lipoid Metabolism, Fractures, Dislocations, Derangement, and Sprains, Gastroesophageal Reflux Disease (GERD), Gastrointestinal Hemorrhage, Gout, Heart Failure, Hypertension (HTN), Hypothyroidism, Ischemic Bowel Disease, Ischemic Heart Disease, Ischemic Stroke, Mitral Valvular Disease, Obstructive Sleep Apnea, Overweight and Obesity, Paroxysmal Supreventricular Tachycardia (PSVT), Pericardidtis, Pneumonia, Pulmonary Embolism, Raynaud's Disease, Rheumatoid Arthritis, Septicemia, Thoracid Aortic Aneurysm, Transient Cerebral Ischemia, Valvular Heart Disease
Languages:
English, Spanish
Description:
Dr. Salazar graduated from the Medical College of Georgia School of Medicine in 1979. He works in Augusta, GA and 1 other location and specializes in Cardiovascular Disease. Dr. Salazar is affiliated with Optim Medical Center Jenkins, Select Specialty Hospital and University Hospital.

John Salazar

Specialties:
Pain Management
Work:
Presbyterian Medical GroupPresbyterian Pain & Spine Center
8300 Constitution Ave NE STE 102, Albuquerque, NM 87110
505-2912770 (phone) 505-2912707 (fax)
Site
Languages:
Arabic, English, Spanish
Description:
Mr. Salazar works in Albuquerque, NM and specializes in Pain Management. Mr. Salazar is affiliated with Presbyterian Kaseman Hospital.

License Records

John S Salazar

Licenses:
License #: 7981 - Active
Category: Tow Truck Operator (Incident Management)
Expiration Date: May 5, 2017

John Salazar

Licenses:
License #: 009561 - Active
Category: WELDER
Issued Date: Aug 10, 2011
Expiration Date: Jul 31, 2017

John P Salazar

Phone:
904-3088096
Licenses:
License #: 9480 - Expired
Category: Health Care
Issued Date: Aug 8, 1997
Effective Date: Jan 1, 1901
Expiration Date: Jan 31, 1999
Type: Certified Respiratory Therapist

Publications & IP owners

Us Patents

Apparatus For Functional And Stress Testing Of Exposed Chip Land Grid Array Devices

US Patent:
6911836, Jun 28, 2005
Filed:
Aug 21, 2003
Appl. No.:
10/645038
Inventors:
Lonnie J. Cannon - Austin TX, US
David Lewis Gardell - Fairfax VT, US
Jose Arturo Garza - Pflugerville TX, US
Jeffrey Frank Kutner - Pleasant Valley NY, US
Kenneth Carl Larsen - Georgetown TX, US
John Joseph Salazar - Austin TX, US
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
G01R031/26
US Classification:
324765, 324760, 3241581
Abstract:
A chip testing system with improved thermal performance. In a preferred embodiment, a nest assembly of a chip testing apparatus includes tooling balls and a fitted frame for improving alignment of a coldplate and a chip surface. In preferred embodiments, the coldplate is of unibody design. Thermal performance is also improved by balancing the forces exerted on the coldplate using an adjustable hose mounting bracket. The bracket allows the forces exerted by the hoses on the coldplate to be adjusted so they balance and cancel other unwanted forces on the cold plate.

Functional And Stress Testing Of Lga Devices

US Patent:
7352200, Apr 1, 2008
Filed:
Jan 12, 2005
Appl. No.:
11/033935
Inventors:
Jose Arturo Garza - Pflugerville TX, US
Dales Morrison Kent - Round Rock TX, US
Kenneth Carl Larsen - Georgetown TX, US
Hoa Thanh Phan - Austin TX, US
John Joseph Salazar - Austin TX, US
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
G01R 31/02
US Classification:
324765, 324760, 3241581
Abstract:
Improved methods, systems, and apparatuses are disclosed for testing LGA devices. One example embodiment include vertical routing of test nest assembly cooling lines in order to minimize the test nest footprint and increase available test sites on a single test card. Another example embodiment includes isolating and adjusting external loads and moments into the heatsink/cold plate, wherein these loads and moments involve controlling the centroid to restore more ideal thermal performance of the heatsink/chip interface. Still another example embodiment includes a nest architecture facilitating easy and low-cost replacement of LGA sockets. Finally, another example embodiment includes efficient condensation control of test nest assembly parts by using dry-air exhaust.

Functional And Stress Testing Of Lga Devices

US Patent:
7405583, Jul 29, 2008
Filed:
May 10, 2007
Appl. No.:
11/747200
Inventors:
Jose Arturo Garza - Pflugerville TX, US
Dales Morrison Kent - Round Rock TX, US
Kenneth Carl Larsen - Georgetown TX, US
Hoa Thanh Phan - Austin TX, US
John Joseph Salazar - Austin TX, US
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
G01R 31/02
US Classification:
324755, 324760, 324765
Abstract:
Improved methods, systems, and apparatuses are disclosed for testing LGA devices. One example embodiment include vertical routing of test nest assembly cooling lines in order to minimize the test nest footprint and increase available test sites on a single test card. Another example embodiment includes isolating and adjusting external loads and moments into the heatsink/cold plate, wherein these loads and moments involve controlling the centroid to restore more ideal thermal performance of the heatsink/chip interface. Still another example embodiment includes a nest architecture facilitating easy and low-cost replacement of LGA sockets. Finally, another example embodiment includes efficient condensation control of test nest assembly parts by using dry-air exhaust.

Functional And Stress Testing Of Lga Devices

US Patent:
7423440, Sep 9, 2008
Filed:
May 10, 2007
Appl. No.:
11/747207
Inventors:
Jose Arturo Garza - Pflugerville TX, US
Dales Morrison Kent - Round Rock TX, US
Kenneth Carl Larsen - Georgetown TX, US
Hoa Thanh Phan - Austin TX, US
John Joseph Salazar - Austin TX, US
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
G01R 31/02
US Classification:
324760, 324765, 3241581
Abstract:
Improved methods, systems, and apparatuses are disclosed for testing LGA devices. One example embodiment include vertical routing of test nest assembly cooling lines in order to minimize the test nest footprint and increase available test sites on a single test card. Another example embodiment includes isolating and adjusting external loads and moments into the heatsink/cold plate, wherein these loads and moments involve controlling the centroid to restore more ideal thermal performance of the heatsink/chip interface. Still another example embodiment includes a nest architecture facilitating easy and low-cost replacement of LGA sockets. Finally, another example embodiment includes efficient condensation control of test nest assembly parts by using dry-air exhaust.

Functional And Stress Testing Of Lga Devices

US Patent:
7425822, Sep 16, 2008
Filed:
May 10, 2007
Appl. No.:
11/747216
Inventors:
Jose Arturo Garza - Pflugerville TX, US
Dales Morrison Kent - Round Rock TX, US
Kenneth Carl Larsen - Georgetown TX, US
Hoa Thanh Phan - Austin TX, US
John Joseph Salazar - Austin TX, US
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
G01R 31/02
US Classification:
3241581, 324760, 324765
Abstract:
Improved methods, systems, and apparatuses are disclosed for testing LGA devices. One example embodiment include vertical routing of test nest assembly cooling lines in order to minimize the test nest footprint and increase available test sites on a single test card. Another example embodiment includes isolating and adjusting external loads and moments into the heatsink/cold plate, wherein these loads and moments involve controlling the centroid to restore more ideal thermal performance of the heatsink/chip interface. Still another example embodiment includes a nest architecture facilitating easy and low-cost replacement of LGA sockets. Finally, another example embodiment includes efficient condensation control of test nest assembly parts by using dry-air exhaust.

Functional And Stress Testing Of Lga Devices

US Patent:
7453279, Nov 18, 2008
Filed:
May 10, 2007
Appl. No.:
11/747197
Inventors:
Jose Arturo Garza - Pflugerville TX, US
Dales Morrison Kent - Round Rock TX, US
Kenneth Carl Larsen - Georgetown TX, US
Hoa Thanh Phan - Austin TX, US
John Joseph Salazar - Austin TX, US
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
G01R 31/02
US Classification:
324765, 324760, 3241581
Abstract:
Improved methods, systems, and apparatuses are disclosed for testing LGA devices. One example embodiment include vertical routing of test nest assembly cooling lines in order to minimize the test nest footprint and increase available test sites on a single test card. Another example embodiment includes isolating and adjusting external loads and moments into the heatsink/cold plate, wherein these loads and moments involve controlling the centroid to restore more ideal thermal performance of the heatsink/chip interface. Still another example embodiment includes a nest architecture facilitating easy and low-cost replacement of LGA sockets. Finally, another example embodiment includes efficient condensation control of test nest assembly parts by using dry-air exhaust.

Functional And Stress Testing Of Lga Devices

US Patent:
7456644, Nov 25, 2008
Filed:
May 10, 2007
Appl. No.:
11/747210
Inventors:
Jose Arturo Garza - Pflugerville TX, US
Dales Morrison Kent - Round Rock TX, US
Kenneth Carl Larsen - Georgetown TX, US
Hoa Thanh Phan - Austin TX, US
John Joseph Salazar - Austin TX, US
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
G01R 31/02
US Classification:
324755, 324760, 324765
Abstract:
Improved methods, systems, and apparatuses are disclosed for testing LGA devices. One example embodiment include vertical routing of test nest assembly cooling lines in order to minimize the test nest footprint and increase available test sites on a single test card. Another example embodiment includes isolating and adjusting external loads and moments into the heatsink/cold plate, wherein these loads and moments involve controlling the centroid to restore more ideal thermal performance of the heatsink/chip interface. Still another example embodiment includes a nest architecture facilitating easy and low-cost replacement of LGA sockets. Finally, another example embodiment includes efficient condensation control of test nest assembly parts by using dry-air exhaust.

Functional And Stress Testing Of Lga Devices

US Patent:
7463017, Dec 9, 2008
Filed:
May 10, 2007
Appl. No.:
11/747213
Inventors:
Jose Arturo Garza - Pflugerville TX, US
Dales Morrison Kent - Round Rock TX, US
Kenneth Carl Larsen - Georgetown TX, US
Hoa Thanh Phan - Austin TX, US
John Joseph Salazar - Austin TX, US
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
G01R 31/02
US Classification:
3241581, 324760, 324765
Abstract:
Improved methods, systems, and apparatuses are disclosed for testing LGA devices. One example embodiment include vertical routing of test nest assembly cooling lines in order to minimize the test nest footprint and increase available test sites on a single test card. Another example embodiment includes isolating and adjusting external loads and moments into the heatsink/cold plate, wherein these loads and moments involve controlling the centroid to restore more ideal thermal performance of the heatsink/chip interface. Still another example embodiment includes a nest architecture facilitating easy and low-cost replacement of LGA sockets. Finally, another example embodiment includes efficient condensation control of test nest assembly parts by using dry-air exhaust.

Possible Relatives

Cynthia F Salazar  David E Salazar  Daxton M Salazar  Dean Salazar  Deanna K Salazar  Debbie Salazar  Dalia P Salazar  John M Johnson  John Stamps  John R Stan 

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