Joseph Apap resumes & CV records
Resumes
Joseph Apap
Location:
United States
Joseph A Apap, 75Palm City, FL
Joseph Apap Phones & Addresses
Palm City, FL
174 Roberta Dr, Hendersonville, TN 37075 607-7485014
5580 State Route 38, Newark Valley, NY 13811 607-6428687
117 Robble Ave, Endicott, NY 13760 607-7485014
701 Hooper Rd, Endicott, NY 13760 607-7485014
Franklin, TN
Rhinebeck, NY
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Joseph A Apap
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Publications & IP owners
Us Patents
Substrate Soldering In A Reducing Atmosphere
US Patent:
5145104, Sep 8, 1992
Filed:
Mar 21, 1991
Appl. No.:
7/672804
Inventors:
Joseph A. Apap - Endicott NY
Mark A. Brown - Whitney Point NY
Alan J. Emerick - Warren Center PA
Thomas L. Miller - Vestal NY
James R. Murray - Owego NY
David W. Sissenstein - Endwell NY
Mark A. Brown - Whitney Point NY
Alan J. Emerick - Warren Center PA
Thomas L. Miller - Vestal NY
James R. Murray - Owego NY
David W. Sissenstein - Endwell NY
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
B23K 3102
US Classification:
228179
Abstract:
An improved method and apparatus for making solder connections from input/output connecting pins to the circuitry on a pinned metallized ceramic substrate. A solder preform in the shape of a sphere provides the correct volume of solder. These spheres are held in position at each desired joint by a templet. The substrate, solder sphere and templet assembly is passed through a furnace in a reducing atmosphere and at a temperature to facilitate solder reflow and wetting, thus creating a sound mechanical and electrical connection between the pin and its portion of the circuitry. The method and apparatus of the invention provides joints have a high degree of reliability such that all connections are made to acceptable soldering standards, none lacking integrity. Only harmless by-products are produced in the practice of the invention, and no residue is produced which requires cleaning by means of chemical solvents and therefore is environmentally superior.
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