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Joseph R Funari, 42Tavistock, NJ

Known as:
Joseph Funary
Related to:
Randy R Shoun Charlie Spell 32

Joseph Funari Phones & Addresses

Haddonfield, NJ   

233 Harlequin Ct, New Castle, DE 19720    302-3269122   

Newark, DE   

Sewell, NJ   

233 Harlequin Dr, New Castle, DE 19720   

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Joseph R Funari

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Work

Company: National restoration Aug 2013 Position: Tech/carpenter

Education

School / High School: University of Delaware- Newark, DE 2006 Specialities: Bachelor of Science in Chemical Engineering

Skills

Data Organization • Data Analysis • Fluent In Spanish • Customer Satisfaction • Curriculum Design • Lesson Planning • Classroom • Statistics • Technical Writing • Analysis • Biotechnology • Visio • Access • Analytics • Business Analysis

Languages

English • Italian

Interests

Exercise • Home Improvement • Reading • New Technologies • Gourmet Cooking • Sports • Health and Wellness • Home Decoration • Health • Cooking • Electronics • Crafts • Fitness • Music • Movies • Kids • Medicine • Automobiles • Travel • Career • Personal Improvement

Industries

Chemicals
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Joseph Funari resumes & CV records

Resumes

Joseph Funari Photo 15

Outbound Associate

Location:
233 Harlequin Dr, New Castle, DE 19720
Industry:
Chemicals
Work:
Amazon Fulfillment Services
Outbound Associate The Home Depot Jun 2014 - Jun 2015
Customer Service Associate The Home Depot Jun 2014 - Jun 2015
Lumber Associate National Restoration Aug 2013 - Feb 2014
Field Technician Taco Bell May 2012 - Aug 2013
Team Member Integrity Staffing & Solutions Nov 2012 - Jan 2013
Packing at Amazon Newark High School Christina School District Aug 2009 - Jun 2010
Math Teacher Healy*S Café Jun 2004 - Mar 2008
Manager Funari*S Thriftway May 1998 - Aug 2002
Chef's Assistant
Education:
University of Delaware 2001 - 2005
Bachelors, Bachelor of Science, Chemical Engineering Salesianum High School 1997 - 2001
Skills:
Data Organization, Data Analysis, Fluent In Spanish, Customer Satisfaction, Curriculum Design, Lesson Planning, Classroom, Statistics, Technical Writing, Analysis, Biotechnology, Visio, Access, Analytics, Business Analysis
Interests:
Exercise
Home Improvement
Reading
New Technologies
Gourmet Cooking
Sports
Health and Wellness
Home Decoration
Health
Cooking
Electronics
Crafts
Fitness
Music
Movies
Kids
Medicine
Automobiles
Travel
Career
Personal Improvement
Languages:
English
Italian
Joseph Funari Photo 16

Joseph Funari - New Castle, DE

Work:
National Restoration Aug 2013 to Jan 2014
Tech/Carpenter Amazon/Integrity Staffing Solutions Nov 2012 to Jan 2013
Seasonal Associate New Jersey Restaurants, LP May 2012 to Nov 2012
Team Member Newark High School Aug 2009 to Jun 2010
Math Teacher Healy's Cafe Jun 2004 to Mar 2009
Manager
Education:
University of Delaware - Newark, DE 2006
Bachelor of Science in Chemical Engineering

Publications & IP owners

Us Patents

Multi-Layer, Multi-Chip Pyramid And Circuit Board Structure

US Patent:
5715144, Feb 3, 1998
Filed:
May 24, 1996
Appl. No.:
8/653092
Inventors:
Joseph George Ameen - Newark DE
Joseph Funari - Vestal NY
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H01R 2368
H05K 111
US Classification:
361790
Abstract:
The present invention provides multi-layer multi-chip circuit board comprising at least two ATAB carriers having chips thereon, stacked upon each other in a pyramid configuration and attached to a substrate, thus reducing the required area on the substrate for mounting components to form a circuit board.

Circuit Boards That Can Accept A Pluggable Tab Module That Can Be Attached Or Removed Without Solder

US Patent:
5744759, Apr 28, 1998
Filed:
May 29, 1996
Appl. No.:
8/655363
Inventors:
Joseph George Ameen - Newark DE
Joseph Funari - Vestal NY
Michael John Funari - Apalachin NY
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H05K 116
US Classification:
174260
Abstract:
The present invention relates to a circuitized board having removable flexible modules disposed thereon. The flexible modules are mechanically and electrically connected to the board to provide an apertured connect, yet may be easily removed without using heat. The invention also relates to a circuit package including a substrate and a flexible module. The substrate includes a circuit board, a plurality of pads affixed to the circuit board, and a plurality of gold plated metal balls affixed atop the pads. The flexible module includes a flexible dielectric member and gold plated vias disposed in the flexible dielectric member wherein at least some of the vias are positioned over the metal balls so that a line contact is made between the vias and the metal balls.

Process For Manufacturing Boards That Can Accept A Pluggable Tab Module That Can Be Attached Or Removed Without Solder

US Patent:
6070785, Jun 6, 2000
Filed:
Jan 8, 1998
Appl. No.:
9/004588
Inventors:
Joseph George Ameen - Newark DE
Joseph Funari - Vestal NY
Michael John Funari - Apalachin NY
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
B23K 2002
US Classification:
228115
Abstract:
The invention relates to a process for attaching a demountable flexible module to a circuit board, and includes the following steps: providing a circuit board having at least one, preferably a plurality, of gold plated metal balls disposed thereon; providing a flexible module having at least one, preferably a plurality, of gold plated vias disposed therein; positioning an elastomer stop over the circuit board; positioning the flexible module over the balls; applying pressure to the flexible module for a time sufficient to form a line contact between the gold plating on the vias and the gold plating on the metal ball of the circuit board, wherein the module is removable without heating the module. The process does not use solder to attach the module to the board, and requires substantially less than 2000 psi, and preferably less than 400 psi, to attach the module which produces little, if any, deformation to the flexible module.

Multi-Layer-Multi-Chip Pyramid And Circuit Board Structure And Method Of Forming Same

US Patent:
5907903, Jun 1, 1999
Filed:
Jan 8, 1998
Appl. No.:
9/004523
Inventors:
Joseph George Ameen - Newark DE
Joseph Funari - Vestal NY
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H05K 336
US Classification:
29830
Abstract:
The present invention provides multi-layer multi-chip circuit board comprising at least two ATAB carriers having chips thereon, stacked upon each other in a pyramid configuration and attached to a substrate, thus reducing the required area on the substrate for mounting components to form a circuit board.

Possible Relatives

Ernest N Funari  Frank E Funari  Heather N Funari  Helen C Funari  Katherine Funari  Michael A Funari  Morgan C Funari  Joseph J Johnson  Joseph D Stamps  Joseph N Stancil 

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