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Joseph S Maniscalco, 767 Bell Pl, Yonkers, NY 10701

Joseph Maniscalco Phones & Addresses

7 Bell Pl, Yonkers, NY 10701    914-9654434   

11 Tompkins Ave, Ossining, NY 10562    914-7629603   

Phoenix, AZ   

Mount Kisco, NY   

Encino, CA   

Jonesville, MI   

Mentions for Joseph S Maniscalco

Career records & work history

Lawyers & Attorneys

Joseph Maniscalco Photo 1

Joseph S. Maniscalco, Wantagh NY - Lawyer

Address:
LaMonica Herbst & Maniscalco, LLP
3305 Jerusalem Avenue Suite 201, Wantagh, NY 11793
516-8266500 (Office), 516-8260222 (Fax)
Licenses:
New York - Currently registered 1996
Education:
Hofstra University School of LawDegree JD - Juris Doctor - LawGraduated 1995
Fordham UniversityDegree BA - Bachelor of ArtsGraduated 1992
Specialties:
Bankruptcy / Debt - 20%
Debt Collection - 20%
Commercial - 20%
Real Estate - 20%
General Practice - 20%
Associations:
American Bankruptcy Institute
American Trial Lawyers Association
Columbian Lawyers Association of Nassau County
Nassau County Bar Association
National Association of Bankruptcy Trustees
New York State Bar Association
Turnaround Management Association
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Joseph Maniscalco - Lawyer

ISLN:
1000334736
Admitted:
2017
University:
Brooklyn Law School
Joseph Maniscalco Photo 3

Joseph S. Maniscalco, Wantagh NY - Lawyer

Office:
LaMonica Herbst & Maniscalco, LLP
3305 Jerusalem Avenue, Suite 201, Wantagh, NY 11793
Phone:
516-8266500 (Phone), 516-8260222 (Fax)
Specialties:
Bankruptcy, Litigation, Real Estate, Corporate Transactions
Memberships:
Nassau County (Former Chairman, Bankruptcy Law Committee), New York State and American Bar Associations, The Association of Trial Lawyers of America, National Association of Bankruptcy Trustees, American Bankruptcy Institute, Chamber of Commerce.
ISLN:
910221427
Admitted:
1996, New York and U.S. District Court, Eastern and Southern Districts of New York
University:
Fordham University, B.A., 1992
Law School:
Hofstra University, J.D., 1995
Links:
Site
Biography:
First Place in New York State Bar Association Environmental Law Essay Contest. Certified Mediator. Author: "At the Crossroads of Environmental Laws and the Bankruptcy Code: Trustee Personal Liability ...
Joseph Maniscalco Photo 4

Joseph Maniscalco, Wantagh NY - Lawyer

Address:
3305 Jerusalem Ave, Wantagh, NY 11793
Phone:
516-8266500 (Phone)
Experience:
29 years
Specialties:
Bankruptcy, Real Estate Law
Jurisdiction:
New York (1996)
Law School:
Hofstra Law School
Education:
Hofstra Law School
Memberships:
New York State Bar (1996)

Medicine Doctors

Joseph Maniscalco Photo 5

Dr. Joseph Maniscalco, Bellmore NY - DDS (Doctor of Dental Surgery)

Specialties:
Prosthodontics
Address:
2814A Merrick Rd, Bellmore, NY 11710
516-7817567 (Phone)
Languages:
English

Joseph Maniscalco resumes & CV records

Resumes

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Joseph Maniscalco

Joseph Maniscalco Photo 46

Joseph Maniscalco

Joseph Maniscalco Photo 47

Joseph Maniscalco

Joseph Maniscalco Photo 48

G450C Advisory Process Engineer @ College Of Nanoscale Science And Engineering

Location:
United States
Joseph Maniscalco Photo 49

Joseph Maniscalco

Location:
United States
Joseph Maniscalco Photo 50

Joseph Maniscalco - Staten Island, NY

Work:
Abiding Real Estate Agency, Inc Nov 1992 to 2000
Associate Broker
Abiding Real Estate Agency, Inc - Staten Island, NY Oct 2011 to Mar 2012
Sales Associate
Abiding Real Estate Agency, Inc - New York, NY Feb 2008 to Sep 2009
Community Liaison
New York City Department of Education - New York, NY Apr 2005 to Feb 2008
K-8 Teacher
Elementary & Intermediate School Nov 1992 to Jun 2001
Teacher
Education:
College of Staten Island - Staten Island, NY 2001
Master of Arts in Elementary Education
Italian International Institute - Firenze, Toscana 1992
Bachelor of Arts in English Literature
Joseph Maniscalco Photo 51

Joseph Maniscalco - Holbrook, NY

Work:
FREELANCE 2005 to 2000 MSG VARSITY 2011 to 2012
ADVANTAGE SALES AND MARKETING
MSG VARSITY - Woodbury, NY 2009 to 2012
Field Producer, editor, camera operator
Education:
Connecticut School of Broadcasting - Westbury, NY 2005
technology

Publications & IP owners

Us Patents

Processing System For Combined Metal Deposition And Reflow Anneal For Forming Interconnect Structures

US Patent:
2014021, Aug 7, 2014
Filed:
Sep 10, 2013
Appl. No.:
14/022861
Inventors:
- Armonk NY, US
Stephan A. Cohen - Wappingers Falls NY, US
Joseph F. Maniscalco - Lake Katrine NY, US
Assignee:
INTERNATIONAL BUSINESS MACHINES CORPORATION - Armonk NY
International Classification:
H01L 21/02
US Classification:
118719
Abstract:
An interconnect conductive metal used in forming an interconnect structure can be formed using a method in which deposition of a metal liner and a reflow anneal are performed in a same multi-chambered processing system without exposing the structure to air between the steps of deposition and reflow annealing. In the disclosure, an interconnect dielectric material including an opening is placed within the multi-chambered processing system and then the interconnect dielectric material is transferred, under vacuum, to a deposition chamber in which the metal liner is deposited. The interconnect dielectric material including the metal liner is then transferred, under the same vacuum, to an annealing chamber in which a reflow anneal is performed.

Processing System For Combined Metal Deposition And Reflow Anneal For Forming Interconnect Structures

US Patent:
2014022, Aug 7, 2014
Filed:
Feb 5, 2013
Appl. No.:
13/759654
Inventors:
INTERNATIONAL BUSINESS MACHINES CORPORATION - , US
Stephan A. Cohen - Wappingers Falls NY, US
Joseph F. Maniscalco - Lake Katrine NY, US
Assignee:
INTERNATIONAL BUSINESS MACHINES CORPORATION - Armonk NY
International Classification:
H01L 21/02
US Classification:
438653, 118719
Abstract:
An interconnect conductive metal used in forming an interconnect structure can be formed using a method in which deposition of a metal liner and a reflow anneal are performed in a same multi-chambered processing system without exposing the structure to air between the steps of deposition and reflow annealing. In the disclosure, an interconnect dielectric material including an opening is placed within the multi-chambered processing system and then the interconnect dielectric material is transferred, under vacuum, to a deposition chamber in which the metal liner is deposited. The interconnect dielectric material including the metal liner is then transferred, under the same vacuum, to an annealing chamber in which a reflow anneal is performed.

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