Joseph J Sniezek, 67210 Harding Ave, Endicott, NY 13760

6370012, Apr 9, 2002

Aug 30, 2000

09/652596

Sylvia Adae-Amoakoh - Binghamton NY
John M. Lauffer - Waverly NY
Michael D. Lowell - Endicott NY
Voya R. Markovich - Endwell NY
Joseph J. Sniezek - Endwell NY

International Business Machines Corporation - Armonk NY

H01G 4228

3613063, 361303, 361311

A parallel capacitor structure capable of forming an internal part of a larger circuit board or the like structure to provide capacitance therefore. Alternatively, the capacitor may be used as an interconnector to interconnect two different electronic components (e. g. , chip carriers, circuit boards, and even semiconductor chips) while still providing desired levels of capacitance for one or more of said components. The capacitor includes at least one internal conductive layer, two additional conductor layers added on opposite sides of the internal conductor, and inorganic dielectric material (preferably an oxide layer on the second conductor layers outer surfaces or a suitable dielectric material such as barium titanate applied to the second conductor layers). Further, the capacitor includes outer conductor layers atop the inorganic dielectric material, thus forming a parallel capacitor between the internal and added conductive layers and the outer conductors.

6524352, Feb 25, 2003

Jan 9, 2002

10/043830

Sylvia Adae-Amoakoh - Binghamton NY
John M. Lauffer - Waverly NY
Michael D. Lowell - Endicott NY
Voya R. Markovich - Endwell NY
Joseph J. Sniezek - Endwell NY

International Business Machines Corporation - Armonk NY

H01G 900

29 2503, 3613013, 3613063, 427 79

A parallel capacitor structure capable of forming an internal part of a larger circuit board or the like structure to provide capacitance therefore. Alternatively, the capacitor may be used as an interconnector to interconnect two different electronic components (e. g. , chip carriers, circuit boards, and even semiconductor chips) while still providing desired levels of capacitance for one or more of said components. The capacitor includes at least one internal conductive layer, two additional conductor layers added on opposite sides of the internal conductor, and inorganic dielectric material (preferably an oxide layer on the second conductor layers outer surfaces or a suitable dielectric material such as barium titanate applied to the second conductor layers). Further, the capacitor includes outer conductor layers atop the inorganic dielectric material, thus forming a parallel capacitor between the internal and added conductive layers and the outer conductors.

6570102, May 27, 2003

Jun 11, 2001

09/878533

Thomas Richard Miller - Endwell NY
Konstantinos I. Papathomas - Endicott NY
Brian Eugene Curcio - Binghamton NY
Joseph J. Sniezek - Endwell NY

International Business Machines Corporation - Armonk NY

H01R 1204

174261, 174262, 29832

A method and arrangement for creating an impedance controlled printing wiring board, particularly the formation of a structure for high speed printed wiring boards incorporating multiple differential impedance controlled layers. Furthermore, there are provided vias of either through-holes, blind holes and buried holes filled with a conductive paste material to form electrical interconnections with conductive layers of the printed wiring board.

4971715, Nov 20, 1990

Nov 18, 1988

7/272847

Richard G. Armant - Vestal NY
Edward L. Arrington - Owego NY
Anilkumar C. Bhatt - Johnson City NY
Donald M. Egleton - Endicott NY
Frederick M. Ortloff - Binghamton NY
Joseph J. Sniezek - Endwell NY
John A. Welsh - Binghamton NY

International Business Machines Corporation - Armonk NY

C11D 750
C11D 112

252143

A stripping composition containing O-dichlorobenzene, dodecylbenzene sulfonic acid, perchloroethylene, and optionally an aromatic hydrocarbon containing at least 8 carbon atoms, and use thereof for removing photoresist.