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Kai Hu, 45San Jose, CA

Kai Hu Phones & Addresses

San Jose, CA   

San Bruno, CA   

Schaumburg, IL   

Santa Clara, CA   

Ann Arbor, MI   

Walton, KY   

Newport, KY   

Cincinnati, OH   

Mill Creek, WA   

Mentions for Kai Hu

Career records & work history

License Records

Kai Hu

Licenses:
License #: 57583 - Active
Issued Date: Jan 20, 1994
Renew Date: Jan 20, 1994
Type: Engineer Intern

Kai Hu resumes & CV records

Resumes

Kai Hu Photo 27

Kai Hu

Location:
San Francisco Bay Area
Industry:
Information Technology and Services
Kai Hu Photo 28

Group Chief Executive Officer

Location:
Santa Clara, CA
Industry:
Airlines/Aviation
Work:
America Tovisa
Group Chief Executive Officer
America Tovisa Travel
Chief Executive Officer
Skills:
管理人员, 顾客服务, 战略规划, 营销战略, 经营策略, 团队建设, 新业务开发, 业务开发, 经营规划, 团队领导力
Languages:
Chinese
English
Certifications:
Securities Analyst
Technical Securities Analysts Association
Kai Hu Photo 29

Senior Technical Support Engineer

Location:
7858 Spring Hill St, Chino, CA 91708
Industry:
Computer Hardware
Work:
Kingston Jan 2008 - May 2014
Product Engineer
Kingston Jan 2008 - May 2014
Senior Technical Support Engineer
Kingston Jun 2006 - Jan 2008
Senior Technology Programs Manager
Storcase Technology Mar 2003 - Jun 2006
Validation Project Manager
Storcase Technology Mar 1990 - Mar 2003
Technical Support Manager
Architectural Factors Oct 1984 - Feb 1990
Associate Architectural Designer
Education:
Valley High School, Las Vegas, Nv
The Collins College of Hospitality Management at Cal Poly Pomona
Skills:
Product Development, Cross Functional Team Leadership, Customer Service, Project Management, Customer Focused Service, Teamwork, Technical Documentation, Product Engineer, Creative Problem Solving, Leadership, Analytic Problem Solving, Technical Training, Concise Communication, Business Process Improvement, Computer Hardware, Product Validation, Sales Operations, Key Account Management, Data Storage Technologies, Architectural Design, Landscape Architecture, Blueprint Reading, Architectural Drawings, 3D Architectural Rendering, Construction Drawings, Database Management, Trade Shows
Languages:
English
Mandarin
Kai Hu Photo 30

Kai Hu

Position:
SDE II at Lab126
Location:
San Francisco Bay Area
Industry:
Computer Software
Work:
Lab126 - Cupertino since Sep 2011
SDE II
Lab126 - Cupertino Jul 2010 - Aug 2011
SDE I
Qualcomm Sep 2008 - Jan 2009
Digital Design Intern
Qualcomm Sep 2007 - Dec 2007
Performance Optimization
Qualcomm Jan 2007 - Apr 2007
Device Drivers Intern
Research In Motion May 2006 - Sep 2006
Embedded Software Developer Intern
Education:
University of Waterloo 2004 - 2009
Forest Hill Collegiate Institute
Kai Hu Photo 31

Sde-Wireless

Location:
San Francisco Bay Area
Industry:
Telecommunications

Publications & IP owners

Us Patents

Method And Circuit Board Panel For Circuit Board Manufacturing That Prevents Assembly-Line Delamination And Sagging

US Patent:
5831218, Nov 3, 1998
Filed:
Jun 28, 1996
Appl. No.:
8/672736
Inventors:
Kai X. Hu - Cary IL
Xinyu Dou - Fox River Grove IL
Don Dillard - Mundelein IL
Gary Mui - Wheeling IL
Tom Brey - Lake In The Hills IL
Rich Dlesk - Grayslake IL
Karl Wyatt - Cary IL
Dave Roller - Libertyville IL
Assignee:
Motorola, Inc. - Schaumburg IL
International Classification:
H05K 100
US Classification:
174250
Abstract:
Board delamination during the singulation from a board panel and board sagging during front-end assembly are two biggest problems encountered in cellular manufacturing lines. The method (700) and circuit board panel (600) of the present invention substantially eliminate assembly-line delamination and sagging for circuit board manufacturing. A number of slots are punched to fit into a circuit board profile. V-grooves are cut along each of the circuit board profiles through the slots and directly opposite on a top and bottom of the circuit board. Thus, optimization of the cut-outs and v-groove configurations eliminate tearing/delamination and substantially reduce sagging.

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