Kathleen A StalterConcord Township, OH

6360938, Mar 26, 2002

Feb 27, 2001

09/794597

Stephen A. DeLaurentis - Claverack NY
Mario J. Interrante - New Paltz NY
Raymond A. Jackson - Fishkill NY
John U. Knickerbocker - Hopewell Junction NY
Sudipta K. Ray - Wappingers Falls NY
Kathleen A. Stalter - Hopewell Junction NY

International Business Machines Corporation - Armonk NY

B23K 1018

228191, 228119, 228264

A process and apparatus for removing flip chips with C4 joints mounted on a multi-chip module by applying a tensile force to one or more removal member bonded to the back of one or more flip chips during heating of the module to a temperature sufficient to cause the C4 joints to become molten. The tensile force can either be a compressed spring, or a bi-metallic member which is flat at room temperature and becomes curved when heated to such temperature, or a memory alloy whose original shape is curved and which is bent flat at room temperature but returns to its original curved shape when heated to such temperature. An adhesive is used to bond the removal member to the chip to be removed and is a low temperature, fast curing adhesive with high temperature tolerance after curing.

6548909, Apr 15, 2003

Apr 3, 2001

09/825512

Peter J. Brofman - Hopewell Junction NY
Sudipta K. Ray - Wappingers Falls NY
Kathleen A. Stalter - Hopewell Junction NY

International Business Machines Corporation - Armonk NY

H01L 2144

257777, 257678, 257700, 257734

A method of interconnecting electronic components by using a plurality of conductive studs on a surface of a first electronic component and a plurality of corresponding conductive vias on the surface of a second electronic component. Camber on the surface of electronic components may be overcome by coating the surface with a dielectric, planarizing the dielectric, and forming conductive vias corresponding to the contact pads thereon. The conductive studs are substantially lead-free and preferably comprise of copper.

6559527, May 6, 2003

Jan 3, 2001

09/753819

Peter Jeffrey Brofman - Hopewell Junction NY
Shaji Farooq - Hopewell Junction NY
John U. Knickerbocker - Hopewell Junction NY
Scott Ira Langenthal - Hyde Park NY
Sudipta Kumar Ray - Wappingers Falls NY
Kathleen Ann Stalter - Hopewell Junction NY

International Business Machines Corporation - Armonk NY

H01L 2302

257678, 257734, 257773, 257779, 257723, 257724, 257772, 438106, 438108, 438128, 438121, 438618, 438666, 438612

A method of forming non-spherically shaped solder interconnects, preferably conical, for attachment of electronic components in an electronic module. Preferably, the solder interconnects of the present invention are cone shaped and comprise of depositing a first solder followed by a second solder having a lower reflow temperature than the first solder. Warm placement of the electronic component at a somewhat elevated temperature than room temperature but less than the solder reflow temperature reduces the force required during placement of a semiconductor chip to a substrate. After warm placement, reflow of the module occurs at the lower reflow temperature of the second solder. The conical shape of the solder interconnects are formed by a heated coining die which may also coin a portion of the interconnects with flat surfaces for stand-offs. The ability of the cone shaped solder interconnects to meet the opposing surface of a chip or substrate at different heights accommodates the camber typically associated with chip and substrate surfaces.

6584684, Jul 1, 2003

Mar 13, 2001

09/804885

Peter J. Brofman - Hopewell Junction NY
Anson J. Call - Poughkeepsie NY
Jeffrey T. Coffin - Pleasant Valley NY
Kathleen A. Stalter - Hopewell Junction NY

International Business Machines - Armonk NY

H05K 334

29840, 29830, 29831, 29834, 29836, 29841, 1562722, 1562744, 228175, 22818021, 22818022

A module or assembly is formed by interposing a polymer between a carrier and a semiconductor device to be secured to the carrier. The polymer has ionized metallic particles suspended in it. Before setting or curing the polymer, the module is exposed to an electric field which induces migration of the metallic particles to the opposing pads of the carrier and semiconductor device. Such migration ultimately forms metal dendrites extending between mating pad pairs. The dendrites establish a metallurgical bond and conductive paths between the carrier and the overlying semiconductor device. When the polymer is subsequently set, the carrier and device are not only adhered to each other, but the dendrite connections are fixed and structurally reinforced to provide the needed electrically conductive paths.

6657313, Dec 2, 2003

Jan 19, 1999

09/233385

Peter J. Brofman - Hopewell Junction NY
Shaji Faroon - Hopewell Junction NY
John U. Knickerbocker - Hopewell Junction NY
Scott I. Langenthal - Hyde Park NY
Sudipta K. Ray - Wappingers Falls NY
Kathleen A. Stalter - Hopewell Junction NY

International Business Machines Corporation - Armonk NY

H01L 2348

257781, 257780, 257734, 257773, 257779, 438612, 438614

A device for preventing short circuits between solder joints in flip chip packaging. The dielectric interposer has a plurality of apertures or vias which correspond to the I/O pads on a chip and substrate. Preferably, the interposer comprises a polyester film, glass, alumina, polyimide, a heat curable polymer or an inorganic powder filler in an organic material. More preferably, the interposer contains an adhesive or has adhesive layers disposed on the linear surfaces of the interposer. Cone shaped solder elements are formed within the apertures of the interposer. The dielectric interposer is positioned between a chip and substrate in an electronic module and thermally reflowed to create an electrical and mechanical interconnection. The interposer prohibits contact between the solder joints by isolating each of the joints and corresponding bonding pads. The interposer also prevents over compression of the solder joints by acting as a stand off.

6984792, Jan 10, 2006

May 1, 2003

10/427459

Peter J. Brofman - Hopewell Junction NY, US
Shaji Farooq - Hopewell Junction NY, US
John U. Knickerbocker - Hopewell Junction NY, US
Scott I. Langenthal - Hyde Park NY, US
Sudipta K. Ray - Wappingers Falls NY, US
Kathleen A. Stalter - Hopewell Junction NY, US

International Business Machines Corporation - Armonk NY

H01R 12/06

174263, 174261, 257779, 257781

A pre-thermal reflown dielectric interposer having a plurality of vias traversing through the interposer which correspond to the I/O pads on a chip and substrate. Cone shaped solder elements reside within the vias, whereby these solder elements are cone shaped prior to thermal reflow to permit a reduced force for allowing some non-planarity for joining the chip to the substrate. The interposer may comprise a polyester film, glass, alumina, polyimide, a heat curable polymer or an inorganic powder filler in an organic material. The interposer may also have an adhesive or adhesive layers disposed on the linear surfaces thereof. The present pre-thermal reflown interposer prohibits contact between the solder joints by isolating each of the joints and corresponding bonding pads, as well as preventing over compression of the solder joints by acting as a stand off.

6297559, Oct 2, 2001

Jun 30, 1998

9/107998

Anson J. Call - Poughkeepsie NY
Stephen Anthony DeLaurentis - Claverack NY
Shaji Farooq - Hopewell Junction NY
Sung Kwon Kang - Chappaqua NY
Sampath Purushothaman - Yorktown Heights NY
Kathleen Ann Stalter - Hopewell Junction NY

International Business Machines Corporation - Armonk NY

H01L 2348

257778

A new interconnection scheme of a ball grid array (BGA) module is disclosed where a solder ball is connected to the BGA module by use of an electrically conducting adhesive The electrically conducting adhesive can be a mixture comprising a polymer resin, no-clean solder flux, a plurality of electrically conducting particles with an electrically conducting fusible coating and others. The solder balls in a BGA module can also be connected to a printed circuit board by use of another electrically conductive adhesive which can be joined at a lower temperature than the first joining to the BGA module. Additionally, an electrically conducting adhesive can be formed into electrically conducting adhesive bumps which interconnect an integrated circuit device to the BGA module.

6218629, Apr 17, 2001

Jan 20, 1999

9/233890

Peter J. Brofman - Hopewell Junction NY
Anson J. Call - Poughkeepsie NY
Jeffrey T. Coffin - Pleasant Valley NY
Kathleen A. Stalter - Hopewell Junction NY

International Business Machines Corporation - Armonk NY

H05K 116

174260

A module or assembly is formed by interposing a polymer between a carrier and a semiconductor device to be secured to the carrier. The polymer has ionized metallic particles suspended in it. Before setting or curing the polymer, the module is exposed to an electric field which induces migration of the metallic particles to the opposing pads of the carrier and semiconductor device. Such migration ultimately forms metal dendrites extending between mating pad pairs. The dendrites establish a metallurgical bond and conductive paths between the carrier and the overlying semiconductor device. When the polymer is subsequently set, the carrier and device are not only adhered to each other, but the dendrite connections are fixed and structurally reinforced to provide the needed electrically conductive paths.