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Keith A Weinstein, 481500 Ridge Rd, Wilmington, DE 19809

Known as:
Keith Allen Weinstein Keith Weistein
Related to:
Susan Q Weinstein 65

Keith Weinstein Phones & Addresses

Wilmington, DE   

Fairfax, VA   

Brooklyn, NY   

New York, NY   

22 Hermosa Ave, Hermosa Beach, CA 90254    310-7982390   

Ann Arbor, MI   

Work

Company: Sprintnextel Jan 2010 Position: Tier ii technical support

Education

School / High School: The Evergreen State College- Olympia, WA Sep 1994 Specialities: Associate in Computer Science and World History
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Keith Weinstein resumes & CV records

Resumes

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Keith Weinstein - Denver, CO

Work:
SprintNextel Jan 2010 to Aug 2012
Tier II Technical Support Professional Wholesale Mortgage - Greenwood Village, CO Jan 2005 to Dec 2009
Loan Originator and Loan Processor Heritage Bookshop Inc - West Hollywood, CA Apr 2002 to Sep 2004
Assistant Sales Rep and Overall Store Maintenance Countrywide Home Loans - Moorpark, CA Mar 2000 to Mar 2002
Systems Analyst/Help Desk Alibris - Emeryville, CA Jun 1998 to Feb 2000
Help Desk/Customer Support
Education:
The Evergreen State College - Olympia, WA Sep 1994 to Jun 1998
Associate in Computer Science and World History Apple University - Santa Monica, CA

Publications & IP owners

Us Patents

White Gold Compositions Without Nickel And Palladium

US Patent:
6863746, Mar 8, 2005
Filed:
Aug 2, 2001
Appl. No.:
09/921357
Inventors:
Keith Weinstein - Marina del Rey CA, US
International Classification:
C22C009/00
US Classification:
148433, 148442, 420511, 420587, 420589
Abstract:
The present invention discloses a white gold composition consisting essentially of copper, silver, zinc, and manganese, and further consisting of small amounts of tin, cobalt, silicon/copper and boron/copper. More particularly, the white gold composition of the present invention discloses a white gold composition consisting essentially of about 36% to about 57% copper, about 10% silver, about 18. 2% to about 24. 2% zinc, about 14% to about 28. 9% manganese, and the balance further consisting of about 1% tin, about 0. 025% to about 0. 03% cobalt, about 0. 52% silicon/copper, and about 0. 2% boron/copper. An objective of the present invention is to provide for methods and compositions of casting, fabricating and soldering white gold that does not incorporate nickel or palladium. The present invention also discloses no tarnish results when hydrogen is used as a catalyst to all compositions.

Precious Metal Solder

US Patent:
7153375, Dec 26, 2006
Filed:
Jun 20, 2003
Appl. No.:
10/601139
Inventors:
Keith Weinstein - Marina Del Rey CA, US
International Classification:
C22C 5/02
US Classification:
148430, 420507, 420511
Abstract:
Platinum, silver and gold solder compositions for repairing, assembling, or sizing jewelry. Platinum compositions having about 90% to about 95% by weight platinum. Silver compositions having at least 92. 5% by weight silver. Gold solder compositions having about 25% to about 91. 6% gold. The platinum and silver solder compositions further consisting of about 8. 3% to about 75% by weight of an alloy consisting essentially of gallium, indium and copper in respective ratios of 6:3:1. The gold solder compositions further consisting of about 2% to about 14% by weight of an alloy consisting essentially of gallium, indium, and copper in respective ratios of 6:3:1. The melting temperature ranges of the respective solder compositions are from about 1300 C. to about 1500 C. for platinum, from about 1000 F.

Palladium Solder

US Patent:
7722806, May 25, 2010
Filed:
Apr 11, 2007
Appl. No.:
11/786773
Inventors:
Keith Weinstein - Marina Del Rey CA, US
International Classification:
C22C 5/04
US Classification:
420463, 148678, 148430
Abstract:
Gold solder compositions for assembling, repairing and sizing jewelry containing about 85% to 95% by weight palladium and an alloy mixture containing about 5% to 15% gallium and indium, in a weight ratio of approximately 7:3. The invention also provides a solder composition for assembling, repairing and sizing jewelry containing white gold and palladium, but not containing nickel. Such a solder contains gold, silver, copper, zinc, palladium, gallium and indium, whereby the gallium and indium is in a weight ratio of 6:4, 7:3 or 8:2, respectively.

Precious Metal Solder

US Patent:
2001003, Nov 1, 2001
Filed:
Jun 29, 2001
Appl. No.:
09/897692
Inventors:
Keith Weinstein - Marina del Rey CA, US
International Classification:
C22C005/04
US Classification:
420/466000
Abstract:
Platinum, silver and gold solder compositions for repairing, assembling, or sizing jewelry. Platinum compositions having about 90% to about 95% by weight platinum. Silver compositions having at least 92.5% by weight silver. Gold solder compositions having about 25% to about 91.6% gold. The platinum and silver solder compositions further consisting of about 8.3% to about 75% by weight of an alloy consisting essentially of gallium, indium and copper in respective ratios of 6:3:1. The gold solder compositions further consisting of about 2% to about 14% by weight of an alloy consisting essentially of gallium, indium, and copper in respective ratios of 6:3:1. The melting temperature ranges of the respective solder compositions are from about 1300 C. to about 1500 C. for platinum, from about 1000 F. to about 1400 F. for silver, and from about 1100 F. to about 1550 F.

Precious Metal Solder

US Patent:
2007005, Mar 8, 2007
Filed:
Nov 8, 2006
Appl. No.:
11/595256
Inventors:
Keith Weinstein - Marina Del Rey CA, US
International Classification:
C22C 5/02
US Classification:
148430000, 420507000, 420587000
Abstract:
Platinum, silver and gold solder compositions for repairing, assembling, or sizing jewelry. Platinum compositions having about 90% to about 95% by weight platinum. Silver compositions having at least 92.5% by weight silver. Gold solder compositions having about 25% to about 91.6% gold. The platinum and silver solder compositions further consisting of about 8.3% to about 75% by weight of an alloy consisting essentially of gallium, indium and copper in respective ratios of 6:3:1. The gold solder compositions further consisting of about 2% to about 14% by weight of an alloy consisting essentially of gallium, indium, and copper in respective ratios of 6:3:1. The melting temperature ranges of the respective solder compositions are from about 1300 C. to about 1500 C. for platinum, from about 1000 F. to about 1400 F. for silver, and from about 1100 F. to about 1550 F.

Possible Relatives

David K Weinstein  Davina Weinstein  Dale S Weinstein  Deborah L Weinstein  Debra A Weinstein  Daniel Weinstein  Dena G Weinstein  Keith A Johnson  Keith J Standish  Keith E Johnston 

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