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Lawrence E Matson, 647133 Road 263, Continental, OH 45831

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7133 Road 263, Continental, OH 45831   

Oakwood, OH   

Plymouth, OH   

Payne, OH   

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Lawrence Matson

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Us Patents

Billet Conditioning Technique For Manufacturing Powder Metallurgy Preforms

US Patent:
4762679, Aug 9, 1988
Filed:
Jul 6, 1987
Appl. No.:
7/070276
Inventors:
Harold L. Gegel - Kettering OH
Yellapregada V. R. K. Prasad - Bangalore, IN
Sokka M. Doraivelu - Dublin OH
Raghavan Srinivasan - Fairborn OH
J. S. Gunasekera - Athens OH
Douglas R. Barker - Centerville OH
James T. Morgan - Huber Heights OH
James C. Malas - Dayton OH
Kristine A. Lark - Enon OH
Lawrence E. Matson - Xenia OH
Assignee:
The United States of America as represented by the Secretary of the Air
Force - Washington DC
International Classification:
B22F 324
US Classification:
419 28
Abstract:
A process for manufacturing powder metallurgy (P/M) preforms which are conditioned for optimum intrinsic workability is described which comprises steps of heating a quantity of P/M material in a can to a first preselected temperature under vacuum to degas the material, compacting the canned material at a second preselected temperature under pressure to provide a compact of the material; or cold compacting the powder to about 75% density and degassing it at suitable temperature and then vacuum hot pressing the powder at about 0. 75 melting point; generating flow stress data as a function of strain rate and temperature on samples of the compact at predetermined strain within predetermined ranges of temperature and strain rate and determining powder dissipation efficiency of the compact and entropy rate ratio within those ranges of temperature and strain rate; selecting values of strain rate and extrusion temperature at which dynamic recrystallization is the dominant metallurgical mechanism characterizing the compact: and extruding the compact in an extrusion can at the selected extrusion temperature and at an extrusion rate corresponding to the selected strain rate using a streamlined die. An improved processing map for preselecting optimum processing parameters for the material is described.

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