Li Zheng, 39Los Altos, CA

6553644, Apr 29, 2003

Feb 9, 2001

09/781009

Nick Karmaniolas - San Jose CA
Wesley Hiroshi Tao - San Jose CA
Li Zheng - Campbell CA

International Business Machines Corporation - Armonk NY

B23Q 700

29559, 292814, 2960317, 2960322, 269 37, 269 55, 269 58, 269287, 269289, 269297, 269317

A device for processing workpieces utilizes a frame and a fixture. The frame has a perimeter with an opening, and inner and outer side walls. A pair of shelves are located in the opening for supporting a workpiece and a spring retains the workpiece on the frame. The fixture has work locations with elevators that are moved by an elevator handle. The fixture also has an engagement handle for actuating the springs. The workpieces may be simultaneously mounted to or removed from the frames with the fixture. The frames are loaded into the locations and both handles are rotated to raise the elevators and bend the springs. The workpieces are then placed on top of the elevators, and the elevator handle is rotated to lower the workpieces. Next, the engagement handle is rotated to release the springs to form assemblies that can be removed from the fixture.

6922890, Aug 2, 2005

Nov 15, 2002

10/295382

Qing Dai - San Jose CA, US
Jennifer Qing Lu - San Jose CA, US
Dennis Richard McKean - Milpitas CA, US
Eun Row - San Jose CA, US
Li Zheng - Campbell CA, US

International Business Machines Corporation - Armonk NY

H05K003/30

29841, 29855, 29856, 29858, 29867, 29883, 29885, 156268, 156344, 4272071, 42720808, 2642721, 26427211, 26427215, 438455, 438458, 438976

A method is provided for planarization of structures which minimizes step heights, reduces process steps, improves cleanliness, and provides increased ease of debond. Structures are placed with working surfaces facing down onto an adhesive layer such that structures remain fixed during heating. A bi-layer encapsulating film is used to achieve planarization. A carrier is bi-laminated with a thermoplastic film layer followed by a chemically inert protective polymer film layer that can withstand etch and cleaning processes. The thermoplastic layer is laminated on top of the carrier; the polymer layer is laminated on top of the joined thermoplastic layer and carrier. The carrier with bi-layer film is then placed onto the backside of the structures to resist chemical attack from the front side during photostrip and enable planarization. When heat is applied, the bi-layer encapsulating film melts and pushes the polymer layer into the gaps between structures thereby achieving complete planarization.

7000310, Feb 21, 2006

Dec 12, 2003

10/734951

Christa Marie Bolig - San Jose CA, US
Richard D. Bunch - San Jose CA, US
Timothy Joseph Neumann - San Jose CA, US
Li Zheng - Campbell CA, US

Hitachi Global Storage Technologies Netherlands B.V. - Amsterdam

G11B 5/127

2960317, 2960307, 156249

A method for handling workpieces such as hard disk drive sliders during a debonding process uses a fixture having two sets of finger-like projections that are interleaved. The sets are movable relative to each other to space apart the sliders after they are processed from their original row configuration. The post-processing separation is required to properly debond the sliders. The fingers on each set are closely interleaved to reduce the amount of displacement required to adequately separate the sliders for debonding. After the sliders are displaced, they are directly debonded into the inspection trays. This design eliminates the need for manual handling of the workpieces during these phases of manufacturing.

7263763, Sep 4, 2007

Jun 27, 2005

11/168215

Qing Dai - San Jose CA, US
Jennifer Qing Lu - San Jose CA, US
Dennis Richard McKean - Milpitas CA, US
Eun Row - San Jose CA, US
Li Zheng - Campbell CA, US

International Business Machines Corporation - Armonk NY

G11B 5/127
H04R 31/00

2960316, 2960312, 2960318, 3602357, 451 5, 451 41

A method is provided for planarization of structures which minimizes step heights, reduces process steps, improves cleanliness, and provides increased ease of debond. Structures are placed with working surfaces facing down onto an adhesive layer such that structures remain fixed during heating. A bi-layer encapsulating film is used to achieve planarization. A carrier is bi-laminated with a thermoplastic film layer followed by a chemically inert protective polymer film layer that can withstand etch and cleaning processes. The thermoplastic layer is laminated on top of the carrier; the polymer layer is laminated on top of the joined thermoplastic layer and carrier. The carrier with bi-layer film is then placed onto the backside of the structures to resist chemical attack from the front side during photostrip and enable planarization. When heat is applied, the bi-layer encapsulating film melts and pushes the polymer layer into the gaps between structures thereby achieving complete planarization.

7421458, Sep 2, 2008

Oct 15, 2004

10/966046

Jeff Taylor - Mountain View CA, US
Rachel Wang - Foster City CA, US
Li Zheng - Milpitas CA, US

Informatica Corporation - Redwood City CA

G06F 17/30

707203, 707 3, 717170

In various embodiments, the present invention provides methods and systems for creating version-stamps of database objects and for tracking, querying, retrieving, and deploying such versioned database objects in enterprise databases, data marts, or data warehouses. The database objects may be interrelated and may reference one another according to their accurate versions.

7741003, Jun 22, 2010

Mar 30, 2004

10/814933

Nicholas I. Buchan - San Jose CA, US
Cherngye Hwang - San Jose CA, US
Timothy Reiley - Cupertino CA, US
Li Zheng - Campbell CA, US

Hitachi Global Storage Technologies Netherlands B.V. - Amsterdam

G03C 1/00
G11B 5/60

4302701, 4302711

A resist transfer pad and method of use are described for forming a uniform photoresist on the surface of a workpiece such as a slider. The resist transfer pad includes a layer of cured polydimethylsiloxane (PDMS) on a cushioning layer, e. g. silicone rubber, and an optional stiffening layer. The sliders are preferably mounted on a carrier or pallet. In one preferred embodiment the loaded resist transfer pads are applied to the slider surface by roll lamination where the loaded resist transfer pad is transported by a roller system using a cover-tape and pressed against the slider surface. Subsequently the cover-tape and the resist transfer pad are lifted off and the photoresist remains on the transducer. An alternative embodiment uses a vacuum, piston laminator to press the loaded resist transfer pad onto the surface of the transducer.

2005012, Jun 16, 2005

Dec 10, 2003

10/734008

Richard Bunch - San Jose CA, US
Dennis McKean - Milpitas CA, US
Timothy Neumann - San Jose CA, US
Li Zheng - Campbell CA, US

C09J001/00

156325000, 156327000

Methods of improving the adhesive characteristics of an adhesive resin composition and the use of the adhesive for bonding substrate materials, such as ceramic materials and manufacturing tools, are described. The adhesive composition includes a resist adhesive resin and a solvent having a boiling point in the range of about 30 C. to about 80 C. The methods and the adhesive composition find utility in hard disk drive applications, such as in the manufacture of sliders for hard disk drives.

2013029, Nov 7, 2013

Jul 2, 2013

13/934127

Steven Michael KUSALO - Fremont CA, US
Haripriya RAJAGOPAL - Sunnyvale CA, US
Jairam RANGANATHAN - Los Angeles CA, US
Li ZHENG - Palo Alto CA, US

G06F 9/455

718 1

A method and software is described for recreating on a target datastore a set of hierarchical files that are present on a source datastore. A content identifier (ID) is maintained for each component of the set of hierarchical files. The content ID of a component is updated when its contents are modified. The child component is copied from the source datastore to the target datastore. The content ID corresponding to the parent component on the source datastore is compared with content IDs corresponding to files present on the target datastore. When a matching content ID is discovered, it infers a copy of the parent component. The matching file on the target datastore is associated with the copied child component so that the matching file becomes a new parent component to the copied child component, thereby recreating the set of hierarchical files on the target.