Lloyd M Walls Deceased1538 Eastridge Pkwy, Seguin, TX 78155

8158461, Apr 17, 2012

Jun 24, 2009

12/490872

Francesco Preda - New Braunfels TX, US
Lloyd A. Walls - Austin TX, US

International Business Machines Corporation - Armonk NY

H01L 21/50

438125, 257E21499

A mechanism for continuously referencing signals over multiple layers in laminate packages provides a continuous path for signals from one layer to another while using the ideal voltage reference for all areas of the package and still avoiding discontinuities in the voltage reference. A reference plane adjustment engine analyzes a package design and identifies an ideal top plane for all areas of the package, including areas under particular chip die(s) and areas that are not under a chip die. The reference plane adjustment engine then modifies the package design to reposition ground planes, source voltage planes, signal planes, and vias between layers to maintain a continuous voltage reference regardless of the top layer. The reference plane adjustment engine provides the resulting mixed voltage plane package design to a design analysis engine. A package fabrication system fabricates the package.

2008009, Apr 24, 2008

Oct 23, 2006

11/551888

Francesco Preda - New Braunfels TX, US
Lloyd A. Walls - Austin TX, US

H01L 23/12

257700

A mechanism for continuously referencing signals over multiple layers in laminate packages provides a continuous path for signals from one layer to another while using the ideal voltage reference for all areas of the package and still avoiding discontinuities in the voltage reference. A reference plane adjustment engine analyzes a package design and identifies an ideal top plane for all areas of the package, including areas under particular chip die(s) and areas that are not under a chip die. The reference plane adjustment engine then modifies the package design to reposition ground planes, source voltage planes, signal planes, and vias between layers to maintain a continuous voltage reference regardless of the top layer. The reference plane adjustment engine provides the resulting mixed voltage plane package design to a design analysis engine. A package fabrication system fabricates the package.

2012017, Jul 5, 2012

Mar 12, 2012

13/417879

Francesco Preda - New Braunfels TX, US
Lloyd A. Walls - Austin TX, US

International Business Machines Corporation - Armonk NY

G06F 17/50

716106

A mechanism for continuously referencing signals over multiple layers in laminate packages provides a continuous path for signals from one layer to another while using the ideal voltage reference for all areas of the package and still avoiding discontinuities in the voltage reference. A reference plane adjustment engine analyzes a package design and identifies an ideal top plane for all areas of the package, including areas under particular chip die(s) and areas that are not under a chip die. The reference plane adjustment engine then modifies the package design to reposition ground planes, source voltage planes, signal planes, and vias between layers to maintain a continuous voltage reference regardless of the top layer. The reference plane adjustment engine provides the resulting mixed voltage plane package design to a design analysis engine. A package fabrication system fabricates the package.

2013031, Nov 28, 2013

Aug 5, 2013

13/959003

Francesco Preda - New Braunfels TX, US
Brian L. Singletary - Austin TX, US
Lloyd A. Walls - Austin TX, US

INTERNATIONAL BUSINESS MACHINES CORPORATION - ARMONK NY

H01L 21/768

438667

A circuit substrate uses post-fed top side power supply connections to provide improved routing flexibility and lower power supply voltage drop/power loss. Plated-through holes are used near the outside edges of the substrate to provide power supply connections to the top metal layers of the substrate adjacent to the die, which act as power supply planes. Pins are inserted through the plated-through holes to further lower the resistance of the power supply path(s). The bottom ends of the pins may extend past the bottom of the substrate to provide solderable interconnects for the power supply connections, or the bottom ends of the pins may be soldered to “jog” circuit patterns on a bottom metal layer of the substrate which connect the pins to one or more power supply terminals of an integrated circuit package including the substrate.