BackgroundCheck.run
Search For

Mark E Bitner, 71380 San Carlos St, Nokomis, FL 34275

Mark Bitner Phones & Addresses

380 San Carlos St, Nokomis, FL 34275    856-5777642   

Tampa, FL   

Kinzers, PA   

Audubon, NJ   

Philippi, WV   

Riverview, FL   

Brandon, FL   

Mentions for Mark E Bitner

Career records & work history

Medicine Doctors

Mark R. Bitner

Specialties:
Obstetrics & Gynecology
Work:
Tanner Clinic
2121 N 1700 W STE B, Layton, UT 84041
801-7734840 (phone) 801-5258702 (fax)
Site
Education:
Medical School
Univ Auto De Ciudad Juarez, Esc De Med, Ciudad Juarez, Chihuahua
Graduated: 1981
Procedures:
D & C Dilation and Curettage, Vaginal Repair, Cesarean Section (C-Section), Cystoscopy, Destruction of Benign/Premalignant Skin Lesions, Hysterectomy, Oophorectomy, Ovarian Surgery, Skin Tags Removal, Tubal Surgery, Urinary Flow Tests, Vaccine Administration, Vaginal Delivery
Conditions:
Genital HPV, Menopausal and Postmenopausal Disorders, Premenstrual Syndrome (PMS), Abnormal Vaginal Bleeding, Breast Disorders, Candidiasis of Vulva and Vagina, Complicating Pregnancy or Childbirth, Conditions of Pregnancy and Delivery, Ectopic Pregnancy, Endometriosis, Female Infertility, Follicular Cyst of the Ovary, Fractures, Dislocations, Derangement, and Sprains, Hemorrhoids, Hypertension (HTN), Internal Derangement of Knee, Internal Derangement of Knee Cartilage, Intervertebral Disc Degeneration, Osteoarthritis, Osteoporosis, Ovarian Dysfunction, Pelvic Inflammatory Disease (PID), Plantar Fascitis, Polycystic Ovarian Syndrome (PCOS), Pregnancy-Induced Hypertension, Spontaneous Abortion, Uncomplicated or Low Risk Pregnancy and Delivery, Uterine Leiomyoma, Venous Embolism and Thrombosis
Languages:
English
Description:
Dr. Bitner graduated from the Univ Auto De Ciudad Juarez, Esc De Med, Ciudad Juarez, Chihuahua in 1981. He works in Layton, UT and specializes in Obstetrics & Gynecology.

License Records

Mark Robert Bitner Md

Licenses:
License #: 16022 - Expired
Category: Medicine
Issued Date: Aug 9, 1982
Effective Date: Nov 22, 1985
Type: Physician

Mark Bitner resumes & CV records

Resumes

Mark Bitner Photo 31

Mark Bitner

Mark Bitner Photo 32

Mark Bitner

Mark Bitner Photo 33

Mark Bitner

Mark Bitner Photo 34

Mark Bitner

Mark Bitner Photo 35

Mark Bitner

Location:
United States

Publications & IP owners

Us Patents

Mechanical Enhancement Of Dense And Porous Organosilicate Materials By Uv Exposure

US Patent:
7098149, Aug 29, 2006
Filed:
Mar 4, 2003
Appl. No.:
10/379466
Inventors:
Aaron Scott Lukas - Lansdale PA, US
Mark Leonard O'Neill - Allentown PA, US
Jean Louise Vincent - Bethlehem PA, US
Raymond Nicholas Vrtis - Orefield PA, US
Mark Daniel Bitner - Nazareth PA, US
Assignee:
Air Products and Chemicals, Inc. - Allentown PA
International Classification:
H01L 21/31
US Classification:
438778, 438780
Abstract:
Low dielectric materials and films comprising same have been identified for improved performance when used as interlevel dielectrics in integrated circuits as well as methods for making same. In one aspect of the present invention, an organosilicate glass film is exposed to an ultraviolet light source wherein the film after exposure has an at least 10% or greater improvement in its mechanical properties (i. e. , material hardness and elastic modulus) compared to the as-deposited film.

Non-Thermal Process For Forming Porous Low Dielectric Constant Films

US Patent:
7404990, Jul 29, 2008
Filed:
Nov 14, 2002
Appl. No.:
10/295568
Inventors:
Aaron Scott Lukas - Lansdale PA, US
Mark Leonard O'Neill - Allentown PA, US
Mark Daniel Bitner - Nazareth PA, US
Jean Louise Vincent - Bethlehem PA, US
Raymond Nicholas Vrtis - Allentown PA, US
Assignee:
Air Products and Chemicals, Inc. - Allentown PA
International Classification:
B05D 3/06
C08F 2/34
C08F 2/52
C08J 7/18
C08J 7/16
C23C 16/00
C23C 16/50
C23C 16/56
US Classification:
427553, 427554, 427555, 427487, 427489, 427532, 427535, 427543, 427551, 42725537, 427255393, 438790, 438789
Abstract:
Low dielectric materials and films comprising same have been identified for improved performance when used as interlevel dielectrics in integrated circuits as well as methods for making same. In certain embodiments of the invention, there is provided a low-temperature process to remove at least a portion of at least one pore-forming phase within a multiphasic film thereby forming a porous film. The pore-forming phase may be removed via exposure to at least one energy source, preferably an ultraviolet light source, in a non-oxidizing atmosphere.

Mechanical Enhancement Of Dense And Porous Organosilicate Materials By Uv Exposure

US Patent:
7468290, Dec 23, 2008
Filed:
Jul 21, 2003
Appl. No.:
10/624357
Inventors:
Aaron Scott Lukas - Lansdale PA, US
Mark Leonard O'Neill - Allentown PA, US
Jean Louise Vincent - Bethlehem PA, US
Raymond Nicholas Vrtis - Orefield PA, US
Mark Daniel Bitner - Nazareth PA, US
Assignee:
Air Products and Chemicals, Inc. - Allentown PA
International Classification:
H01L 51/40
US Classification:
438 99, 438780, 438795, 42725528, 427569, 501 39, 501 80
Abstract:
Low dielectric materials and films comprising same have been identified for improved performance when used as interlevel dielectrics in integrated circuits as well as methods for making same. In one aspect of the present invention, an organosilicate glass film is exposed to an ultraviolet light source wherein the film after exposure has an at least 10% or greater improvement in its mechanical properties (i. e. , material hardness and elastic modulus) compared to the as-deposited film.

Non-Thermal Process For Forming Porous Low Dielectric Constant Films

US Patent:
7470454, Dec 30, 2008
Filed:
Jul 21, 2003
Appl. No.:
10/624356
Inventors:
Aaron Scott Lukas - Lansdale PA, US
Mark Leonard O'Neill - Allentown PA, US
Mark Daniel Bitner - Nazareth PA, US
Jean Louise Vincent - Bethlehem PA, US
Raymond Nicholas Vrtis - Allentown PA, US
Assignee:
Air Products and Chemicals, Inc. - Allentown PA
International Classification:
B05D 5/00
B05D 3/06
B05D 3/02
C23C 16/18
C23C 16/40
C23C 16/42
C23C 16/48
C23C 16/517
C23C 16/56
C08J 7/16
H01L 21/3105
H01L 21/4757
US Classification:
427509, 427515, 427542, 427544, 427553, 427557, 427558, 427 59, 42725537, 42725528, 438788, 438789, 438790, 438784
Abstract:
Low dielectric materials and films comprising same have been identified for improved performance when used as interlevel dielectrics in integrated circuits as well as methods for making same. In certain embodiments of the invention, there is provided a low-temperature process to remove at least a portion of at least one pore-forming material within a composite film thereby forming a porous film. The pore-forming material may be removed via exposure to at least one energy source, preferably an ultraviolet light source, in a non-oxidizing atmosphere.

Isbn (Books And Publications)

Project Red Light

Author:
Mark A. Bitner
ISBN #:
0595330568

NOTICE: You may not use BackgroundCheck or the information it provides to make decisions about employment, credit, housing or any other purpose that would require Fair Credit Reporting Act (FCRA) compliance. BackgroundCheck is not a Consumer Reporting Agency (CRA) as defined by the FCRA and does not provide consumer reports.