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Mark D Eblen, 5643906 Sassari St, Temecula, CA 92592

Mark Eblen Phones & Addresses

43906 Sassari St, Temecula, CA 92592    951-3009335    951-3039335   

41624 Margarita Rd, Temecula, CA 92591    909-3039335   

Shelbyville, KY   

San Diego, CA   

Seattle, WA   

Louisville, KY   

Riverside, CA   

43906 Sassari St, Temecula, CA 92592    951-7514286   

Work

Position: Professional/Technical

Education

Degree: High school graduate or higher

Emails

Mentions for Mark D Eblen

Career records & work history

Lawyers & Attorneys

Mark Eblen Photo 1

Mark Douglas Eblen, Louisville KY - Lawyer

Address:
462 S 4Th St, Louisville, KY 40202
Phone:
502-5662945 (Phone)
Jurisdiction:
Kentucky
Memberships:
Kentucky State Bar

Mark Eblen resumes & CV records

Resumes

Mark Eblen Photo 16

R And D Program Manager

Location:
43906 Sassari St, Temecula, CA 92592
Industry:
Semiconductors
Work:
University of California at San Diego Extension 2007 - 2009
Instructor
Kyocera 1998 - 2006
Senior R and D Engineer
Kyocera 1998 - 2006
R and D Program Manager
Ectc 1998 - 2006
Ip Committee
Vermont Amerincan Corporate Engineering 1995 - 1998
New Product Design Engineer
Education:
University of Louisville 1990 - 1995
Master of Science, Masters, Master of Engineering, Mechanical Engineering
Skills:
Failure Analysis, R&D, Finite Element Analysis, Semiconductors, Characterization, Ansys, Thermal Analysis, Electronics, Design of Experiments, Engineering, Mems, Product Design, Thermal, Cfd, Materials Science, Thermal Management, Solidworks, Design For Manufacturing, Engineering Management, Fmea, Materials, Simulations, Spc, Pcb Design
Interests:
Collecting Antiques
Exercise
Sweepstakes
Home Improvement
Reading
Gourmet Cooking
Sports
The Arts
Home Decoration
Health
Cooking
Electronics
Crafts
Fitness
Collecting
Kids
Medicine
Parenting
Travel
Investing
Traveling
Languages:
English
Mark Eblen Photo 17

Mark Eblen Markr Eblen

Mark Eblen Photo 18

Mark Eblen

Mark Eblen Photo 19

Mark Eblen

Skills:
Microsoft Office, Research, Microsoft Excel, English, Microsoft Word, Customer Service, Powerpoint, Windows, Photoshop, Teaching, Outlook, Editing

Publications & IP owners

Us Patents

Semiconductor Packaging Structure And Package Having Stress Release Structure

US Patent:
2017022, Aug 3, 2017
Filed:
Jan 27, 2017
Appl. No.:
15/418109
Inventors:
- San Diego CA, US
Mark EBLEN - San Diego CA, US
Eiji WATANABE - Kirishima, JP
Eiji TANAKA - San Diego CA, US
International Classification:
H01L 23/367
H01L 23/10
H01L 49/02
H01L 23/00
H01L 23/373
H01L 23/057
Abstract:
A semiconductor packaging structure includes a copper heat-sink with a shim projection which provides a stress release structure. The heat-sink with the shim projection may be used in conjunction with a pedestal in order to further reduce the thermal stress produced from the mismatch of thermal properties between the copper heat-sink metal and the ceramic frame. The copper heat-sink with a shim projection may also be part of the semiconductor package along with a lead frame, the ceramic frame, a semiconductor device, a capacitor, a wire bond and a ceramic lid or an encapsulation. The copper heat-sink, the ceramic frame and the lead frame are all chosen to be cost effective, and chosen such that the packaging process for the semiconductor device is able to achieve a smaller size while maintaining high reliability, low cost, and suitability for volume manufacturing.

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