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Mark Anthony Ferra, 5415840 S 23Rd Pl, Phoenix, AZ 85048

Known as:
Mark A Ferra Mark Ferr
Related to:
Lily Ferra 21 Vernon J Ferra

Mark Ferra Phones & Addresses

Phoenix, AZ   

Keizer, OR   

Chandler, AZ   

Tucson, AZ   

Marana, AZ   

Peoria, AZ   

16019 S 1St Ave, Phoenix, AZ 85045   

Work

Position: Machine Operators, Assemblers, and Inspectors Occupations

Education

Degree: Associate degree or higher
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Mentions for Mark Anthony Ferra

Mark Ferra resumes & CV records

Resumes

Mark Ferra Photo 19

Industry Manager - Metals And Mining

Location:
Phoenix, AZ
Industry:
Mining & Metals
Work:
Rexa, Inc.
Industry Manager - Metals and Mining Climax Molybdenum Jan 2012 - Nov 2012
Senior Marketing Analyst Climax Molybdenum Jan 2006 - Dec 2011
Chief Engineer - Marketing Technical Services Novellus Systems 2003 - 2005
Lab Applications Manager Speedfam-Ipec 2000 - 2003
Senior Program Manager - Tungsten and Oxide Cmp Process Technology Speedfam-Ipec 1998 - 2000
Key Account Technical Manager Ipec 1997 - 1998
Field Applications Manager Ipec 1996 - 1997
Field Process Engineer
Education:
Arizona State University 1989 - 1994
Bachelors, Bachelor of Science, Chemical Engineering
Skills:
Process Engineering, Cross Functional Team Leadership, Engineering, Manufacturing, Spc, Project Management, Product Development, Management, Process Simulation, Leadership, Continuous Improvement, Strategy, Product Management, Electronics, Design of Experiments, Semiconductors, Testing, Fmea, Process Improvement, Projects, Sap, Negotiation, Materials, Business Development, Engineering Management, Sales, Sales Management, Powerpoint, Microsoft Excel, Marketing, Materials Science, Crm, Business Objects, Statistical Process Control
Mark Ferra Photo 20

Mark Ferra

Publications & IP owners

Us Patents

Optical Endpoint Detection For Buff Module On Cmp Tool

US Patent:
2002015, Oct 24, 2002
Filed:
Apr 24, 2001
Appl. No.:
09/840901
Inventors:
Mark Ferra - Phoenix AZ, US
Yakov Epshteyn - Phoenix AZ, US
William Bellamak - Gilbert AZ, US
International Classification:
B24B001/00
B24B049/12
US Classification:
451/057000
Abstract:
The invention includes a polishing station and a buffing station for chemically mechanically polishing a wafer. The buffing station preferably includes a pair of rotating opposing buffing pads that receive a portion of the wafer. In the buffing station, a measurement instrument may be positioned adjacent an exposed portion of the wafer for detecting an endpoint of the buffing process. A first slurry may be used in the polishing station and a second slurry may be used in the buffing station. For planarizing a wafer with a metal layer over a barrier layer, the metal layer may be removed at the polishing station while the barrier layer is removed at the buffing station. For planarizing a dielectric layer, the top portion of the dielectric layer may be removed at the polishing station with an additional amount removed at the buffing station thereby leaving a dielectric layer with a desired thickness.

Possible Relatives

Emmett A Ferra  Jack G Ferra  Michael J Ferra  Paul C Ferra  Ralph B Ferra  Sandra R Ferra  Carol C Ferra  Mark W Johnson  Mark E Stamps  Mark Stancil 

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