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Martin A Rothschild, 761010 Stirlingshire Dr, Hendersonville, TN 37075

Martin Rothschild Phones & Addresses

1010 Stirlingshire Dr, Hendersonville, TN 37075    615-8260076   

Hendersonvlle, TN   

Wilmington, VT   

Santa Monica, CA   

Nashville, TN   

Henderson, TN   

1010 Stirlingshire Dr, Hendersonvlle, TN 37075   

Mentions for Martin A Rothschild

Career records & work history

Medicine Doctors

Martin Rothschild

Specialties:
Internal Medicine, Endocrinology, Diabetes & Metabolism
Work:
Stephen Rubenstein MD
885 Park Ave Ofc 1A, New York, NY 10075
212-7376993 (phone) 212-7947295 (fax)
Education:
Medical School
New York Medical College
Graduated: 1973
Conditions:
Abnormal Vaginal Bleeding, Alopecia Areata, Dehydration, Diabetes Mellitus (DM), Disorders of Lipoid Metabolism, Erectile Dysfunction (ED), Herpes Zoster, Hypertension (HTN), Hypothyroidism, Osteoporosis
Languages:
English, Spanish
Description:
Dr. Rothschild graduated from the New York Medical College in 1973. He works in New York, NY and specializes in Internal Medicine and Endocrinology, Diabetes & Metabolism. Dr. Rothschild is affiliated with Lenox Hill Hospital, Mount Sinai Beth Israel Brooklyn Medical Center and Mount Sinai Medical Center.

Martin Rothschild resumes & CV records

Resumes

Martin Rothschild Photo 22

President

Location:
Hendersonville, TN
Industry:
Hospital & Health Care
Work:
Aladdin Temp-Rite
President
Aladdin Temp-Rite May 1999 - May 2010
Vice President of Sales and Marketing
Skills:
Team Building, Strategic Planning, Budgets, Leadership, New Business Development, Customer Service, Healthcare, Food Service, Contract Negotiation, Sales Management, Sales Operations, Training, Management, Operations Management, Account Management, Sales, Marketing Strategy, Customer Satisfaction, Market Research, Budgeting, Hospitals, Cross Functional Team Leadership, P&L Management, Forecasting, Catering, Marketing, Product Development, Inventory Management, P&L, Business Strategy, Business Development, Public Speaking, Process Improvement, Strategy, Direct Sales, Pricing, Negotiation, Sales Process, Team Leadership, Retail, Microsoft Excel, Hospitality
Martin Rothschild Photo 23

Martin Rothschild

Martin Rothschild Photo 24

Martin Rothschild

Publications & IP owners

Us Patents

Induction-Based Heat Retentive Server

US Patent:
2013030, Nov 14, 2013
Filed:
Jul 3, 2013
Appl. No.:
13/934509
Inventors:
David R. Gordon - Nashville TN, US
R. Kevin Ray - Gallatin TN, US
Timothy D. Altizer - Hendersonvlile TN, US
Matthew J. McCartney - Madison TN, US
Martin A. Rothschild - Hendersonville TN, US
Philip H. Scruggs - Brentwood TN, US
International Classification:
A47J 39/02
US Classification:
426520
Abstract:
A heat retentive server includes a chamber defined between an upper shell and a lower shell that are connected to one another. An induction-heatable member is positioned in the chamber, and the induction-heatable member may be heated by electromagnetic induction to a first temperature that is greater than the heat deflection temperature of the upper shell. Buffering material is positioned in the chamber between the induction-heatable member and the upper shell, and the buffering material is adapted for providing predetermined conductive heat transfer from the induction-heatable member to the upper shell so that at least a portion of the upper shell is heated to a second temperature that is greater than the heat deflection temperature of the upper shell. The second temperature is less than the first temperature.

Induction-Based Heat Retentive Server

US Patent:
2013010, Apr 25, 2013
Filed:
Oct 24, 2011
Appl. No.:
13/280068
Inventors:
Rodger D. Crocker - Hendersonville TN, US
David R. Gordon - Nashville TN, US
R. Kevin Ray - Gallatin TN, US
Timothy D. Altizer - Hendersonville TN, US
Matthew J. McCartney - Madison TN, US
Martin A. Rothschild - Hendersonville TN, US
Philip H. Scruggs - Brentwood TN, US
International Classification:
A47J 39/02
H05B 6/12
US Classification:
426520, 219622
Abstract:
A heat retentive server includes a chamber defined between an upper shell and a lower shell that are connected to one another. An induction-heatable member is positioned in the chamber, and the induction-heatable member may be heated by electromagnetic induction to a first temperature that is greater than the heat deflection temperature of the upper shell. Buffering material is positioned in the chamber between the induction-heatable member and the upper shell, and the buffering material is adapted for providing predetermined conductive heat transfer from the induction-heatable member to the upper shell so that at least a portion of the upper shell is heated to a second temperature that is greater than the heat deflection temperature of the upper shell. The second temperature is less than the first temperature.

Induction-Based Heat Retentive Server

US Patent:
2021040, Dec 30, 2021
Filed:
Nov 30, 2017
Appl. No.:
15/827707
Inventors:
- Hendersonville TN, US
David R. Gordon - Nashville TN, US
R. Kevin Ray - Gallatin TN, US
Timothy D. Altizer - Hendersonville TN, US
Matthew J. McCartney - Madison TN, US
Martin A. Rothschild - Hendersonville TN, US
Phillip H. Scruggs - Brentwood TN, US
International Classification:
A47J 39/02
H05B 6/06
H05B 6/10
Abstract:
A heat retentive server includes a chamber defined between an upper shell and a lower shell that are connected to one another. An induction-heatable member is positioned in the chamber, and the induction-heatable member may be heated by electromagnetic induction to a first temperature that is greater than the heat deflection temperature of the upper shell. Buffering material comprising an inhibitively conductive hydrophobic material is positioned in the chamber between the induction-heatable member and the upper shell, and the buffering material is adapted for providing predetermined conductive heat transfer from the induction-heatable member to the upper shell so that at least a portion of the upper shell is heated to a second temperature that is greater than the heat deflection temperature of the upper shell. The second temperature is less than the first temperature.

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