BackgroundCheck.run
Search For

Michael L Garner, 77400 Woodfield Ct, Lagrange, GA 30240

Michael Garner Phones & Addresses

Lagrange, GA   

Newnan, GA   

29305 Champion Ct, Menifee, CA 92586    951-7463590   

Sun City, CA   

7518 Wood St, Phoenix, AZ 85043    623-5182070   

Winchester, CA   

Murrieta, CA   

Riverside, CA   

Mentions for Michael L Garner

Career records & work history

Lawyers & Attorneys

Michael Garner Photo 1

Michael Garner - Lawyer

Office:
Stokes Lawrence, P.S.
Specialties:
Real Estate, Business, Business/ Commercial, Contracts, Real Property/ Land Use, Litigation, Real Property/Land Use
ISLN:
907191207
Admitted:
1976
University:
Stanford University, A.B., 1971; Stanford University, A.B., 1971
Law School:
Boalt Hall School of Law, University of California at Berkeley, J.D., 1976
Michael Garner Photo 2

Michael Garner - Lawyer

Specialties:
Administrative, Criminal, Government, Labor-Employment, Criminal Defense
ISLN:
917863811
Admitted:
2002
Law School:
Wayne State University, J.D., 2002
Michael Garner Photo 3

Michael Garner - Lawyer

Office:
Entrust Legal, LLP
Specialties:
Estate Planning, Trust Administration, Probate, Business Law, Trusts & Estates, Contracts, Wills & Living Wills, Wills & Probate, Probate, Trusts
ISLN:
909710703
Admitted:
1994
University:
California State University, Northridge, B.S., 1990
Law School:
University of La Verne, J.D., 1994

License Records

Michael R Garner

Licenses:
License #: 1467 - Expired
Category: Asbestos
Issued Date: Jun 1, 1989
Effective Date: Jun 1, 1989
Expiration Date: Jun 1, 1991
Type: Asbestos Worker

Michael Garner resumes & CV records

Resumes

Michael Garner Photo 56

Michael Garner - Goodyear, AZ

Work:
Quality Woodcrafts Architectural Millworks - Phoenix, AZ Apr 2010 to Jan 2013
Project Manager
Lumber Products - Chandler, AZ Nov 2004 to Aug 2009
Sales Representative
Lumber Products 2006 to 2006
National sales
Hardwoods Inc - Phoenix, AZ Mar 1999 to Nov 2004
Sales Representative
Sales Person 2004 to 2004 Accountable - Phoenix, AZ 2004 to 2004
Offered sales
Education:
University of Colorado - Grand Junction, CO Mar 2010
Bachelors of Arts in Marketing
Western State College - Gunnison, CO
Bachelors of Arts in Advertising

Publications & IP owners

Us Patents

Electronic Assembly Including A Die Having An Integrated Circuit And A Layer Of Diamond To Transfer Heat

US Patent:
6770966, Aug 3, 2004
Filed:
Jul 31, 2001
Appl. No.:
09/920275
Inventors:
Gregory M. Chrysler - Chandler AZ
Abhay A. Watwe - Chandler AZ
Sairam Agraharam - Phoenix AZ
Kramadhati V. Ravi - Atherton CA
Michael C. Garner - Pleasanton CA
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H01L 2310
US Classification:
257706
Abstract:
Processes are described whereby a wafer is manufactured, a die from the wafer, and an electronic assembly including the die. The die has a diamond layer which primarily serves to spread heat from hot spots of an integrated circuit in the die.

Electronic Assembly Including A Die Having An Integrated Circuit And A Layer Of Diamond To Transfer Heat

US Patent:
6921706, Jul 26, 2005
Filed:
Feb 6, 2004
Appl. No.:
10/773879
Inventors:
Gregory M. Chrysler - Chandler AZ, US
Abhay A. Watwe - Chandler AZ, US
Sairam Agraharam - Phoenix AZ, US
Kramadhati V. Ravi - Atherton CA, US
Michael C. Garner - Pleasanton CA, US
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H01L021/46
H01L021/78
H01L021/301
US Classification:
438460, 438113
Abstract:
Processes are described whereby a wafer is manufactured, a die from the wafer, and an electronic assembly including the die. The die has a diamond layer which primarily serves to spread heat from hot spots of an integrated circuit in the die.

Electronic Assembly Including A Die Having An Integrated Circuit And A Layer Of Diamond To Transfer Heat

US Patent:
7170098, Jan 30, 2007
Filed:
Feb 3, 2005
Appl. No.:
11/050902
Inventors:
Gregory M. Chrysler - Chandler AZ, US
Abhay A. Watwe - Chandler AZ, US
Sairam Agraharam - Phoenix AZ, US
Kramadhati V. Ravi - Atherton CA, US
Michael C. Garner - Pleasanton CA, US
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H01L 31/0312
US Classification:
257 77, 257103, 257713, 257678, 257E21122, 257E21568
Abstract:
Processes are described whereby a wafer is manufactured, a die from the wafer, and an electronic assembly including the die. The die has a diamond layer which primarily serves to spread heat from hot spots of an integrated circuit in the die.

Electronic Assembly Including A Die Having An Integrated Circuit And A Layer Of Diamond To Transfer Heat

US Patent:
7432532, Oct 7, 2008
Filed:
Jul 31, 2006
Appl. No.:
11/496934
Inventors:
Gregory M. Chrysler - Chandler AZ, US
Abhay A. Watwe - Chandler AZ, US
Sairam Agraharam - Phoenix AZ, US
Kramadhati V Ravi - Atherton CA, US
Michael C. Garner - Pleasanton CA, US
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H01L 21/00
US Classification:
257 77, 257103, 257678, 257713, 257E21222, 257E21568, 257E23111
Abstract:
Processes are described whereby a wafer is manufactured, a die from the wafer, and an electronic assembly including the die. The die has a diamond layer which primarily serves to spread heat from hot spots of an integrated circuit in the die.

Isbn (Books And Publications)

Diagnosing Lameness In Dogs

Author:
Michael Garner
ISBN #:
0632058064

Layers Of Light

Author:
Michael Garner
ISBN #:
8273844714

NOTICE: You may not use BackgroundCheck or the information it provides to make decisions about employment, credit, housing or any other purpose that would require Fair Credit Reporting Act (FCRA) compliance. BackgroundCheck is not a Consumer Reporting Agency (CRA) as defined by the FCRA and does not provide consumer reports.