Michael W Jack, 761089 Richard Dr, Xenia, OH 45385

6441368, Aug 27, 2002

Oct 23, 2001

10/000591

Jan Grinberg - Los Angeles CA
Michael D. Jack - Goleta CA

Raytheon Company - Lexington MA

H01J 502

250239, 250214, 250216

A method and apparatus for protecting a bolometer antenna imaging array from out of band electromagnetic energy is disclosed. Protective pads are disposed upon a window in an optical system forming a millimeter wave image on an array of bolometer antenna sensors. The protective pads are effectively opaque to infrared and visible emissions and are aligned to shade the bolometer portion of the bolometer antennas from infrared and visible emissions, while leaving the antenna portion of each sensor in the array exposed to intercept the millimeter wave energy incident upon them.

7132655, Nov 7, 2006

Dec 2, 2003

10/727187

Michael D. Jack - Goleta CA, US
Eli E. Gordon - Santa Barbara CA, US

Raytheon Company - Waltham MA

G01J 5/00

2503381, 2503362, 2503384

A radiation sensor () has a substrate (); an antenna () coupled to the substrate (), a thermal detector unit TDU () spaced from the antenna () and the substrate (); and a multi-layered conductive lead (). The conductive lead () physically contacts the antenna () and the TDU (). The conductive lead () defines a support layer () adjacent to the substrate () for structurally supporting the TDU () over a cavity defined by the substrate (), a buffer layer () disposed on the support layer (), and a superconductive layer () disposed on the buffer layer (). The buffer layer has a crystalline structure to facilitate bonding with other layers. A method for making the sensor () is disclosed wherein the superconductive layer () and the buffer layer () are deposited using laser deposit, the buffer layer () with ion beam assist for alignment.

RE40767, Jun 23, 2009

Nov 9, 2000

09/708713

Jay Peterson - Montecito CA, US
David R Nelson - Santa Barbara CA, US
Troy P. Bahan - Santa Barbara CA, US
George C. Polchin - Santa Barbara CA, US
Michael D. Jack - Goleta CA, US

Environmental Systems Products Holdings Inc. - East Granby CT

G01N 21/00
G01N 21/35

2503385, 25033913, 2502521, 356436

An unmanned integrated RES integrates all of its components except the reflector into a single console that is positioned at the side of a road and has a CPU that controls calibration, verification and data gathering. The RES's source and receiver are preferably stacked one on top of the other such that the IR beam traverses a low and high path as it crosses the road This allows the RES to detect both low and high ground clearance vehicles. To maintain the vehicle processing and identification throughput, the speed sensor and ALPR detect the passing vehicles at steep angles, approximately 20 to 35 degrees. In a preferred system, a manned control center communicates with a large number of the unmanned integrated RES to download emissions data, perform remote diagnostics, and, if necessary, dispatch a technician to perform maintenance on a particular RES.

RE44214, May 14, 2013

Jun 22, 2009

12/489349

Jay Peterson - Montecito CA, US
David R Nelson - Santa Barbara CA, US
Troy P. Bahan - Santa Barbara CA, US
George C. Polchin - Santa Barbara CA, US
Michael D. Jack - Goleta CA, US

Envirotest Systems Holdings Corp. - East Granby CT

G01N 21/00
G01N 21/35
G01N 21/25

2503385, 25033913, 2502521, 356436

An unmanned integrated RES integrates all of its components except the reflector into a single console that is positioned at the side of a road and has a CPU that controls calibration, verification and data gathering. The RES's source and receiver are preferably stacked one on top of the other such that the IR beam traverses a low and high path as it crosses the road This allows the RES to detect both low and high ground clearance vehicles. To maintain the vehicle processing and identification throughput, the speed sensor and ALPR detect the passing vehicles at steep angles, approximately 20 to 35 degrees. In a preferred system, a manned control center communicates with a large number of the unmanned integrated RES to download emissions data, perform remote diagnostics, and, if necessary, dispatch a technician to perform maintenance on a particular RES.

2009010, Apr 30, 2009

Oct 30, 2007

11/980150

Michael D. Jack - Goleta CA, US
Michael Ray - Goleta CA, US
Robert E. Kvaas - Goleta CA, US
Gina M. Crawford - Goleta CA, US

H02H 9/00
G01T 1/24
H01L 27/00
H01L 21/44

361 56, 25037001, 257529, 257530, 438600, 438601, 257E27001

In one exemplary embodiment, a detector of electromagnetic radiation includes: a substrate; at least one layer of semiconductor material formed on the substrate, said at least one layer of semiconductor material defining a radiation absorbing and detecting region; an electrical contact configured to couple said region to a readout circuit; and a fuse coupled between the region and the electrical contact. In another exemplary embodiment, a fusible link between a first component and a second component is provided and includes: a fuse with an undercut located underneath at least a portion of the fuse; a first contact coupling the first component to the fuse; and a second contact coupling the second component to the fuse, wherein the undercut is disposed between the first contact and the second contact. In another exemplary embodiment, a fusible link includes a fuse having a layer of material having a negative temperature coefficient of resistance.

2013027, Oct 24, 2013

Apr 18, 2012

13/449637

Adam M. Kennedy - Santa Barbara CA, US
Michael D. Jack - Goleta CA, US
James Asbrock - Oceanside CA, US
Frank B. Jaworski - Goleta CA, US

RAYTHEON COMPANY - Waltham MA

H01L 27/146
H04N 13/02

348 42, 250372, 250395, 25037013, 977954, 348E13074

A 3D ultraviolet (UV) imaging LADAR system includes a UV source configured to generate a UV interrogation beam, a sensor configured to receive a UV return beam reflected from a target and to produce an electrical signal, and an imaging module coupled to the sensor and configured to receive the electrical signal and to generate a corresponding 3D image of the target. In one example, the sensor includes a down-shifting device configured to down-shift the UV return beam to a down-shifted light beam of a different wavelength, for example, in the visible or SWIR wavelength ranges.

5808329, Sep 15, 1998

Jul 15, 1996

8/680096

Michael D. Jack - Goleta CA
Ken J. Ando - Santa Barbara CA
Kenneth Kosai - Goleta CA
David R. Rhiger - Santa Barbara CA

Raytheon Company - Lexington MA

H01L 310328
H01L 310336
H01L 31072
H01L 31109

257188

An imaging device (10, 10') has a plurality of unit cells (11) that contribute to forming an image of a scene. The imaging device includes a layer of wide bandgap semiconductor (18) material (e. g. , silicon) having photogate charge-mode readout circuitry (20, 22, 24), such as CCD or CMOS circuitry, disposed upon a first surface of the layer. In one embodiment a second, opposing surface of the layer is bonded at a heterojunction interface or atomic bonding layer (16) to a surface of a layer of narrower bandgap semiconductor material (e. g. , InGaAs or HgCdTe), that is selected for absorbing electromagnetic radiation having wavelengths longer than about one micrometer (i. e. , the NIR or longer) and for generating charge carriers. The generated charge carriers are transported across the heterojunction interface for collection by the photogate charge-mode readout circuitry. The layer of narrower bandgap material may be disposed upon a surface of a transparent substrate, and also may be differentiated into a plurality of mesa structures (14a).

6329649, Dec 11, 2001

Oct 7, 1999

9/414988

Michael D. Jack - Goleta CA
Jan Grinberg - Los Angeles CA
Franklin A. Dolezal - Reseda CA
Ray Balcerak - Alexandria VA

Raytheon Company - Lexington MA

G01R 2302
G01J 500

250250

An integrated infrared and millimeter-wave monolithic focal plane sensor array having a substrate upon which an integrated array of infrared sensors and mm-wave sensors are provided at a first planar level on the same side of the substrate, and a planar antenna for receiving incident millimeter-wave radiation located at a second planar level located between the integrated array of sensors and the surface of the substrates for coupling the mm-wave radiation field to the mm-wave sensor. The antenna receiver of electromagnetic radiation, in one embodiment, is an antenna having a crossed bowtie configuration which efficiently couples the radiation field to the mm-wave sensor. The invention also is directed to a method of fabricating such a radiation sensor.