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Michael D Maeder, 31Riverview, FL

Michael Maeder Phones & Addresses

Riverview, FL   

3895 Lisa Ct UNIT B, Reno, NV 89503   

567 Ione Rd, Henderson, NV 89074   

Mentions for Michael D Maeder

Michael Maeder resumes & CV records

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Michael Maeder Photo 23

Engineering Tutor

Location:
Reno, NV
Industry:
Higher Education
Work:
University of Nevada Reno
Engineering Tutor
Education:
University of Nevada, Reno 2011 - 2015
Bachelors, Bachelor of Science In Electrical Engineering, Electrical Engineering
University of Nevada
Skills:
Matlab, Ni Labview, Microsoft Office, Fiber Optics, Mathcad, Electronics, Pspice, Fpga, Control Engineering, Ni Multisim, Analog Circuit Design, C++, Circuit Design, Power Systems
Languages:
English
Certifications:
Nevada State Board of Professional Engineers and Land Surveyors
Engineering Intern
Michael Maeder Photo 24

Michael Maeder

Publications & IP owners

Us Patents

Method Of Achieving Improved Transient Response In Apparatus For Controlling Flow And System For Accomplishing Same

US Patent:
2020025, Aug 13, 2020
Filed:
Apr 30, 2020
Appl. No.:
16/864117
Inventors:
- Fremont CA, US
Michael Maeder - Reno NV, US
Daniel T. Mudd - Reno NV, US
Patti J. Mudd - Reno NV, US
Assignee:
ICHOR SYSTEMS, INC. - Fremont CA
International Classification:
H01L 21/67
F16K 37/00
F16K 27/02
G05D 7/06
F16K 1/00
B05B 1/30
B05B 12/08
Abstract:
Apparatuses for controlling gas flow are important components for delivering process gases for semiconductor fabrication. In one embodiment, a gas flow control system for achieving improved transient response in apparatuses for controlling gas flow is disclosed. Specifically, by providing a command to an apparatus to deliver a predetermined mass flow rate at a future turn on time, the apparatus is able to pre-pressurize a P1 volume so that the response time of the apparatus is no longer dependent on the speed of the apparatus's control valves and the limitations of the control loop.

Apparatus For Controlling Flow And Method Of Calibrating Same

US Patent:
2018018, Jul 5, 2018
Filed:
Dec 29, 2017
Appl. No.:
15/858689
Inventors:
- Wilmington DE, US
Michael Maeder - Reno NV, US
International Classification:
G05B 13/02
G01N 7/00
G01F 17/00
G01F 1/36
G05D 7/06
Abstract:
Apparatuses for controlling gas flow are important components for delivering process gases for semiconductor fabrication. In one embodiment, a method of calibrating an apparatus for controlling gas flow is disclosed. Specifically, the apparatus may be calibrated on installation using a two-step process of measuring the volume of gas box downstream from the apparatus by flowing nitrogen gas into the gas box and measuring the resulting temperature and rate of pressure rise. Using the computed volume of the gas box, a sweep of several mass flow rates may be performed using the process gas and the gas map for the process gas. The apparatus is calibrated based on the measured temperature and pressure values, which allow calculation of the actual mass flow rate for the process gas as compared with the commanded mass flow rates.

Method Of Achieving Improved Transient Response In Apparatus For Controlling Flow And System For Accomplishing Same

US Patent:
2018009, Mar 29, 2018
Filed:
Sep 27, 2017
Appl. No.:
15/717562
Inventors:
- Wilmington DE, US
Michael Maeder - Reno NV, US
Daniel T. Mudd - Reno NV, US
Patti J. Mudd - Reno NV, US
International Classification:
H01L 21/67
B05B 1/30
B05B 12/08
Abstract:
Apparatuses for controlling gas flow are important components for delivering process gases for semiconductor fabrication. In one embodiment, a method of achieving improved transient response in apparatuses for controlling gas flow is disclosed. Specifically, by providing a command to the apparatus to deliver a predetermined mass flow rate at a future turn on time, the apparatus is able to pre-pressurize a P1 volume so that the response time of the apparatus is no longer dependent on the speed of the apparatus's control valves and the limitations of the control loop.

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