BackgroundCheck.run
Search For

Michael R Parodi, 521452 George Ct, Benicia, CA 94510

Michael Parodi Phones & Addresses

1885 Shirley Dr, Benicia, CA 94510    707-2976728   

Stockton, CA   

2815 Ruff Ave, Pinole, CA 94564   

Hercules, CA   

El Sobrante, CA   

Phoenix, AZ   

1452 George Ct, Benicia, CA 94510    707-2976728   

Mentions for Michael R Parodi

Michael Parodi resumes & CV records

Resumes

Michael Parodi Photo 35

President & Ceo, Iselrobotik Usa, Llc

Location:
San Francisco Bay Area
Industry:
Semiconductors
Michael Parodi Photo 36

Michael Parodi

Location:
United States

Publications & IP owners

Us Patents

Method And Apparatus For Curing Photoresist

US Patent:
5766824, Jun 16, 1998
Filed:
Jul 27, 1995
Appl. No.:
8/508028
Inventors:
William T. Batchelder - San Mateo CA
Michael L. Parodi - Alamo CA
Michael R. Biche - Union City CA
Assignee:
Semiconductor Systems, Inc. - Fremont CA
International Classification:
G03F 700
US Classification:
430330
Abstract:
A substrate photolithography system includes a substrate handling robot that pivots about a fixed point and transfers substrates between photoresist coater, a developer, and a heating/cooling unit, all of which are clustered about the robot. The end effector of the robot is capable of both vertical and lateral movement so that individual modules of the heating/cooling unit may be stacked. For heating/cooling, the substrate is placed in the heating/cooling unit in close proximity to a hotplate/chillplate and a thermally conductive, non-reactive gas, such as helium, is introduced into the airspace between the substrate and the hotplate/chillplate. The thermally conductive, non-reactive gas, is preheated/precooled before introduction into the airspace between the substrate and the hotplate/chillplate when the gas passes through a bore in the hotplate/chillplate. Additionally, the substrate is automatically aligned in a milled recession in the hotplate surface for future handling.

Oscillatory Chuck Method And Apparatus For Coating Flat Substrates

US Patent:
5798140, Aug 25, 1998
Filed:
Apr 30, 1996
Appl. No.:
8/640248
Inventors:
Michael L. Parodi - Alamo CA
Roy E. Hurtig - Anacortes WA
Assignee:
Semiconductor Systems, Inc. - Fremont CA
International Classification:
B05D 312
US Classification:
427240
Abstract:
An apparatus and method are provided for efficiently and effectively coating a substantially flat surface, i. e. , a substrate, with a high-viscosity liquid chemical, such as photoresist. The flat surface is oscillated by rotating the surface in one direction and then repeatedly reversing the direction of rotation of the surface. The chemical is spread by both the centrifugal force of the rotation of the surface and the tangential force of the angular acceleration of the surface. The tangential force helps spread the chemical without prematurely overcoming the surface tension of the chemical resulting in a particularly effective coating using substantially less chemical. Chemical is alternatively spread by vibrating the flat surface. Vibrating applies to the chemical, in addition to radial, centrifugal force, if any, non-radial forces which are not directly opposed by surface tension. The chemical is therefore spread more evenly and efficiently without overcoming the surface tension of the chemical.

Clustered Photolithography System

US Patent:
5651823, Jul 29, 1997
Filed:
Mar 29, 1995
Appl. No.:
8/412650
Inventors:
Michael L. Parodi - Alamo CA
Michael R. Biche - Union City CA
H. Alexander Anderson - Santa Cruz CA
Alexander Lurye - Fremont CA
Assignee:
Semiconductor Systems, Inc. - Fremont CA
International Classification:
B65G 2500
US Classification:
118500
Abstract:
A substrate photolithography system includes a substrate handling robot which pivots about a fixed point and transfers substrates between photoresist coater, a developer, and a heating/cooling unit, all of which are clustered about the robot. The end effector of the robot is capable of both vertical and lateral movement so that individual modules of the heating/cooling unit may be stacked. An apparatus and a method for baking and cooling silicon substrates are disclosed. Both baking and cooling of silicon substrates are done in a single integrated thermal process module. Each thermal process module includes two hot plate assemblies, a cool plate assembly, two local linear transfer arms and a micro-processor based module controller. Both transfer arms are capable of transferring substrates among the cool and hot plate assemblies. A cassette input/output unit handles cassettes which contain semiconductor wafers or other substrates that are to be delivered to or withdrawn from a semiconductor processing system.

NOTICE: You may not use BackgroundCheck or the information it provides to make decisions about employment, credit, housing or any other purpose that would require Fair Credit Reporting Act (FCRA) compliance. BackgroundCheck is not a Consumer Reporting Agency (CRA) as defined by the FCRA and does not provide consumer reports.