BackgroundCheck.run
Search For

Michael WitherspoonMesa, AZ

Related to:
Irron S Sage 35 Michelle L Whitney 35 Garrick Witherspoon

Michael Witherspoon Phones & Addresses

Mesa, AZ   

Apache Junction, AZ   

Get Report
Control this profile

Mentions for Michael Witherspoon

Career records & work history

Lawyers & Attorneys

Michael Witherspoon Photo 1

Michael Witherspoon - Lawyer

Office:
The Law Office of Michael Witherspoon, PA
Specialties:
Wrongful Death, Family, Personal Injury
ISLN:
915357602
Admitted:
2000
University:
Lincoln University, B.S., 1982
Law School:
David A. Clarke School, University of the District of Columbia, J.D., 1999
Michael Witherspoon Photo 2

Michael Witherspoon - Lawyer

Office:
Ma'ayergi & Associates, LLC
Specialties:
Real Estate, Immigration and Naturalization, Housing Law
ISLN:
919004137
Admitted:
2002
Law School:
North Carolina Central University School of Law, JD - Juris Doctor, 2002

Michael Witherspoon resumes & CV records

Resumes

Michael Witherspoon Photo 41

Michael Witherspoon

Michael Witherspoon Photo 42

Michael Witherspoon

Michael Witherspoon Photo 43

Michael Witherspoon

Michael Witherspoon Photo 44

Michael Witherspoon

Michael Witherspoon Photo 45

Michael Witherspoon

Michael Witherspoon Photo 46

Michael Witherspoon

Michael Witherspoon Photo 47

Michael Witherspoon

Location:
United States

Publications & IP owners

Us Patents

Electronic Assembly Having A Heat Pipe That Conducts Heat From A Semiconductor Die

US Patent:
2002006, Jun 6, 2002
Filed:
Dec 5, 2000
Appl. No.:
09/730621
Inventors:
Ajit Sathe - Chandler AZ, US
Michael Witherspoon - Avondale AZ, US
Ravi Prasher - Phoenix AZ, US
Kristopher Frutschy - Phoenix AZ, US
International Classification:
H05K007/20
US Classification:
361/700000, 361/687000
Abstract:
An electronic assembly is described including a motherboard, a semiconductor die mounted to the motherboard, and a heat pipe having an evaporator portion adjacent the die, and a condenser portion distant from the die. The heat pipe is connected to a ground plane of the motherboard at various locations. Structural integrity of the heat pipe is provided by an insert in an evaporator portion of the heat pipe and because of opposing recessed seat portions that contact one another. Another feature of the electronic assembly is that it has a sheet of material forming a plurality of fins that are welded to a condenser portion of the heat pipe.

Possible Relatives

Cynthia K Witherspoon  David Witherspoon  Deborah A Witherspoon  Debra Witherspoon  Daniel A Witherspoon  Denise R Witherspoon  Dennis E Witherspoon  Michael C Last  Michael C Johnson  Michael F Stamps 

NOTICE: You may not use BackgroundCheck or the information it provides to make decisions about employment, credit, housing or any other purpose that would require Fair Credit Reporting Act (FCRA) compliance. BackgroundCheck is not a Consumer Reporting Agency (CRA) as defined by the FCRA and does not provide consumer reports.